Core Insights - The HDI board market is experiencing significant growth driven by global digital transformation and the trend towards electric and intelligent vehicles. China, as a major manufacturing and consumption market, is seeing rapid development in the HDI board industry, with a projected market size of 45.568 billion yuan in 2024, reflecting a year-on-year increase of 16.5% [1][6]. - The market is expected to continue expanding, reaching 50.908 billion yuan by 2025, with an 11.7% year-on-year growth [1][6]. Industry Overview - HDI boards, or High-Density Interconnect boards, utilize micro-blind buried hole technology and lamination processes to enhance circuit density, catering to the miniaturization and high-speed signal transmission needs of electronic products. They are primarily used in mobile phone motherboards, digital devices, and automotive electronics [3][4]. - The HDI board industry can be categorized into three types based on lamination complexity: low-end HDI (single lamination), high-end HDI (two or more laminations), and any-layer HDI (most complex) [3]. Market Size and Growth - The global HDI board market is projected to reach 12.8 billion USD in 2024, with a year-on-year increase of 15.3%, and is expected to grow to approximately 14.3 billion USD by 2025 [5][6]. Competitive Landscape - The HDI board industry is dominated by overseas and Taiwanese manufacturers, while mainland Chinese companies are rapidly catching up. Key players in mainland China include companies like Fangzheng Technology, Bomin Electronics, and Shenghong Technology, which are increasing their R&D investments and expanding high-end production capacities [7][8]. Development Trends - The HDI board market is shifting towards higher-end products, driven by the demand for advanced mobile devices and the adoption of AnyLayer HDI motherboards in Android smartphones. The trend indicates a growing need for high-layer HDI boards as high-end smartphone sales increase [9]. - The application fields for HDI boards are expanding, particularly in the rising electric vehicle sector, which requires stable and reliable circuit connections for various systems [10]. Additionally, the medical device sector is also a growing market for HDI boards due to the demand for miniaturized and intelligent devices [11]. - Environmental considerations are leading to a trend towards green manufacturing practices in the HDI board industry, with a focus on reducing harmful substances and optimizing production processes [12].

Market Overview - The component sector experienced a decline of 4.47% on September 26, with Zhongfu Circuit leading the drop [1] - The Shanghai Composite Index closed at 3828.11, down 0.65%, while the Shenzhen Component Index closed at 13209.0, down 1.76% [1] Stock Performance - Notable gainers included: - Tianjin Pulin (002134) with a closing price of 21.00, up 4.37% on a trading volume of 143,100 shares and a turnover of 301 million [1] - ST Dongjing (002199) closed at 10.01, up 3.52% with a trading volume of 44,000 shares [1] - Major decliners included: - Zhongfu Circuit (300814) closed at 48.52, down 8.61% with a trading volume of 137,800 shares and a turnover of 689 million [2] - Dongshan Precision (002384) closed at 68.58, down 7.44% with a trading volume of 862,600 shares [2] Capital Flow - The component sector saw a net outflow of 6.765 billion in institutional funds, while retail investors contributed a net inflow of 5.702 billion [2] - The table of capital flow indicates varying levels of net inflow and outflow among individual stocks, with notable movements in Tianjin Pulin and ST Dongjing [3]

Group 1 - The core point of the article is that Zhuhai's second plant of Chongda Technology is currently in a ramp-up phase with a monthly production capacity of 120,000 square meters, and the full capacity will be determined based on market conditions and ramp-up progress [2] Group 2 - The company is committed to maximizing the efficiency of the Zhuhai second plant and will actively work to release its production potential [2]

崇达技术（002815.SZ）9月26日在投资者互动平台表示，公司目前尚无直接的OCS（光电路交换）交换 机产品。我们的研发资源主要聚焦于服务器、通讯、航空航天用高多层PCB、以及先进封装基板等核心 技术的开发与量产。公司会持续关注行业技术动态，积极布局前沿领域。 （文章来源：每日经济新闻） 每经AI快讯，有投资者在投资者互动平台提问：请问董秘贵公司有在OCS方面的技术储备吗？ ...

崇达技术（002815.SZ）9月26日在投资者互动平台表示，普诺威与歌尔股份、立讯精密的合作持续深 化，向其供应MEMS类载板，主要应用于智能手机、TWS耳机、可穿戴设备等领域。其他信息请以公 司指定媒体披露信息为准。 （记者 曾健辉） 每经AI快讯，有投资者在投资者互动平台提问：客户拓展：进入头部企业供应链 普诺威2025年成功进 入华为海思、立讯精密、歌尔微电子等头部客户的供应链，其先进封装基板产品已应用于智能手机、智 能手表、5G基站等终端设备。例如，普诺威为华为海思提供的25/25微米IC载板（用于AI服务器），已 实现批量供货，成为其2025年的重要收入来源。 请问普诺威是真的进入立讯精密歌尔股份供应链 吗？？今年业绩会有大增长吗？？ ...

格隆汇9月26日丨崇达技术(002815.SZ)在投资者互动平台表示，公司目前尚无直接的OCS(光电路交换) 交换机产品。公司的研发资源主要聚焦于服务器、通讯、航空航天用高多层PCB、以及先进封装基板等 核心技术的开发与量产。公司会持续关注行业技术动态，积极布局前沿领域。 ...

Group 1 - The company, Chongda Technology (002815.SZ), has notable clients in the server industry, including ZTE, H3C, and Inspur [1] - The company's products are utilized in various fields such as server motherboards, storage devices, and GPUs [1]

Core Viewpoint - Chongda Technology (002815.SZ) is currently in the ramp-up phase of its production capacity at the Zhuhai Second Plant, which has a monthly capacity of 120,000 square meters. The full production capacity will be determined based on market conditions and the progress of the ramp-up [1] Group 1 - The current monthly production capacity of the Zhuhai Second Plant is 120,000 square meters [1] - The company is focused on maximizing the efficiency of its production as it ramps up capacity [1] - The specific full production capacity will be aligned with market conditions and ramp-up progress [1]

本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 特别提示： | 证券代码：002815 | 证券简称：崇达技术 | 公告编号：2025-067 | | --- | --- | --- | | 债券代码：128131 | 债券简称：崇达转2 | | 崇达技术股份有限公司 关于"崇达转 2"摘牌的公告 一、可转债基本情况 （一）可转债发行情况 经中国证券监督管理委员会"证监许可[2020]1487 号文"核准，崇达技术股 份有限公司（以下简称"公司"）于 2020 年 9 月 7 日公开发行了 1,400.00 万张可 转债，每张面值 100 元，发行总额 140,000.00 万元。发行方式采用向股权登记日 收市后登记在册的公司原股东优先配售，原股东优先配售后余额部分（含原股东 放弃优先配售部分）通过在深圳证券交易所（以下简称"深交所"）交易系统网 上向社会公众投资者发行，认购金额不足 140,000.00 万元的部分由保荐机构（主 承销商）包销。 （二）可转债上市情况 经深交所"深证上﹝2020﹞886 号"文同意，公司 140,000.00 万元可转债于 2 ...

| 证券代码：002815 | 证券简称：崇达技术 | 公告编号：2025-066 | | --- | --- | --- | | 债券代码：128131 | 债券简称：崇达转2 | | （三）可转债转股期限 根据有关规定和《崇达技术股份有限公司公开发行可转换公司债券募集说明 书》（以下简称"《募集说明书》"）的约定，本次发行的可转债转股期限自发 行结束之日起满六个月后的第一个交易日起至可转换公司债券到期日止，即自 2021 年 3 月 11 日至 2026 年 9 月 6 日（由于 2026 年 9 月 6 日为非交易日，实际 转股截止日期为 2026 年 9 月 4 日）。 1 崇达技术股份有限公司 关于"崇达转 2"赎回结果的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 一、可转债基本情况 （一）可转债发行情况 经中国证券监督管理委员会"证监许可[2020]1487 号文"核准，崇达技术股 份有限公司（以下简称"公司"）于 2020 年 9 月 7 日公开发行了 1,400.00 万张 可转债，每张面值 100 元，发行总额 140,000.00 ...