Group 1 - On September 16, 26 A-share listed companies disclosed share reduction plans, including companies like XinHua Co., MaiDi Technology, and ChengBang Co. [1] - Suzhou Bank's 12 directors and senior management completed a share buyback plan, with a total investment of nearly 5 million yuan [2] - LiXun Precision's vice chairman completed a share buyback of 200 million yuan, accumulating a total of 5 to 7 million yuan in 2022 [2] Group 2 - XinHua Co. plans to reduce holdings by no more than 75,200 shares [3] - MaiDi Technology's shareholders plan to collectively reduce 1.71% of the company's shares [3] - ChengBang Co. shareholders plan to reduce no more than 0.5% of the company's shares [3] - Other companies with planned reductions include Aters (2.04%), ZhongYou Technology (3%), and DeYe Co. (158,050 shares) [3]

Summary of Key Points Core Viewpoint - On September 16, several companies disclosed their shareholding changes, with notable increases in holdings by some executives and significant reductions by others, indicating varied market sentiments and potential investment opportunities. Group 1: Increased Holdings - Suzhou Bank's 12 executives completed their share buyback plan, with a total investment of nearly 5 million yuan [3] - Luxshare Precision's Vice Chairman Wang Laisheng completed a 200 million yuan share buyback, bringing the total for 2022 to 500 million yuan [3] Group 2: Decreased Holdings - Newhua Co. plans to reduce holdings by up to 75,200 shares [3] - MediTech shareholders plan to collectively reduce 1.71% of the company's shares [3] - Chengbang Co. shareholders plan to reduce up to 0.5% of the company's shares [3] - Chahua Co.'s Director and Deputy General Manager Chen Zhihai plans to reduce up to 40,000 shares [3] - Artis shareholders plan to reduce up to 2.04% of the total share capital [3] - Zhongyou Technology shareholders plan to reduce up to 3% of the company's shares [3] - Deyang Co. plans to reduce up to 1.5805 million shares [3] - Changhua Group plans to reduce up to 5.3806 million repurchased shares [3] - Tiancheng Technology shareholders plan to reduce up to 1.68% of the company's shares [3] - Anzheng Fashion plans to reduce up to 1.87004 million repurchased shares [3] - Sichuan Gold shareholders plan to reduce a total of 1.5938% of the company's shares [3] - Zhongyan Co. plans to reduce up to 30,000 shares [3] - Fuchuang Precision shareholders plan to reduce up to 3% of the company's shares [3] - Beifang Huachuang plans to reduce 2.5919 million shares through centralized bidding [3] - Xiamen Tungsten plans to reduce up to 1% of Tengyuan Mining's shares [3] - Changgao Electric plans to reduce 3.465 million shares of its associate company [3] - Xinghua New Materials' specific shareholder plans to reduce 1.17% of the company's shares [3] - Tonghe Technology shareholders plan to reduce up to 3% of the company's shares [3] - Anlian Ruishi's Director Shen Lei plans to reduce up to 100,000 shares [3] - Yidong Electronics' controlling shareholder plans to reduce up to 2.96% of the total share capital [3] - Saiwei Times shareholders plan to reduce up to 3% of the company's shares [3] - Tiandi Digital shareholders plan to reduce up to 2.96% of the total share capital [3] - Wanjie Technology's Director and Deputy General Manager Liu Huaiqi plans to reduce up to 386,000 shares [3] - Haitai New Light's actual controller's concerted action plans to reduce up to 0.2102% of the shares [3] - Tengyuan Mining's Xiamen Tungsten and Changjiang Chen Dao plan to reduce up to 2% of the total share capital [3] - Yayi International's Director and senior management plan to reduce up to 540,000 shares [3]

格隆汇9月16日丨富创精密(688409.SH)公布，因自身资金安排需要，股东国投创业基金拟通过集中竞价 和大宗交易的方式减持不超过918.63万股的公司股份，减持比例不超过公司总股本的3%。其中，以集 中竞价交易方式减持股份，减持期间为自本公告披露之日起十五个交易日后的三个月内，减持数量不超 过306.21万股，且连续30个自然日内通过集中竞价交易减持公司股份数量不超过公司总股本的1%；以 大宗交易方式减持股份，减持期间为自本公告披露之日起十五个交易日后的三个月内，减持数量不超过 612.42万股，且连续30个自然日内通过大宗交易减持公司股份数量不超过公司总股本的2%。减持价格 按照市场价格确定。 ...

格隆汇9月16日丨富创精密(688409.SH)公布，因自身资金安排需要，股东国投创业基金拟通过集中竞价 和大宗交易的方式减持不超过918.63万股的公司股份，减持比例不超过公司总股本的3%。其中，以集 中竞价交易方式减持股份，减持期间为自本公告披露之日起十五个交易日后的三个月内，减持数量不超 过306.21万股，且连续30个自然日内通过集中竞价交易减持公司股份数量不超过公司总股本的1%；以 大宗交易方式减持股份，减持期间为自本公告披露之日起十五个交易日后的三个月内，减持数量不超过 612.42万股，且连续30个自然日内通过大宗交易减持公司股份数量不超过公司总股本的2%。减持价格 按照市场价格确定。 ...

富创精密公告，因自身资金安排需要，股东国投创业基金拟通过集中竞价和大宗交易的方式减持不超过 918.63万股的公司股份，减持比例不超过公司总股本的3%。其中，以集中竞价交易方式减持股份，减 持期间为自本公告披露之日起十五个交易日后的三个月内，减持数量不超过306.21万股，且连续30个自 然日内通过集中竞价交易减持公司股份数量不超过公司总股本的1%；以大宗交易方式减持股份，减持 期间为自本公告披露之日起十五个交易日后的三个月内，减持数量不超过612.42万股，且连续30个自然 日内通过大宗交易减持公司股份数量不超过公司总股本的2%。减持价格按照市场价格确定。 ...

证券代码：688409 证券简称：富创精密 公告编号：2025-058 沈阳富创精密设备股份有限公司 股东减持股份计划公告 本公司董事会、全体董事及相关股东保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律 责任。 重要内容提示： 大股东持有的基本情况 截至本公告披露日，沈阳富创精密设备股份有限公司（以下简称"公司"）股 东国投（上海）科技成果转化创业投资基金企业（有限合伙）（以下简称"国投创 业基金"）持有沈阳富创精密设备股份有限公司（以下简称"富创精密"或"公司"） 股份 29,427,178 股，占公司总股本的 9.61%，其中 15,712,906 股为公司首次公开 发行前取得的股份，已于 2023 年 10 月 10 日上市流通；13,714,272 股为公司 2023 年度实施资本公积金转增股本取得的股份,已于 2024 年 6 月 24 日上市流通。 一、减持主体的基本情况 | 股东名称 | 国投（上海）科技成果转化创业投资基金企业（有限合伙） | | | | --- | --- | --- | --- | | 股东身份 | 控股股东、实控 ...

每经AI快讯，富创精密（SH 688409，收盘价：61.45元）9月16日晚间发布公告称，因自身资金安排需 要，股东国投创业基金拟通过集中竞价和大宗交易的方式减持不超过约919万股的公司股份，减持比例 不超过公司总股本的3%。减持价格按照市场价格确定，若公司在减持计划实施期间发生送红股、转增 股本、增发新股或配股等股本除权、除息事项的，则减持股份数量将做相应调整。 截至发稿，富创精密市值为188亿元。 （记者 王晓波） 2024年1至12月份，富创精密的营业收入构成为：集成电路占比88.61%，非集成电路占比8.88%，其他 业务占比2.51%。 每经头条（nbdtoutiao）——海拔4306米现"秦始皇密令"，获官方"身份认定"！古文字学家刘钊：秦人 寻仙采药足迹确至青藏高原 ...

人民财讯9月16日电，富创精密(688409)9月16日晚间公告，持股9.61%的国投(上海)科技成果转化创业投 资基金企业(有限合伙)(简称"国投创业基金")拟通过集中竞价和大宗交易的方式减持不超过918.63万股的 公司股份，减持比例不超过公司总股本的3%。 ...

富创精密公告，股东国投（上海）科技成果转化创业投资基金企业（有限合伙）持有2942.72万股，占 9.61%；拟自2025年10月17日至2026年1月16日，通过集中竞价减持不超306.21万股、大宗交易减持不超 612.42万股，合计不超过918.63万股，即不超3%。 ...

Core Insights - The direct write lithography market is expected to recover in 2024, with a projected growth of 12% year-on-year, reaching a market size of $1.57 billion due to a significant rebound in downstream industries [1][5][7] - The market is driven by the advantages of direct write lithography technology and its expanding application boundaries, particularly in PCB manufacturing, which is the largest application area [1][7] Industry Overview - Direct write lithography, also known as maskless lithography, utilizes a computer-controlled high-precision beam to project patterns directly onto a substrate coated with photosensitive material without the need for a mask [2][5] - The technology integrates various systems, including graphic processing, high-precision displacement platforms, optical systems, and control systems, making it a key device in micro-nano manufacturing [2][5] Market Dynamics - The global direct write lithography equipment market has shown volatility in recent years due to a slowdown in economic growth and pressure on downstream industries [5][6] - The PCB sector is the largest application area for direct write lithography, accounting for 41.1% of the market in 2024, followed by the mask plate sector at 36.6% [7][8] Competitive Landscape - Major players in the PCB direct imaging equipment sector include Israel's Orbotech, Japan's ORC, ADTEC, SCREEN, and domestic companies such as Chipbond and Jiangsu Yingsu [1][5][6] - In the broader semiconductor direct write lithography market, foreign companies dominate, with competitors including Sweden's Mycronic, Germany's Heidelberg, and Japan's SCREEN [1][5][6] Technological Trends - The direct write lithography technology is evolving to achieve finer line widths and higher resolution, driven by the increasing integration and performance demands of downstream electronic products [14][16] - The industry is focusing on improving production yield and balancing the cost of equipment upgrades with production efficiency [17][18] Application Insights - The PCB manufacturing process is complex and requires various specialized equipment, with direct imaging technology becoming the mainstream method due to its advantages over traditional exposure techniques [8][9] - The global PCB market is projected to reach $73.6 billion in 2024, with a growth rate of 5.8%, driven by demand from AI servers and data center equipment [7][8] Future Outlook - The demand for direct write lithography equipment in advanced packaging is expected to grow significantly, with a projected market size of $30 million by 2030 as the technology matures [13][14]