Market Outlook - The global printed circuit board (PCB) market is expected to grow by 6.8% in value and 7.0% in shipment volume in 2025, driven by increased demand in sectors like mobile phones, servers, and communications [2][3] - The company anticipates a significant increase in sales orders in high-demand areas, particularly in mobile and server sectors, due to strong domestic and international order demand [2][3] Capacity and Production - Current overall capacity utilization is approximately 85% [3] - The company is accelerating the release of high-layer PCB capacity in its Zhuhai plants and is planning to establish a new HDI factory in Jiangmen to meet customer demand [3][5] - Ongoing construction of a production base in Thailand aims to enhance the overseas production network [3][5] Profitability Improvement Measures - The company is focusing on high-value customers and optimizing the sales structure to improve product gross margins [4][5] - Measures include managing loss-making orders, enhancing the sales team's capabilities, and implementing a performance-based incentive system [4][5] - Cost management initiatives are in place to reduce unit product costs and maintain competitive advantages [4][5] Response to Raw Material Cost Increases - The company is facing rising raw material costs, particularly for copper and other key materials, which have seen significant price increases since June 2024 [7][8] - Strategies to mitigate cost pressures include dynamic monitoring of costs, improving material utilization, and implementing price adjustments for certain products [7][8] U.S. Market Exposure and Tariff Impact - Currently, approximately 10% of the company's revenue comes from the U.S. market [9] - The company is actively diversifying its market presence to reduce reliance on the U.S. market, with domestic sales exceeding 50% [9][10] - Strategies to address U.S. tariffs include optimizing customer cooperation strategies and accelerating the establishment of overseas production bases [9][10]

Core Viewpoint - The PCB market is experiencing a structural transformation driven by the demand for high-end products, particularly in AI-related applications, leading to a significant increase in both demand and prices for high-end PCBs [1][3][4]. Group 1: Market Conditions - The current PCB market is characterized by a shortage of high-end products and pressure on low-end products, with overall market conditions improving compared to last year [1][2]. - Many PCB companies have reported positive earnings forecasts for the first half of the year, with some companies experiencing significant growth, such as a 3.7 times increase in net profit for certain firms [2][3]. - The demand for high-end PCBs is being driven by the rapid growth of AI server hardware, which requires advanced PCB technologies [3][9]. Group 2: Company Performance - Major companies like Pengding Holdings and Huadian Electronics are seeing substantial increases in net profits, with expected growth rates exceeding 40% year-on-year [3][6]. - Companies involved in the production of electronic-grade fiberglass and copper-clad laminates are also reporting significant increases in sales and profitability due to rising demand [2][6]. - The overall order saturation for PCB manufacturers is reported to be over 90%, indicating strong market demand [6][7]. Group 3: Future Projections - The global PCB market is projected to grow significantly, with estimates suggesting a market value of $78.6 billion by 2025, driven by advancements in AI and high-performance computing [4][8]. - The demand for high-layer and high-density interconnect (HDI) boards is expected to grow at rates of 14.2% and 18.5%, respectively, indicating a shift towards more complex PCB designs [8][10]. - The industry is likely to face challenges related to potential overcapacity as more companies announce expansion plans to meet the surging demand for high-end PCBs [10][12]. Group 4: Technological Advancements - The shift towards high-end PCBs is accompanied by increased technical barriers, with only a few manufacturers capable of producing advanced PCBs that meet the requirements of AI servers and high-speed data transmission [9][11]. - Companies are investing heavily in new technologies and production capabilities to meet the evolving demands of the market, including investments in low-loss materials and advanced manufacturing processes [5][10]. - The regulatory environment is also pushing companies to focus on high-quality production and green manufacturing practices, further raising the competitive bar in the industry [11][12].

证券代码：002815 证券简称：崇达技术 公告编号：2025-034 一、公司担保事项概述 1、本次担保基本情况 崇达技术股份有限公司（以下简称"公司"）因子公司深圳崇达多层线路板 有限公司（以下简称"深圳崇达"）、珠海崇达电路技术有限公司（以下简称"珠 海崇达"）日常生产经营相关授信业务需要，于 2025 年 7 月 25 日与中国银行股 份有限公司南头支行（以下简称"中国银行南头支行"）签署了《最高额保证合 同》。 崇达技术股份有限公司 关于为子公司提供担保的进展公告 中国银行南头支行为深圳崇达、珠海崇达各提供综合授信额度 2 亿元，公司 为全资子公司本次授信业务均提供全额信用保证。 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 2、公司本次担保额度的审议情况 2025 年 4 月 15 日，公司召开的第五届董事会第二十二次会议、第五届监事 会第十五次会议，以及 2025 年 5 月 9 日召开的 2024 年度股东会，审议通过了 《关于公司 2025 年度对子公司担保额度预计的议案》，同意公司为深圳崇达、珠 海崇达分别提供不超过 147,000 万元 ...

Market Outlook - The global printed circuit board (PCB) market is expected to grow by 6.8% in value and 7.0% in shipment volume in 2025, driven by increased demand in sectors like mobile phones, servers, and communications [2] - The company anticipates a significant increase in sales orders in high-demand areas, particularly in high-layer boards for communications and servers, as well as high-density interconnect (HDI) boards for mobile phones [2] Capacity and Production - Current overall capacity utilization is approximately 85% [3] - The company is accelerating the release of high-layer PCB capacity in its Zhuhai plants and is planning to establish a new HDI factory in Jiangmen to meet customer demand [3][4] - Ongoing construction of a production base in Thailand aims to enhance the overseas production network [3] Profitability Improvement Measures - The company is focusing on high-value customers and orders, optimizing the sales structure by eliminating loss-making orders and increasing the proportion of high-margin orders [4] - Strengthening the sales team by recruiting experienced professionals and implementing performance incentives to boost sales efficiency [4] - Enhancing cost management through standardized cost control measures and improving material utilization [5] - Innovating product offerings to meet high-value customer demands, particularly in high-frequency and high-reliability PCB products [5] Financial Strategy - The company aims to improve operational performance to support the conversion of convertible bonds, ensuring a stable cash flow for repayment [6] - A flexible exit strategy for convertible bonds will be maintained, adapting to market conditions and investor needs [6] Raw Material Cost Management - The company is facing rising raw material costs, particularly for copper and other key materials, and is implementing measures to mitigate these pressures [7] - Strategies include dynamic cost monitoring, improving material efficiency, and selectively raising prices for certain products [8] U.S. Market Exposure - Currently, approximately 10% of the company's revenue comes from the U.S. market [9] - The company is diversifying its market presence to reduce reliance on the U.S. market, with domestic sales exceeding 50% [9] - Strategies to address U.S. tariffs include optimizing customer cooperation terms and accelerating the establishment of overseas production bases [10]

崇达技术股份有限公司 关于 2025 年第二季度可转换公司债券转股情况的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假记 载、误导性陈述或重大遗漏。 特别提示： 证券代码：002815 证券简称：崇达技术 债券代码：128131 债券简称：崇达转 2 转股价格：10.25 元/股 转股起止日期：2021 年 3 月 11 日至 2026 年 9 月 6 日（由于 2026 年 9 月 6 日 为非交易日，实际转股截止日期为 2026 年 9 月 4 日） 转股股份来源：仅使用新增股份转股 证券代码：002815 证券简称：崇达技术 公告编号：2025-033 根据有关规定和公司《崇达技术股份有限公司公开发行可转换公司债券募集说 明书》（以下简称"《募集说明书》"）的约定，本次发行的可转债转股期限自发行 结束之日起满六个月后的第一个交易日起至可转换公司债券到期日止，即自 2021 年 3 月 11 日至 2026 年 9 月 6 日（由于 2026 年 9 月 6 日为非交易日，实际转股截止日 期为 2026 年 9 月 4 日）。 （四）可转债转股价格调整情况 1、2021 年 5 ...

三记 中 证 鹏 元 CSCI Pengyuan 崇达技术股份有限公司相关债券 2025 年跟踪评级报告 中鹏信评【2025】跟踪第【251】号 01 115 19 信用评级报告声明 除因本次评级事项本评级机构与评级对象构成委托关系外,本评级机构及评级从业人员与评级对象不存 在任何足以影响评级行为独立、客观、公正的关联关系。 本评级机构与评级从业人员已履行尽职调查义务,有充分理由保证所出具的评级报告遵循了真实、客观、 公正原则,但不对评级对象及其相关方提供或已正式对外公布信息的合法性、真实性、准确性和完整性 作任何保证。 本评级机构依据内部信用评级标准和工作程序对评级结果作出独立判断，不受任何组织或个人的影响。 本评级报告观点仅为本评级机构对评级对象信用状况的个体意见,不作为购买、出售、持有任何证券的 建议。本评级机构不对任何机构或个人因使用本评级报告及评级结果而导致的任何损失负责。 资料来源：公司 2022-2024 年审计报告及未经审计的 2025 年 1-3 月财务报表，中证鹏元 整理 本次评级结果自本评级报告所注明日期起生效,有效期为被评证券的存续期。同时,本评级机构已对受 评对象的跟踪评级事项做出了 ...

证券代码：002815 证券简称：崇达技术 公告编号：2025-032 崇达技术股份有限公司 关于为子公司提供担保的进展公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 一、公司担保事项概述 1、本次担保基本情况 崇达技术股份有限公司（以下简称"公司"）因参股子公司深圳市三德冠精 密电路科技有限公司（以下简称"三德冠"）日常生产经营相关授信业务需要， 于近日与上海浦东发展银行股份有限公司深圳分行（以下简称"浦发银行深圳分 行"）签署了《最高额保证合同》，为三德冠与银行发生的授信业务提供信用保 证。 浦发银行深圳分行为三德冠提供 8,000 万元授信额度，公司按照持股比例 49% 为三德冠本次授信额度提供信用保证，三德冠其他股东楼宇星、吕亚以及珠海市 三德冠高频电子科技有限公司提供全额信用保证。 2、公司本次担保额度的审议情况 1、担保方式 1 公司提供连带责任保证。 2、担保期限 保证期间为，按债权人对债务人每笔债权分别计算，自每笔债权合同债务履 行期届满之日起至该债权合同约定的债务履行期届满之日后三年止。 3、担保范围 2025 年 4 月 15 日，公 ...

证券代码：002815 证券简称：崇达技术 公告编号：2025-031 崇达技术股份有限公司 2025 年 4 月 15 日，公司召开的第五届董事会第二十二次会议、第五届监事 会第十五次会议，以及 2025 年 5 月 9 日召开的 2024 年度股东会，审议通过了 《关于公司 2025 年度对子公司担保额度预计的议案》、《关于为参股子公司提 供担保额度预计暨关联交易的议案》，同意公司为大连崇达、三德冠分别提供不 超过 83,000 万元、43,610 万元担保额度，该担保额度使用有效期为股东会审议 通过之日起十二个月内。 关于为子公司提供担保的进展公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 一、公司担保事项概述 1、本次担保基本情况 崇达技术股份有限公司（以下简称"公司"）因全资子公司大连崇达电路有 限公司（以下简称"大连崇达"）、参股子公司深圳市三德冠精密电路科技有限 公司（以下简称"三德冠"）日常生产经营相关授信业务需要，于近日与招商银 行股份有限公司大连分行（以下简称"招商银行大连分行"）、深圳市中小担小 额贷款有限公司（以下简称"深圳中小担 ...

Core Viewpoint - The company has announced an adjustment to the conversion price of its convertible bonds, reducing it from 10.37 CNY per share to 10.25 CNY per share, effective from May 22, 2025, due to the distribution of cash dividends [1][3]. Group 1: Convertible Bond Adjustment - The company issued 14 million convertible bonds on September 7, 2020, and the adjustment in conversion price is based on the company's profit distribution plan approved on May 9, 2025 [1][2]. - The adjustment formula for the conversion price is outlined, taking into account factors such as cash dividends and stock distributions [1][2]. - The cash dividend distribution is set at 1.2 CNY per 10 shares, and the adjustment in conversion price reflects this distribution [2][3]. Group 2: Implementation Details - The record date for the dividend distribution is May 21, 2025, and the adjustment will not involve a suspension of conversion rights [2][3]. - The adjusted conversion price will be effective from May 22, 2025, allowing bondholders to convert at the new price [3].

一、股东会审议通过利润分配方案情况 转债"）仍处于转股期，公司拟以未来实施分配方案时股权登记日的总股本为基 数，向全体股东每 10 股派发现金人民币 1.2 元（含税），不转增股本，不送红 股。剩余未分配利润结转以后年度分配。在利润分配方案公告后至实施前，因可 转换公司债券转股、股份回购、股权激励行权等原因导致享有利润分配权的股份 总额变动的情形，则以权益分派实施时股权登记日的总股本为基数，按照分配比 例不变的原则调整分配总额。 超过两个月。 二、权益分派方案 证券代码：002815 证券简称：崇达技术 公告编号：2025-029 崇达技术股份有限公司 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 召开 2024 年度股东会，审议通过了公司 2024 年度权益分派方案，现将权益分派 事宜公告如下： 年 5 月 22 日通过股东托管证券公司（或其他托管机构）直接划入其资金账户。 序号 股东账号 股东名称 在权益分派业务申请期间（申请日：2025 年 5 月 13 日至股权登记日：2025 年 5 月 21 日），如因自派股东证券账户内股份减少而导致委托中国结算 ...