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格科微(688728) - 格科微有限公司关于召开2025年第三季度业绩说明会的公告
2026-01-19 09:45
证券代码:688728 证券简称:格科微 公告编号:2026-001 格科微有限公司 关于召开 2025 年第三季度业绩说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示: 会议召开方式:上证路演中心网络互动 投资者可于 2026 年 1 月 20 日(星期二)至 1 月 26 日(星期一) 16:00 前登录上证路演中心网站首页点击"提问预征集"栏目或通过 公司邮箱 yjsmh@gcoreinc.com 进行提问。公司将在说明会上对投资 者普遍关注的问题进行回答。 格科微有限公司(以下简称"公司")已于 2025 年 10 月 31 日发 布公司 2025 年第三季度报告,为便于广大投资者更全面深入地了解 公司经营成果及财务状况,公司计划于 2026 年 1 月 27 日(星期二) 09:00-10:00 举行 2025 年第三季度业绩说明会,就投资者关心的问 题进行交流。 一、 说明会类型 本次业绩说明会以网络互动形式召开,公司将针对 2025 年第三 季度经营成果及财务指标的具体情况与投资者进 ...
京东方供应商获北方华创投资
WitsView睿智显示· 2026-01-16 09:07
Core Insights - Recently, Beijing Xulun Technology Co., Ltd. completed a strategic financing round exceeding 100 million yuan in A4 round [1] - The financing was led by Northern Huachuang Industrial Investment Fund and Novartis Strategic Investment, with A3 round led by Beijing Electric Control Industrial Investment Fund and Qianhai Ark Fund [1] - The funds will be used for the second phase of expansion of UV Tape/DAF product lines, semiconductor packaging material R&D, and upgrading customer delivery systems [1] Company Overview - Xulun Technology has a core team from top domestic and international universities and research institutions, with rich experience in materials science and chemical engineering [1] - The company focuses on developing high-end semiconductor adhesive films and tapes, starting from basic resins such as acrylic, epoxy, and organic silicon [1] Infrastructure and Operations - Xulun Technology has a 5,000 square meter application R&D center in Beijing and a pilot base with a thousand-level clean coating facility in Hebei [2] - The company also has semiconductor-grade precision coating production lines with thousand-level and hundred-level clean standards in Jiangsu, and warehouses and technical support subsidiaries in Shanghai, Suzhou, Shenzhen, and Chengdu [2] Product Applications - The products of Xulun Technology are applied in critical process scenarios such as wafer thinning, cutting, chip mounting and stacking, substrate interlayer and line insulation, wafer-level packaging, and 2.5D/3D packaging [2] - The company serves various fields including RF chips, computing power chips, storage chips, and HBM [2]
格科微荣获“格隆汇金格奖·年度信息披露奖”
Ge Long Hui· 2025-12-25 01:20
"年度信息披露奖"旨在表彰资本市场中具备最佳信息披露能力的企业。信息披露是企业与投资者、社会大众沟通的桥梁,良好的沟通总能加强双方的理解, 推动企业走上更好的发展道路。本奖项从信息披露的频繁度、准确性、及时性等多角度评选,甄选出的企业在交流沟通、信息披露、维护企业形象上取得了 丰硕成果。 格隆汇12月22日线上举办"科技赋能·资本破局"分享会。备受瞩目的卓越公司评选榜单隆重揭晓。其中,格隆汇"金格奖"年度卓越公司评选中,格科微 (688728.SH)荣获"年度信息披露奖"奖项。 STANKS 0 Chine St tte the first to the AND TO TO T STATE THE the state Home TANK ERODICAL profile t 2 SEXUAL ESTABLE t star 2016年 THE STO read to t a program LED STORE THE le r ne H the state and and and the seen the see of the see of the see of the see of the see of th ...
格科微(688728) - 格科微有限公司关于中期票据获准注册的公告
2025-12-24 10:17
证券代码:688728 证券简称:格科微 公告编号:2025-044 格科微有限公司 关于中期票据获准注册的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 格科微有限公司(以下简称"公司")于2025年8月26日和2025年9月11日分 别召开第二届董事会第十四次会议和2025年第二次临时股东会,审议通过了《关 于申请注册发行中期票据的议案》,同意公司向中国银行间市场交易商协会(以 下简称"交易商协会")申请注册发行不超过人民币15亿元(含15亿元)的中期 票据,并根据实际资金需求情况,在注册额度有效期内一次性或分期发行。具体 内容详见公司分别于2025年8月27日和2025年9月12日在上海证券交易所网站 (www.sse.com.cn)上披露的《格科微有限公司关于申请注册发行中期票据的公 告》(公告编号:2025-025)和《格科微有限公司2025年第二次临时股东会决议 公告》(公告编号:2025-032)。 公司于近日收到交易商协会出具的《接受注册通知书》(中市协注〔2025〕 MTN 1262号),交易商协会决 ...
格科微(688728.SH)获准注册15亿元中期票据
智通财经网· 2025-12-24 10:17
智通财经APP讯,格科微(688728.SH)发布公告,公司于近日收到交易商协会出具的《接受注册通知 书》(中市协注〔2025〕MTN1262号),交易商协会决定接受公司中期票据注册。公司中期票据注册金额 为15亿元,注册额度自本通知书落款之日起2年内有效。 ...
格科微获准注册15亿元中期票据
Zhi Tong Cai Jing· 2025-12-24 10:16
格科微(688728.SH)发布公告,公司于近日收到交易商协会出具的《接受注册通知书》(中市协注 〔2025〕MTN1262号),交易商协会决定接受公司中期票据注册。公司中期票据注册金额为15亿元,注 册额度自本通知书落款之日起2年内有效。 ...
格科微:截至2025年9月30日公司股东户数为29067户
Zheng Quan Ri Bao· 2025-12-23 14:16
证券日报网讯 12月23日,格科微在互动平台回答投资者提问时表示,公司在定期报告中披露各期末的 股东人数信息,截至2025年9月30日,公司股东户数为29067户。 (文章来源:证券日报) ...
格隆汇“科技赋能·资本破局”线上分享会暨“金格奖”——“年度信息披露奖”奖项揭晓:复宏汉霖(02696.HK)、格科微(688728.SH)、康希诺生物(06185.HK)等6家企业上榜
Ge Long Hui· 2025-12-22 11:15
Core Insights - The "Golden Award" annual excellence company selection by Gelonghui will announce its results on December 22, highlighting companies recognized for their outstanding information disclosure capabilities [1][2] - Six companies, including Fuhong Hanlin, Gekewei, CanSino Biologics, TCL Technology, Weishi Jiajie, and Yonghe Medical, received the "Annual Information Disclosure Award" [1] Group 1 - The "Annual Information Disclosure Award" aims to recognize companies with the best information disclosure practices in the capital market [1] - Effective information disclosure serves as a bridge between companies and investors, enhancing mutual understanding and promoting better development paths for enterprises [1] - The evaluation criteria for the award include frequency, accuracy, and timeliness of information disclosure, with results derived from quantitative data analysis and expert review [1] Group 2 - Gelonghui's selection process aims to create a valuable reference list of listed companies and unicorns, covering all companies listed on major exchanges including HKEX, SSE, SZSE, NYSE, and NASDAQ [2]
格科微有限公司 关于获得政府补助的公告
Sou Hu Cai Jing· 2025-12-20 06:28
格科微有限公司(以下简称"公司")全资子公司格科微电子(浙江)有限公司近日收到政府补助款项共 计人民币6,000.00万元,为与收益相关的政府补助,占公司最近一个会计年度经审计净利润的32.12%。 二、政府补助的类型及对公司的影响 根据《企业会计准则第16号一一政府补助》等有关规定,确认上述事项并划分补助类型。上述政府补助 未经审计,具体的会计处理以及对公司损益的影响最终以审计机构年度审计确认后的结果为准。敬请投 资者注意投资风险。 证券代码:688728 证券简称:格科微 公告编号:2025-043 格科微有限公司 关于获得政府补助的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或重大遗漏,并对其内容的 真实性、准确性和完整性依法承担法律责任。 一、获得补助的基本情况 特此公告。 格科微有限公司董事会 2025年12月18日 ...
【太平洋科技-每日观点&资讯】(2025-12-18)
远峰电子· 2025-12-17 13:57
Market Overview - The main board saw significant gains with stocks like Tongding Interconnection (+10.09%), Guangxun Technology (+10.01%), and Zhongci Electronics (+10.00%) leading the charge [1] - The ChiNext board also performed well, with Yidong Electronics (+20.01%), Gu'ao Technology (+20.00%), and Liant Technology (+20.00%) showing strong increases [1] - The Sci-Tech Innovation board was led by Kaipu Cloud (+20.00%), Juguang Technology (+17.34%), and Shengyi Electronics (+13.56%) [1] - Active sub-industries included SW Communication Network Equipment and Devices (+7.11%) and SW Communication Cables and Accessories (+6.90%) [1] Domestic News - Aibang ARAI announced the launch of the industry's first ultra-low power silicon-based LCD micro-display panel, model OP03021, featuring a resolution of 1632×1536 and a refresh rate of 90Hz [1] - The semiconductor sector observed a strategic acquisition by the Greater Bay Area Fund and Huada Jiutian of Sierxin, enhancing Huada Jiutian's capabilities in digital chip design and verification [1] - Texas Instruments and UBTECH Robotics entered a strategic partnership, with Texas Instruments procuring UBTECH's Walker S2 humanoid robots for deployment in production lines [1] - Xiaomi raised prices on several tablet models, with the entry-level Redmi Pad 2 seeing a price increase of approximately 20%, from 999 yuan to 1199 yuan [1] Company Announcements - Nanchip Technology plans to issue 1.933 billion yuan in convertible bonds to fund projects in smart power management chips, automotive chips, and industrial sensor and control chips [3] - Geke Micro announced a government subsidy of 60 million yuan received by its subsidiary Geke Microelectronics (Zhejiang) [3] - Mingyang Circuit projected a maximum of 5.09 million yuan in related transactions with Bai Rou New Materials for 2026, primarily for raw material procurement [3] - Pingzhi Information's subsidiary signed a 5-year contract with Inner Mongolia Unicom for computing power services, valued at 38.25 million yuan [3] Overseas News - TOPPAN plans to install an advanced semiconductor packaging R&D line at its Ishikawa factory, set to be operational by July 2026 [2] - SK Hynix's advanced semiconductor packaging factory in Indiana is set to break ground in Q1 2026, with an investment of approximately 3.87 billion USD [2] - SEM forecasts a 13.7% year-on-year increase in global semiconductor equipment sales in 2025, reaching a historical high of 133 billion USD [2] - Samsung Electronics aims to finalize the product development specifications for LPDDR6-PIM memory solutions by the end of this year, enhancing AI capabilities in edge computing devices [2]