Group 1 - The company, Huaguang New Materials, will release its performance forecast by the end of January 2026, in accordance with the relevant regulations of the Shanghai Stock Exchange's Sci-Tech Innovation Board [1]

Core Viewpoint - The company showcased innovative products and material solutions at the 2026 CES exhibition, targeting sectors such as AI liquid cooling, heating power modules, smart healthcare, smart wearables, smart home, electronic industry, and new energy vehicles, achieving positive results in expanding its international market and technological vision [1] Group 1 - The company participated in the 2026 CES exhibition with a focus on AI liquid cooling and other innovative solutions [1] - The exhibition helped the company to further open up international markets and enhance its technological perspective [1] - Future business progress in the AI liquid cooling sector will be detailed in upcoming periodic reports [1]

Group 1 - The company Huaguang New Materials has submitted an application for liquid cooling server concepts to Dongfang Caifu (300059) and is currently awaiting approval [1]

Group 1 - The company, Huaguang New Materials, announced that it has won the 2025 China Cold and Warm Intelligent Manufacturing Award for the Annual Excellent Brand in the materials category [1]

Core Viewpoint - Huaguang New Materials is actively involved in the semiconductor industry with its conductive silver paste and tin-based solder materials, currently in the validation phase for its pre-formed high-activity tin solder sheets and conductive adhesive products, which have not yet achieved mass supply [1] Group 1 - The company's tin-based solder materials have been applied in the PCBA process on a large scale [1] - Investors are advised to pay attention to the company's future periodic reports for specific revenue details [1]

Group 1 - The company, Huaguang New Materials, stated that it currently does not have products directly applied in CPO (Chip-on-Board) technology [1] - The company has invested in Suzhou Lianjie Technology, which develops and produces ceramic substrates used in optical modules and semiconductor lasers, with an investment ratio of approximately 5% [1]

Core Viewpoint - The company emphasizes a strategy focused on "quality improvement and efficiency enhancement" to achieve sustainable growth and explore investment opportunities in relevant industries [1] Group 1: Strategic Focus - The company is advancing high-quality development through "capacity enhancement, technological innovation, new field layout, and internationalization" [1] - The management is committed to continuously improving operational performance while adhering to its development stage, industry characteristics, profitability, and daily funding plans [1] Group 2: Dividend Policy - The company strictly formulates its dividend policy in accordance with its articles of association and relevant laws, actively engaging in dividend distribution to share development results with investors [1] Group 3: Investor Relations - The company is enhancing interaction and communication with investors to actively convey its value [1]

格隆汇1月13日丨华光新材(688379.SH)在投资者互动平台表示，公司目前未有产品直接应用于CPO，公 司投资的企业苏州联结科技研发生产的陶瓷基板应用于光模块、半导体激光器等环节，公司投资比例为 5%左右。 （原标题：华光新材(688379.SH)：目前未有产品直接应用于CPO） ...

Group 1 - The core viewpoint of the article is that Huaguang New Materials (688379) is actively involved in the semiconductor industry through its conductive silver paste and tin-based solder materials [1] - The company is currently advancing the verification of its pre-formed high-activity tin solder sheets and conductive adhesive products in the semiconductor field, although it has not yet achieved mass supply [1]

Core Viewpoint - Huaguang New Materials (688379.SH) is actively involved in the semiconductor industry with its conductive silver paste and tin-based solder materials, currently advancing verification of its pre-formed high-activity tin solder sheets and conductive adhesive products, which have not yet achieved mass supply [1] Group 1: Product Applications - The company's conductive silver paste and tin-based solder materials are applied in the electronic semiconductor industry [1] - The tin-based solder materials developed by the company have been applied in mass production for the PCBA process [1] Group 2: Future Developments - The company is in the process of verifying its pre-formed high-activity tin solder sheets and conductive adhesive products for the semiconductor sector [1] - Investors are advised to pay attention to the company's future periodic reports for specific revenue details [1]