此乃要件 请即处理 阁下对本通函任何方面或应采取的行动如有任何疑问，应咨询股票经纪或其他注册证券商、银行经 理、律师、专业会计师或其他专业顾问。 阁下如已售出或转让名下所有华虹半导体有限公司的股份，应立即将本通函连同随附的代表委任表 格转交予买主或承让人、或经手买卖或转让的银行、股票经纪或其他代理人，以便转交买主或承让 人。 香港交易及结算所有限公司及香港联合交易所有限公司对本通函的内容概不负责，对其准确性或完 整性亦不发表任何声明，并明确表示，概不对因本通函全部或任何部分内容而产生或因倚赖该等内 容而引致的任何损失承担任何责任。 HUA HONG SEMICONDUCTOR LIMITED 华虹半导体有限公司 （于香港注册成立的有限公司） （股份代号 ：01347） （上海证券交易所股票代码 ：688347） (1) 建议宣派末期股息 ； (2) 建议重选退任董事 ； (3) 建议授出购回股份及发行股份的一般授权 ； 及 (4) 股东周年大会通告 华虹半导体有限公司谨订于二零二四年五月九日下午二时三十分在香港九龙么地道64号九龙香格里 拉大酒店举行股东周年大会，大会通告载于本通函第18至22页。随函亦附奉股 ...

| A 股代码：688347 | A 股简称：华虹公司 | 公告编号：2024-014 | | --- | --- | --- | | 港股代码：01347 | 港股简称：华虹半导体 | | 华虹半导体有限公司 关于召开 2024 年股东周年大会的通知 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 一、 召开会议的基本情况 （一） 股东大会类型和届次 2024 年股东周年大会 召开日期时间：2024 年 5 月 9 日 14 点 30 分 召开地点：香港九龙么地道 64 号九龙香格里拉大酒店 （五） 网络投票的系统、起止日期和投票时间。 网络投票系统：上海证券交易所股东大会网络投票系统 网络投票起止时间：自 2024 年 5 月 9 日 至 2024 年 5 月 9 日 采用上海证券交易所网络投票系统，通过交易系统投票平台的投票时间为股 二、 会议审议事项 本次股东大会审议议案及投票股东类型 | 序号 | 议案名称 | 投票股东类型 | | --- | --- | --- | | | | 股股东 A | | ...

Financial Performance - Revenue for 2023 reached US$2,475.5 million, representing a 36% increase compared to the previous year[16] - The company reported an earnings per share (EPS) of US$0.34, up from US$0.25 in 2022, indicating a 36% growth[16] - The consolidated statement of cash flows showed a net cash inflow of US$1,630.8 million, reflecting a 24% increase from the previous year[16] - In 2023, Hua Hong Semiconductor reported revenue of US$2,286.1 million, a decrease of 7.7% compared to 2022[19] - The overall gross profit margin decreased by 12.8 percentage points to 21.3% compared to the previous year[19] - Profit for the year attributable to owners of the parent decreased by 37.8% to US$280.0 million, resulting in a net profit margin of 5.5% compared to 16.4% in 2022[138] - Gross profit decreased by 42.3% to US$487.1 million, primarily due to decreased average selling prices and increased depreciation costs[130] - Other income and gains increased by 103.4% to US$144.4 million, mainly driven by increased government subsidies and interest income[131] Market Expansion and Strategy - The company plans to expand its market presence through strategic partnerships and investments in new technologies[16] - The company aims to enhance production capacity by 20% in the next fiscal year to meet growing demand[16] - A new product line is expected to launch in Q3 2024, targeting the automotive semiconductor market[16] - The company is exploring potential acquisitions to strengthen its position in the semiconductor industry[16] - Future guidance estimates revenue growth of 25% for the next fiscal year, supported by strong market demand[16] - The company is focused on penetrating emerging markets such as communication, new energy, IoT, and automotive electronics[19] - The company emphasizes a dual-pronged strategy of "Specialty IC + Power Discrete" to navigate market challenges[19] Research and Development - Research and development expenses increased by 30% year-over-year, highlighting a commitment to innovation[16] - Looking ahead to 2024, the company plans to advance research and development of new technologies and optimize existing platforms[21] - The company continues to focus on R&D in differentiated technologies, particularly in eNVM and power management ICs, to meet market demand[120] Corporate Governance - The Company has a nine-member Board comprising two Executive Directors, four Non-Executive Directors, and three Independent Non-Executive Directors[51] - The Company complied with the Corporate Governance Code during the year ended 31 December 2023[48] - The Company has adopted the Model Code for Securities Transactions by Directors, with all Directors confirming compliance throughout the year[49] - The Board is responsible for the overall management of the Company, delegating day-to-day management to the Chairman and management team[50] - The Company has established corporate governance procedures that comply with the principles in the Corporate Governance Code[46] - The Company has continually monitored and updated its corporate governance practices in response to regulatory changes[47] - The Company has implemented mechanisms for independent views and input to the Board, ensuring effective governance[61] Board Composition and Diversity - Ms. Chengyan Xiong was appointed as a Non-executive Director effective from 28 March 2024, bringing nearly 20 years of experience in finance and accounting[31] - The term for each Non-Executive Director is three years, subject to re-nomination and re-election[52] - The Board has achieved measurable objectives for diversity, with a focus on cultural and educational background, professional experience, and skills[82] - The Nomination Committee is actively seeking to improve gender diversity on the Board after the resignation of a director in September 2023[82] - The Company is committed to maintaining a balance of diverse perspectives on the Board to support its growth[83] Risk Management - The Company has implemented a robust risk management system, including a three-line model for risk management and internal monitoring[104] - The internal auditing department reported no material deficiencies in the Company's risk management and internal monitoring system for the year ended December 31, 2023[105] Shareholder Communication and Financial Management - The Company has adopted a shareholders' communication policy to ensure equal and timely access to information for shareholders[88] - The Company paid US$0.75 million for audit services and US$0.01 million for non-audit related services during the year ended December 31, 2023[76] - The Company maintains a policy to monitor liquidity requirements regularly to ensure sufficient cash reserves and funding lines[157] - The company has no significant exposure to credit risk as it trades only with recognized and creditworthy parties[155] Investments and Capital Projects - The Hua Hong Manufacturing Project, launched in June 2023, involves an investment of US$6.7 billion for a new 12-inch specialty technology production line with a monthly capacity of 83,000 wafers[20] - The Company plans to utilize the proceeds for various projects, including RMB12.5 billion for the Hua Hong Manufacturing (Wuxi) Project, with RMB11.72 billion unutilized as of the reporting period[188] - A joint venture was established on 18 January 2023, with an investment of US$880.38 million for the Wuxi Phase II project (HH Fab9) to manufacture integrated circuits and 12-inch wafers[189] Share Options and Dividends - The company recommended a final dividend of HK$0.165 per share, totaling approximately US$36,234,000 for the year ended December 31, 2023[162] - The share option scheme allows for a total of 21,144,481 shares to be issued, representing approximately 1.23% of the total shares in issue[173] - The company granted 30,250,000 share options at an exercise price of HK$6.912, representing 1.76% of the issued shares as of December 31, 2023[174] - A total of 34,500,000 share options were granted at an exercise price of HK$15.056, representing 2.01% of the issued shares as of December 31, 2023[176] Sales and Revenue Breakdown - Revenue from semiconductor wafers accounted for 95.4% of total revenue, amounting to US$2,181.6 million, down 8.2% year-on-year[112] - Revenue from systems and fabless companies was US$2,109.5 million, representing 92.3% of total revenue, a decline of 7.0% year-on-year[113] - Revenue from the European market grew by 17.5% year-on-year, reaching US$134.8 million, while North America and Other Asia saw declines of 31.2% and 29.2%, respectively[114] - Power discrete revenue increased by 16.5% year-on-year to US$902.3 million, driven by demand in the new energy vehicle and industrial sectors[115]

股份發行人及根據《上市規則》第十九B章上市的香港預託證券發行人的證券變動月報表 截至月份: 2024年3月31日 狀態: 新提交 致：香港交易及結算所有限公司 公司名稱: 華虹半導體有限公司（於香港註冊成立的有限公司） 呈交日期: 2024年4月8日 I. 法定/註冊股本變動 不適用 FF301 第 1 頁 共 6 頁 v 1.0.2 FF301 II. 已發行股份變動 | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | 於香港聯交所上市 (註1) | 是 | | --- | --- | --- | --- | --- | --- | | 證券代號 | 01347 | 說明 | | | | | 上月底結存 | | 1,308,863,694 | | | | | 增加 / 減少 (-) | | 158,733 | | | | | 本月底結存 | | 1,309,022,427 | | | | | 2. 股份分類 | 普通股 | 股份類別 | A | 於香港聯交所上市 (註1) | 否 | | --- | --- | --- | --- | --- | --- | | 證券代號 | 688347 | 說 ...

Financial Performance - In 2023, Hua Hong Semiconductor reported a revenue of RMB 16.232 billion, a decrease of 3.30% compared to 2022[17]. - The overall gross margin fell to 27.10%, down by 8.76 percentage points from the previous year[17]. - The company's revenue for 2023 was CNY 16.23 billion, a decrease of 3.30% compared to CNY 16.79 billion in 2022[29]. - Net profit attributable to shareholders for 2023 was CNY 1.94 billion, down 35.64% from CNY 3.01 billion in 2022[29]. - The net cash flow from operating activities was CNY 5.10 billion, a decrease of 7.59% compared to CNY 5.52 billion in 2022[29]. - The company achieved a main business revenue of RMB 16.095 billion in the reporting period, a year-on-year decrease of 3.43%[48]. - The wafer foundry business revenue was RMB 15.360 billion, down 3.99% year-on-year[48]. - The company reported a significant increase in revenue, achieving a total of $1.2 billion for the fiscal year, representing a 15% year-over-year growth[141]. - The company reported a significant increase in revenue, achieving a total of $1.5 billion for the fiscal year, representing a 20% year-over-year growth[146]. Dividend Distribution - The company plans to distribute a cash dividend of HKD 0.165 per share (including tax) to all shareholders, translating to approximately RMB 0.150 per share based on the exchange rate[6]. - The board of directors has approved the profit distribution plan, which is subject to shareholder approval at the annual general meeting[6]. - The cash dividend amount for the year is ¥257,142,007.25, representing 13.28% of the net profit attributable to ordinary shareholders[174]. Research and Development - The company's R&D expenditure as a percentage of revenue rose to 9.11% in 2023, an increase of 1.48 percentage points from 7.63% in 2022[30]. - The company achieved a total R&D investment of approximately ¥1.48 billion in 2023, representing a 15.42% increase from the previous year[66]. - Research and development expenses increased by 35.47% to RMB 1.46 billion, reflecting a focus on innovation[90]. - The company applied for over 672 patents in the year, with a total of 4,427 authorized patents[47]. - The company has a total of 8,926 patents, with 659 new patent applications filed during the reporting period[65]. - The company is focusing on technology innovation and patent layout in key industry areas to strengthen its core competitiveness[71]. Market Strategy and Growth - Hua Hong Semiconductor's strategic focus includes penetrating emerging markets such as communication, new energy, IoT, and automotive electronics[16]. - The company aims to enhance its core competitiveness by focusing on innovative technology and optimizing existing platforms in 2024[19]. - The company is expanding its "8-inch + 12-inch" production platform, enhancing its capabilities in specialty IC and power discrete processes[44]. - The company is committed to high-quality development and aims to contribute to the sustainable growth of the global integrated circuit industry[18]. - The company plans to continue expanding its market presence and investing in new technologies[32]. - The company is expanding its market presence in Southeast Asia, targeting a 25% market share by 2025[141]. - The company is expanding its market presence in Europe, targeting a 10% market share by the end of 2024[146]. Operational Efficiency - The company emphasizes a dual-engine strategy of "specialty IC + Power Discrete" to drive growth[16]. - The launch of the 12-inch production line is expected to significantly support the integrated circuit industry chain in the Yangtze River Delta region[18]. - The company plans to enhance its supply chain efficiency, targeting a 15% reduction in operational costs over the next year[146]. - Operational efficiency improved, with a reduction in production costs by 8% due to new automation technologies[141]. Risks and Challenges - The company faces various risks in its operations, including market competition and supply chain challenges, which could impact future performance[8]. - The company emphasizes the importance of addressing potential risks related to the semiconductor industry, including capacity oversupply and geopolitical factors[8]. - The semiconductor industry is experiencing a slowdown in overall demand, which may lead to risks of revenue decline if the company cannot adapt quickly to market changes[77]. - The company faces risks related to supply chain disruptions due to reliance on specific raw materials and key components, particularly from suppliers in geopolitically unstable regions[77]. - The company’s main business gross margin may fluctuate due to potential decreases in product prices or increases in unit costs amid industry downturns and rising raw material prices[78]. Governance and Management - The company has a diverse board with a mix of executive and non-executive directors, including independent directors[138]. - The company’s governance structure includes a mix of executive and independent directors to ensure balanced decision-making[138]. - The company is committed to maintaining a diverse and experienced leadership team, with several members having served since 2012[139]. - The company’s board is set to be re-elected at the upcoming shareholder meeting in 2024, ensuring continuity in governance[138]. Environmental and Social Responsibility - The company invested 111.96 million yuan in environmental protection during the reporting period[189]. - The company received a bronze medal from EcoVadis for its corporate social responsibility assessment, covering labor, environmental management, business ethics, and sustainable procurement[188]. - The company has established a robust internal control system, with no significant deficiencies reported in 2023[182]. - The company has completed environmental impact assessments for all key pollutant discharge projects and obtained necessary environmental protection permits[195]. - The company has not faced any administrative penalties due to environmental issues during the reporting period[200]. - All operational plants have passed ISO 14001 environmental management system certification[199].

华虹半导体有限公司 | A 股代码：688347 | A 股简称：华虹公司 | 公告编号：2024-011 | | --- | --- | --- | | 港股代码：01347 | 港股简称：华虹半导体 | | 关于委任独立非执行董事、委任非执行董事、独立非 执行董事辞任及调整董事会专门委员会成员的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 华虹半导体有限公司（以下简称"本公司"或"公司"）董事会谨此宣布，以下 变动自二零二四年三月二十八日起生效： 封松林先生（以下简称"封先生"）获委任为本公司董事会独立非执行董事、 董事会审核委员会成员、董事会提名委员会成员及董事会薪酬委员会成员。熊承 艳女士（以下简称"熊女士"）获委任为本公司董事会非执行董事及董事会审核委 员会成员。叶龙蜚先生（以下简称"叶先生"）希望退休并将更多时间投入家庭和 其他个人事务而辞任本公司独立非执行董事职务及董事会专门委员会相应职务。 叶峻先生获调任为本公司董事会薪酬委员会成员，不再担任公司董事会审核委员 会成员。现将有关情况公告如下： 一、 ...

重要内容提示： | A 股代码：688347 | A 股简称：华虹公司 | 公告编号：2024-008 | | --- | --- | --- | | 港股代码：01347 | 港股简称：华虹半导体 | | 华虹半导体有限公司 关于续聘会计师事务所的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 拟聘任的会计师事务所名称：安永华明会计师事务所（特殊普通合伙）（以 下简称"安永华明"）为华虹半导体有限公司（以下简称"公司"）中国企 业会计准则财务报告审计师，安永会计师事务所（以下简称"安永香港"） 为公司香港财务报告准则财务报告核数师。 一、 拟聘任会计师事务所的基本情况 （一）机构信息 1、安永华明 （1）基本信息 安永华明于 1992 年 9 月成立，2012 年 8 月完成本土化转制，从一家中外合 作的有限责任制事务所转制为特殊普通合伙制事务所。安永华明总部设在北京， 注册地址为北京市东城区东长安街 1 号东方广场安永大楼 17 层 01-12 室。 截至 2023 年末拥有合伙人 245 人，首席合伙人为毛鞍宁 ...

本委员会已审阅封松林先生的背景资料及个人履历，认为其符合《香港联合交易 所有限公司证券上市规则》《上市公司独立董事管理办法》《上海证券交易所科创板股 票上市规则》等相关法律法规规定的独立非执行董事任职资格。本委员会决议通过向 董事会提呈有关委任封松林先生为公司董事会独立非执行董事之决议案。 华虹半导体有限公司董事会提名委员会 华虹半导体有限公司 董事会提名委员会关于委任独立非执行董事的意见 根据《香港联合交易所有限公司证券上市规则》《上市公司独立董事管理办法》 《上海证券交易所科创板股票上市规则》等相关法律法规的规定，依据独立非执行董 事候选人声明承诺、独立性声明、个人履历等信息，华虹半导体有限公司董事会提名委 员会（"本委员会"）于 2024 年 3 月 28 日举行会议，对独立非执行董事候选人的任 职资格进行了审核，就委任独立非执行董事向董事会提出如下意见： 2024 年 3 月 28 日 ...

附件 5 提名人华虹半导体董事会,现提名封松林为华虹半导体有 限公司董事会独立董事候选人,并已充分了解被提名人职业、学 历、职称、详细的工作经历、全部兼职、有无重大失信等不良记 录等情况。被提名人已书面同意出任华虹半导体有限公司董事会 独立董事候选人(参见该独立董事候选人声明)。提名人认为,被 提名人具备独立董事任职资格,与华虹半导体有限公司之间不 存在任何影响其独立性的关系,具体声明并承诺如下: 一、被提名人具备上市公司运作的基本知识,熟悉相关法律、 行政法规、规章及其他规范性文件,具有五年以上法律、经济、 会计、财务、管理等履行独立董事职责所必需的工作经验。 被提名人已经参加培训并取得证券交易所认可的相关培训 证明材料(如有)。 二、被提名人任职资格符合下列法律、行政法规和部门规章 的要求: (一)《中华人民共和国公司法》等关于董事任职资格的规定; (二)《中华人民共和国公务员法》关于公务员兼任职务的规 定(如适用); (三)中国证监会《上市公司独立董事管理办法》、上海证券 交易所自律监管规则以及公司章程有关独立董事任职资格和条 件的相关规定; (四)中共中央纪委、中共中央组织部《关于规范中管干部辞 夫公 ...

国泰君安证券股份有限公司、海通证券股份有限公司 关于华虹半导体有限公司 2023年度持续督导年度跟踪报告 根据《证券发行上市保荐业务管理办法》《上海证券交易所科创板股票上市 规则》《上海证券交易所上市公司自律监管指引第11号——持续督导》等有关法 律法规的规定，国泰君安证券股份有限公司与海通证券股份有限公司（以下合称 "联席保荐人"）作为华虹半导体有限公司（以下简称"华虹公司"或"公司"） 持续督导工作的联席保荐人，负责华虹公司上市后的持续督导工作，并出具本持 续督导跟踪报告，本持续督导期间为2023年8月7日至2023年12月31日。 一、持续督导工作情况 | 工作内容 | 持续督导情况 | | --- | --- | | 1、建立健全并有效执行持续督导工作制度，并针对 | 联席保荐人已建立健全并有效执行 | | 具体的持续督导工作制定相应的工作计划。 | 持续督导制度，已根据华虹公司的 | | | 具体情况制定了相应的工作计划。 | | 2、根据中国证监会相关规定，在持续督导工作开始 | | | 前，与上市公司或相关当事人签署持续督导协议， | 联席保荐人已与华虹公司签订保荐 | | 明确双方在持续督导期 ...