本公司及董事会全体成员保证信息披露的内容真实、准确和完整，没有虚假记载、误导 性陈述或重大遗漏。 证券代码：301217 证券简称：铜冠铜箔 公告编号：2025-057 安徽铜冠铜箔集团股份有限公司 第二届董事会第十七次会议决议公告 三、备查文件 1.第二届董事会第十七次会议决议。 一、董事会会议召开情况 安徽铜冠铜箔集团股份有限公司（以下简称"公司"）第二届董事会第十七 次会议于 2025 年 10 月 23 日以现场结合通讯方式召开。会议通知已于本次董事 会召开 10 日前发出。本次会议由董事长甘国庆先生召集并主持，会议应出席董 事 9 名，实际出席董事 9 名，公司部分高管列席了会议。会议的召集和召开符合 《中华人民共和国公司法》和《公司章程》的有关规定。 二、董事会会议审议情况 经与会董事认真审议，通过如下议案： 1、审议通过了《关于公司<2025 年第三季度报告>的议案》 公司严格按照《证券法》《深圳证券交易所创业板股票上市规则》等有关规 定，完成了 2025 年第三季度报告的编制工作。公司董事会认为：公司 2025 年第 三季度报告真实、准确、完整地反映了公司 2025 年 1-9 月份的财务状况 ...

安徽铜冠铜箔集团股份有限公司 2025 年第三季度报告 证券代码：301217 证券简称：铜冠铜箔 公告编号：2025-058 安徽铜冠铜箔集团股份有限公司 2025 年第三季度报告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假记载、误导性陈述或重大遗漏。 重要内容提示： 1.董事会、监事会及董事、监事、高级管理人员保证季度报告的真实、准确、完整，不存在虚假记载、误导性陈述或重大 遗漏，并承担个别和连带的法律责任。 2.公司负责人、主管会计工作负责人及会计机构负责人(会计主管人员)声明：保证季度报告中财务信息的真实、准确、完 整。 3.第三季度财务会计报告是否经过审计 □是 否 1 安徽铜冠铜箔集团股份有限公司 2025 年第三季度报告 一、主要财务数据 （一） 主要会计数据和财务指标 单位：元 公司是否需追溯调整或重述以前年度会计数据 □是 否 | | 本报告期 | 本报告期比上年同期 | 年初至报告期末 | 年初至报告期末比上 | | --- | --- | --- | --- | --- | | | | 增减 | | 年同期增减 | | 营业收入（元） | 1,737,477,96 ...

Core Viewpoint - The company announced a cash dividend distribution plan for the first half of 2025, indicating a commitment to returning value to shareholders [1] Summary by Sections Dividend Distribution - The company will distribute a cash dividend of 0.200000 RMB per 10 shares to all shareholders, based on a total share capital of 829,015,544 shares, excluding 2,999,900 repurchased shares, resulting in a base of 826,015,644 shares [1] - The record date for the dividend is set for October 27, 2025, and the ex-dividend date is October 28, 2025 [1]

证券代码：301217 证券简称：铜冠铜箔 公告编号：2025-056 安徽铜冠铜箔集团股份有限公司 2025年中期权益分派实施公告 本公司及董事会全体成员保证信息披露的内容真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 特别提示： 1、截至本公告披露日，安徽铜冠铜箔集团股份有限公司（以下简称"公司"） 的回购专用证券账户股份数量 2,999,900 股，不参与本次权益分派。公司 2025 年中期权益分派方案为：以公司现有总股本剔除已回购股份 2,999,900 股后的 826,015,644 股为基数，向全体股东每 10 股派发现金红利 0.2 元（含税），预 计派发现金分红总额人民币 16,520,312.88 元（含税）不转增，不送股，剩余未 分配利润结转以后年度。 2、本次权益分派实施后计算除权除息价格时，按总股本（含回购股份）折 算的每 10 股现金股利（含税）=现金分红总额/总股本×10 股=16,520,312.88 元/829,015,544 股×10 股=0.199276 元（保留六位小数，最后一位直接截取， 不四舍五入）。本次权益分派实施后的除权除息参考价格=（除权除息日的前一 ...

Core Viewpoint - The collaboration between Guoxuan High-Tech and Tongguan Copper Foil is significant, with Guoxuan High-Tech being a major customer for Tongguan Copper Foil, particularly in the lithium battery sector [2] Group 1 - Guoxuan High-Tech is the second-largest shareholder of Tongguan Copper Foil [2] - Tongguan Copper Foil supplies lithium battery copper foil to Guoxuan High-Tech [2] - A stable cooperative relationship has been established between the two companies in the battery field [2]

Group 1 - The core viewpoint of the news highlights the recent trading performance and financial metrics of Copper Crown Copper Foil, indicating a strong market presence and growth potential [1][2][3] Group 2 - On October 9, Copper Crown Copper Foil's stock rose by 1.63%, with a trading volume of 951 million yuan. The financing buy-in amount for the day was 91.14 million yuan, while the net financing buy-in was 3.74 million yuan, indicating active trading [1] - As of October 9, the total margin balance for Copper Crown Copper Foil was 342 million yuan, accounting for 1.30% of its market capitalization, which is above the 80th percentile of the past year [1] - The company reported a significant increase in revenue for the first half of 2025, achieving 2.997 billion yuan, a year-on-year growth of 44.80%, and a net profit of 34.95 million yuan, up 159.47% year-on-year [2] - The company has distributed a total of 257 million yuan in dividends since its A-share listing, with 133 million yuan distributed over the past three years [3] - As of June 30, 2025, the number of shareholders increased to 62,600, with an average of 13,253 circulating shares per person, reflecting a slight decrease [2][3]

Investment Rating - The report maintains a "Recommended" investment rating for the mechanical equipment industry [3] Core Viewpoints - The mechanical equipment industry is entering the "AI Era," which will create significant investment opportunities centered around AI infrastructure and AI empowerment [4][15] - The report highlights the historical performance of the mechanical equipment sector during previous five-year plans, indicating that each era has distinct characteristics that influence investment opportunities [6][10] Summary by Sections 1. Review of Five-Year Plans - The mechanical equipment industry has shown varying performance across the past four five-year plans, with significant growth during the Eleventh Five-Year Plan (642% increase) and a decline during the Thirteenth Five-Year Plan (-21% decrease) [6][7] - The industry ranked second among 28 sectors during the Eleventh Five-Year Plan and seventh during the Fourteenth Five-Year Plan, reflecting its evolving significance [7][8] 2. AI Infrastructure: Driving Demand for PCB Equipment, AIDC, Liquid Cooling, and Semiconductor Equipment - The AI computing revolution is expected to drive structural growth in PCB demand, with a projected annual growth rate of 16.3% for AI server-related HDI from 2023 to 2028 [19] - The report anticipates that the global PCB market will reach $73.565 billion in 2024, with a 5.8% year-on-year increase, and $94.661 billion by 2029 [19] - AI servers significantly increase the unit value of PCBs, with a single AI server PCB valued at $500-$800, compared to $200-$300 for traditional servers [20] - The report identifies challenges in capacity expansion, including long delivery times for high-end equipment and complex process validations [21] 3. AI Empowerment: The Rise of Embodied Intelligent Robots - The report discusses the practical applications of embodied intelligent robots in industrial logistics, elderly care, and specialized environments, emphasizing their potential to improve efficiency and safety [4][15] - It highlights the importance of technical feasibility and cost-effectiveness in the deployment of these robots [4] 4. Investment Recommendations - The report suggests focusing on AI infrastructure and AI empowerment as key investment directions for the mechanical equipment industry during the Fifteenth Five-Year Plan [4][15] - Specific recommendations include AI PCB equipment, AIDC power generation equipment, liquid cooling solutions, and semiconductor equipment [4][15] 5. Related Listed Companies - The report provides insights into key companies in the PCB equipment sector, such as Dazhu CNC, Chipbond Technology, and Dongwei Technology, highlighting their market performance and technological advancements [40][41]

Core Viewpoint - The report highlights that the evolution of AI computing hardware is driving structural growth opportunities in the PCB (Printed Circuit Board) industry, with significant demand for high-layer and HDI boards due to the increasing requirements of AI applications and high-performance computing [1][27]. Industry Overview - The global PCB market size is projected to grow from $62 billion in 2020 to $75 billion in 2024, with a compound annual growth rate (CAGR) of 4.9%. By 2029, the market is expected to reach $93.7 billion, with a CAGR of 4.6% from 2024 to 2029 [1][27]. - The AI and high-performance computing sectors are anticipated to see substantial growth, with the market size expected to reach $15 billion by 2029, reflecting a CAGR of 20.1% from 2024 to 2029 [1][27]. Demand Drivers - The demand for high-layer PCBs and HDI boards is rapidly increasing, driven by the need for high-frequency, low-signal loss, and high-heat dissipation performance in AI servers. The value of a single AI server PCB is significantly higher than that of traditional servers [1][27]. - The market for high-layer PCBs is projected to reach $171 billion by 2029, while the share of high-end HDI boards in the global HDI market is expected to rise from 47% in 2024 to 57% in 2029, with a market size of $9.6 billion [1][27]. Technological Advancements - AI server requirements are pushing PCB technology upgrades, necessitating the use of high-layer (14-30 layers) and low-loss materials. This includes the adoption of low roughness reverse (RTF) copper foil and very low loss materials to minimize signal distortion [1][27]. - The report emphasizes the importance of material upgrades, such as the transition from traditional fiberglass cloth to low dielectric constant Q cloth, to meet the evolving demands of high-frequency applications [1][27]. Company Strategies - Companies in the PCB sector are actively expanding their capabilities. For instance, companies like Huadian Co. are advancing high-end PCB production, while Shenghong Technology has the capacity for mass production of high-layer boards and HDI boards [1][27]. - Equipment manufacturers like Chip Microelectronics and Dazhu CNC are introducing laser equipment tailored for high-end PCB processing, while material suppliers like Honghe Technology and Feilihua are developing low-dielectric electronic fabrics and high-end copper foils [1][27].

安徽承义律师事务所 关于 关于安徽铜冠铜箔集团股份有限公司 召开 2025 年第三次临时股东会的法律意见书 (2025)承义法字第 00226 号 致：安徽铜冠铜箔集团股份有限公司 安徽铜冠铜箔集团股份有限公司 召开 2025 年第三次临时股东会的 法律意见书 安徽承义律师事务所 中国.合肥市政务区怀宁路 200 号栢悦中心 5 楼 邮编: 230022 电话（Tel）:（86-551）65609815 传真（Fax）:（86-551）65608051 网址（Website）:www.chengyi-law.com 电子信箱（E-mail）：chengyilawyer@163.com 安徽承义律师事务所 根据《中华人民共和国公司法》《中华人民共和国证券法》《上市公司股东 会规则》等法律法规和其他规范性文件的要求，安徽承义律师事务所接受安徽铜 冠铜箔集团股份有限公司（以下简称"公司"）的委托，指派束晓俊、方娟律师 （以下简称"本律师"）就公司召开 2025 年第三次临时股东会（以下简称"本 次股东会"）出具法律意见书。 一、本次股东会召集人资格和召集、召开的程序 经核查，本次股东会是由公司第二届董事会召集，公司 ...

证券代码：301217 证券简称：铜冠铜箔 公告编号：2025-055 安徽铜冠铜箔集团股份有限公司 2025年第三次临时股东会决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 特别提示： 1、本次股东会无否决议案的情形； 2、本次股东会不涉及变更以往股东大会已通过的决议。 一、会议召开和出席情况 1、会议召开的日期、时间： （1）现场会议召开时间：2025年9月29日（星期一）14：30； （2）网络投票时间：2025年9月29日（星期一）。其中，通过深圳证券交易 所交易系统进行网络投票的时间为2025年9月29日的交易时间，即上午9:15-9:25， 9:30-11:30和下午13:00-15:00；通过深圳证券交易所互联网投票系统投票的具 体时间为2025年9月29日9:15至15:00期间的任意时间。 2、会议召开方式：本次会议采取现场表决和网络投票相结合的方式。 3、会议召开地点：安徽省池州经济技术开发区清溪大道189号安徽铜冠铜箔 集团股份有限公司一楼会议室。 4、会议召集人：公司董事会。 6、本次股东会会议的召集、召开程序符合《中华人民共 ...