《科创板日报》12月5日讯 今日科创板早报主要内容有：商务部：中国政府依法依规开展稀土相关物项 出口管制；中国贸促会会长任鸿斌率团出席美国半导体行业协会；巴西：TikTok将在巴投建其在拉美地 区首座数据中心。 《科创板日报》主播小K为您播报。 市场动态 商务部：中国政府依法依规开展稀土相关物项出口管制 今天下午，商务部召开例行新闻发布会，新闻发言人就开展稀土相关物项出口管制进行了回应。商务部 新闻发言人何亚东：中国政府依法依规开展稀土相关物项的出口管制工作，据我所知，只要是用于民用 用途的，合规的出口申请，中国政府都及时予以了批准。同时，中国政府积极适用通用许可等便利化措 施，促进两用物项合规贸易，切实维护全球产供链的安全稳定。 中国贸促会会长任鸿斌率团出席美国半导体行业协会及会员企业座谈会 据中国贸易报，12月3日，中国贸促会会长任鸿斌率中国企业家代表团出席美国半导体行业协会及会员 企业座谈会，与美国半导体行业协会总裁兼首席执行官诺伊弗就推动中美半导体领域合作、深化多边领 域合作、维护全球产业链供应链稳定畅通等议题深入交流。美国半导体行业协会全球政策副总裁桑顿， 以及高通公司、格芯公司、安森美半导体公司、 ...

（文/罗叶馨梅）12月4日，格科微（688728.SH）发布公告称，截至公告日，公司3200万及5000万像素图像传感器产品累计出货已超过1亿颗。公司表示，高 像素产品在智能手机等终端市场的渗透率持续提升，出货量稳步放大。当前高像素方案在中高端机型中的采用比例不断提高，带动相关图像传感器需求增 长。 （校对/秋贤） 格科微主要从事CMOS图像传感器芯片的设计与销售，产品广泛应用于智能手机、物联网终端等领域。公司称，高像素产品出货量突破1亿颗，体现出其在 高像素图像传感器领域的规模化供货能力以及Fab-Lite模式的高效性。随着客户机型升级及多摄配置普及，高像素图像传感器在整机影像系统中的重要性持 续增强。 公司表示，将继续在现有技术平台基础上提升高像素产品的成像质量和能效表现，并规划推出1亿像素以上的更高规格产品，以扩大在中高端及旗舰机型中 的市场份额。公司同时提示，终端需求变化、客户项目节奏及竞争格局等因素，仍可能对后续订单执行和出货节奏产生影响，将持续关注下游市场环境并动 态调整产品及客户结构。 据介绍，本次订单产品基于GalaxyCell®2.0工艺平台，在像素性能、动态范围及功耗优化等方面实现显著提升 ...

每经AI快讯，12月4日，格科微(688728.SH)公告称，截至公告发布日，公司3,200万及5,000万像素图像 传感器产品已累计实现出货超1亿颗。公司近日收到国际知名品牌原始设备制造商（ODM）订单，供应 0.7微米规格5,000万像素图像传感器产品，已实现部分出货。该产品基于GalaxyCell®2.0工艺平台，在 像素性能、动态范围及功耗优化方面实现显著提升。公司高像素单芯片集成技术及相关产品得到市场验 证与认可，对公司未来发展产生积极影响。 ...

证券代码：688728 证券简称：格科微 公告编号：2025-042 格科微有限公司 关于高像素图像传感器产品出货情况的自愿性公告 今年以来，公司3,200万及5,000万像素图像传感器出货量持续提升，推动公 司高像素产品收入持续增长，在手机CIS业务营收占比进一步提升。截至公告发 布日，本年度公司3,200万及5,000万像素图像传感器产品已累计实现出货超1亿颗， 其中5,000万像素产品包含0.61微米、0.7微米、1.0微米等多个规格，被广泛应用 于多个品牌客户机型的前后主摄。 同时，公司持续推动单芯片高像素产品在更多品牌客户导入、出货及量产。 近日，公司收到国际知名品牌ODM订单，并已实现部分出货。公司本次供应0.7 1 截至公告发布日，本年度格科微有限公司（以下简称"公司"）3,200万 及5,000万像素图像传感器产品已累计实现出货超1亿颗。 公司高像素产品的持续放量，充分证明公司高像素单芯片集成技术得到 市场验证与认可，对公司未来的发展将产生积极的影响。 公司于近日收到国际知名品牌原始设备制造商（ODM）订单，供应0.7 微米规格5,000万像素图像传感器产品，已实现部分出货。 微米规格5,00 ...

格隆汇12月4日丨格科微(688728.SH)公布，截至公告发布日，本年度公司3,200万及5,000万像素图像传 感器产品已累计实现出货超1亿颗。公司高像素产品的持续放量，充分证明公司高像素单芯片集成技术 得到市场验证与认可，对公司未来的发展将产生积极的影响。公司于近日收到国际知名品牌原始设备制 造商（ODM）订单，供应0.7微米规格5,000万像素图像传感器产品，已实现部分出货。 ...

格隆汇12月4日｜格科微公告，截至公告发布日，本年度格科微有限公司3,200万及5,000万像素图像传感 器产品已累计实现出货超1亿颗。公司于近日收到国际知名品牌原始设备制造商(ODM)订单，供应0.7微 米规格5,000万像素图像传感器产品，已实现部分出货。 ...

格科微公告，截至公告发布日，本年度格科微有限公司3,200万及5,000万像素图像传感器产品已累计实 现出货超1亿颗。公司于近日收到国际知名品牌原始设备制造商（ODM）订单，供应0.7微米规格5,000 万像素图像传感器产品，已实现部分出货。 ...

Core Insights - The global automotive CMOS image sensor (CIS) market is projected to grow from $1.377 billion in 2020 to $2.499 billion in 2024, with a compound annual growth rate (CAGR) of 16.1% [7] - The Chinese automotive CIS market is expected to reach approximately 7.83 billion yuan in 2024, reflecting a year-on-year growth of 19.7% [7] - The automotive CIS industry is characterized by high technical barriers and market concentration, with the top three companies holding over 80% of the global market share in 2024 [7] Automotive CIS Industry Overview - CMOS image sensors (CIS) are semiconductor devices that convert optical images into digital signals, widely used in consumer electronics, security monitoring, and intelligent driving [2][4] - In automotive applications, CIS is a core component of camera modules, crucial for light perception and image quality [2][4] - The cost structure of automotive camera modules shows that CIS, packaging, and optical lenses account for nearly 75% of total costs, with CIS alone representing 40% [6][7] Market Dynamics - The demand for automotive cameras is increasing exponentially due to the trend of automotive intelligence, with CIS benefiting directly from this growth [7] - The number of cameras per vehicle is rising, alongside demands for higher resolution and enhanced low-light performance, which increases the average value of individual camera modules [7] Competitive Landscape - The automotive CIS market is dominated by a few key players, with OmniVision leading at a 32.9% market share, followed by ON Semiconductor and Sony [7] - Chinese companies like SmartSens and Geke Micro are also gaining market share, reflecting the increasing competitiveness of domestic firms [7] Future Trends - The automotive CIS industry is expected to continue benefiting from the trend of automotive intelligence, with leading companies likely to strengthen their positions through technological advancements and brand advantages [8] - Future developments in automotive CIS will focus on higher resolutions (over 8 million pixels), functional safety (ASIL-B/D), and multi-spectral integration (visible light + infrared) to meet diverse needs [8]

Core Insights - The electronic sector has significantly outperformed the market since 2025, driven by substantial capital expenditures and demand for computing power from major companies like Google, Meta, Microsoft, and Amazon, which collectively spent nearly $100 billion in Q3 2025, a year-on-year increase of approximately 70% [1] - The demand for high-end PCBs (Printed Circuit Boards) has surged due to the explosion of computing power, particularly for AI servers, which require advanced PCB designs [1] - The global PCB market is projected to approach $95 billion by 2029, with the specialized PCB market for AI and high-performance computing expected to grow at a compound annual growth rate (CAGR) exceeding 20% from 2024 to 2029 [1] Semiconductor Sector - In Q3 2025, top performers in the semiconductor sector included companies like Silan Micro with a 1109% year-on-year growth and Geke Micro with 519% [2] - The strong performance of Nvidia and Google's AI advancements indicate that the AI industry is in an accelerating growth phase, presenting opportunities in the PCB sector as it aligns with AI chip upgrades [2] PCB Sector - Companies in the PCB sector, such as Shenghong Technology and Shennan Circuit, reported significant revenue and net profit growth, reflecting the rapid increase in orders for AI servers and related equipment [1][2] - The PCB market is experiencing a transformation driven by AI, which is reshaping the value chain of the electronic industry and creating new growth opportunities [2] Market Activity - On November 24, 2025, the PCB sector saw active trading, with stocks like Pengding Holdings and Huadian Shares rising over 1%, indicating positive market sentiment [3] - The electronic ETF (515260), which focuses on core leaders in the electronic sector, has attracted significant investment, with a total of 11.2 million yuan in inflows over three days, reflecting investor confidence in the sector's future performance [3] Investment Tools - The electronic ETF (515260) and its linked funds are designed to track the electronic 50 index, focusing on semiconductor and consumer electronics sectors, including high-demand areas like AI chips and 5G [5][6] - The ETF's composition heavily features the Apple supply chain, which accounts for 44.63% of its holdings, benefiting from the anticipated strong performance of Apple's product line [6] - Government policies are supporting the semiconductor industry, aiming for self-sufficiency and leveraging AI to enhance consumer electronics, positioning the electronic sector for potential growth [6]

Group 1 - The company, GeKong Micro, announced the completion of the stock registration for the first grant of the 2023 restricted stock incentive plan on November 20, 2025 [2] - A total of 1,633,520 shares were registered for this vesting period [2]