Group 1 - The company Xin Heng Hui (301678) has completed the change of its company type and registered capital, as well as the filing of its Articles of Association [1] - The company type has been changed from "non-listed joint-stock company (natural person investment or control)" to "listed joint-stock company (natural person investment or control)" [1] - The registered capital has increased from 179.6666 million to 239.555467 million [1]

证券代码：301678 证券简称：新恒汇 公告编号：2025-020 新恒汇电子股份有限公司 关于完成工商变更登记并换发营业执照的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 一、基本情况 新恒汇电子股份有限公司（以下简称"公司"）分别于 2025 年 8 月 15 日、 2025年9月4日召开第二届董事会第十一次会议和2025年第二次临时股东大会， 均审议通过了《关于变更公司注册资本、公司类型、取消监事会暨修订<公司章 程>并办理工商变更登记的议案》。具体内容详见公司于 2025 年 8 月 19 日披露 于巨潮资讯网（www.cninfo.com.cn）的《关于变更公司注册资本、公司类型、取 消监事会暨修订<公司章程>并办理工商变更登记的公告》（公告编号：2025-016）。 近日，公司已经完成了变更公司类型、注册资本的工商变更登记及《公司 章程》备案手续。公司类型由"股份有限公司(非上市、自然人投资或控股)"变 更为"股份有限公司(上市、自然人投资或控股)"；注册资本由 17,966.66 万元 变更为 23,955.5467 万元，并取得了由淄 ...

Core Viewpoint - The article highlights the significant advancements made by Xinhenghui in the integrated circuit packaging industry, emphasizing its role in breaking overseas technology monopolies and contributing to China's self-sufficiency in this sector [1][2]. Group 1: Company Overview - Xinhenghui has established itself as a key player in the integrated circuit industry by integrating research, production, sales, and testing services for packaging materials [1]. - The company has built strong technical barriers in three main areas: smart cards, etched lead frames, and IoT eSIM chip packaging [1][2]. Group 2: Core Technology and Business Model - The smart card business serves as the foundation for Xinhenghui's technological accumulation and business model innovation, utilizing a unique "upstream and downstream collaboration" approach [2]. - Xinhenghui's proprietary technologies, including high-precision metal surface patterning and surface treatment techniques, have enabled it to overcome high barriers to entry in flexible lead frame manufacturing [2][3]. Group 3: Growth and Market Expansion - The company has successfully extended its technology and experience from the smart card sector to the etched lead frame and IoT eSIM chip packaging markets, leveraging shared customers and technical synergies [4]. - Xinhenghui's etched lead frame business has seen a remarkable revenue growth of 46.48% year-on-year, driven by a focus on high-end applications [5]. Group 4: Future Development and Strategy - The company is investing in projects to enhance production capacity and technological innovation, including a 170 million yuan project for high-density QFN/DFN packaging materials [6]. - Xinhenghui aims to become a leading global supplier in the integrated circuit packaging materials sector while also enhancing its position in high-end product markets [6][7].

Core Viewpoint - The article highlights the rapid advancement of domestic substitution in the integrated circuit industry, focusing on the company Xinhenghui (301678) as a key player in the packaging materials and testing services sector, leveraging its integrated business model and core technological breakthroughs to break the overseas technology monopoly and promote self-sufficiency in China's integrated circuit packaging and testing industry [1] Group 1: Company Overview - Xinhenghui is one of the few integrated circuit companies in China that combines research, production, sales of chip packaging materials, and packaging testing services [1] - The company has established strong technical barriers in three main areas: smart cards, etched lead frames, and IoT eSIM chip packaging, allowing it to maintain a competitive edge in a fierce market [1][2] Group 2: Core Technology and Business Model - The smart card business serves as the foundation for Xinhenghui, where it employs an integrated business model of "key packaging materials + testing services," creating a competitive barrier that is difficult to replicate [2] - Xinhenghui's unique "upstream and downstream collaboration" model allows it to provide both flexible lead frames and smart card module testing services, enhancing delivery efficiency and profit margins while reducing reliance on external supply chains [2] Group 3: Technological Advancements - The company has developed high-etch-resistant alloy plating processes and nickel-palladium plating technology for smart cards, improving coating performance while reducing dependence on precious metals [3] - Xinhenghui's selective plating technology, which uses mold shielding for "regional" plating, has become a key method for cost control [3] Group 4: Market Expansion and Growth - Building on its smart card technology, Xinhenghui has expanded into the etched lead frame and IoT eSIM chip packaging sectors, leveraging shared technology and customer bases to quickly open new growth avenues [4] - The etched lead frame business has shown impressive performance, with a revenue increase of 46.48% year-on-year, focusing on high-end fields such as automotive-grade and high-density packaging [5] Group 5: Future Development and Strategy - Xinhenghui is committed to continuous capacity and technology iteration, with significant investments in projects aimed at alleviating capacity bottlenecks and enhancing market share [6] - The company aims to become a leading global supplier in the integrated circuit packaging materials sector while developing into a top-tier etched lead frame supplier [6] - Future plans include focusing on integrated circuit packaging, deepening technological innovation, and expanding into cutting-edge fields such as automotive and industrial internet [7]

利欧股份 | 301678 | 新恒汇 | 90.86 | 26.83 | 1.29 | | --- | --- | --- | --- | --- | | 000851 | *ST高鸿 | 0.66 | 26.80 | -2.94 | | 603626 | 科森科技 | 13.81 | 25.98 | -4.23 | | 301630 | 同宇新材 | 200.06 | 25.96 | 10.53 | | 603382 | 海阳科技 | 40.83 | 25.83 | 1.01 | | 300499 | 高澜股份 | 30.04 | 25.67 | 2.25 | | 002796 | 世嘉科技 | 17.66 | 25.26 | 10.03 | | 603262 | 技源集团 | 32.99 | 24.83 | 3.32 | | 002067 | 景兴纸业 | 5.19 | 24.44 | -1.52 | | 301251 | 威尔高 | 59.78 | 23.91 | 9.73 | | 301662 | 宏工科技 | 155.00 | 23.71 | -1.89 | | 000558 | 天府文旅 | 7 ...

Market Overview - The semiconductor sector increased by 1.44% on September 10, with Xin Henghui leading the gains [1] - The Shanghai Composite Index closed at 3812.22, up 0.13%, while the Shenzhen Component Index closed at 12557.68, up 0.38% [1] Top Gainers in Semiconductor Sector - Xin Henghui (301678) closed at 89.70, up 14.19% with a trading volume of 137,700 shares and a transaction value of 1.175 billion [1] - Dagang Co., Ltd. (002077) closed at 17.62, up 9.99% with a trading volume of 646,600 shares and a transaction value of 1.115 billion [1] - Lanke Technology (688008) closed at 114.10, up 5.70% with a trading volume of 585,500 shares and a transaction value of 666.7 million [1] Top Losers in Semiconductor Sector - Liandong Technology (301369) closed at 78.27, down 4.50% with a trading volume of 19,900 shares and a transaction value of 159 million [2] - Jingsheng Technology (688478) closed at 36.45, down 4.00% with a trading volume of 39,300 shares and a transaction value of 145 million [2] - Canray Technology (688061) closed at 33.30, down 2.92% with a trading volume of 13,600 shares and a transaction value of 45.82 million [2] Capital Flow in Semiconductor Sector - The semiconductor sector saw a net inflow of 1.475 billion from institutional investors, while retail investors experienced a net outflow of 548 million [2][3] - Major stocks like Haiguang Information (688041) and Dagang Co., Ltd. (002077) had significant net inflows from institutional investors, amounting to 689 million and 451 million respectively [3]

Group 1 - The company announced that its second extraordinary general meeting of shareholders for 2025 was held on September 4, 2025 [2] - The meeting approved several proposals, including the use of part of the raised funds for investing in new projects [2]

证券代码：301678 证券简称：新恒汇 公告编号：2025-019 新恒汇电子股份有限公司 2025 年第二次临时股东大会决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 特别提示： 1、本次股东大会无变更、否决提案的情形； 2、本次股东大会不涉及变更以往股东大会已通过的决议。 一、会议召开和出席情况 （一）会议召开情况 1、会议召开时间：2025 年 9 月 4 日（星期四）下午 16：00 2、会议召开方式：采取现场投票和网络投票相结合的方式 3、会议召开地点：山东省淄博市高新区中润大道 187 号 新恒汇电子股份有 限公司会议室 4、网络投票时间：通过深圳证券交易所交易系统进行网络投票的具体时间 为：2025 年 9 月 4 日上午 9:15-9:25，9:30-11:30，下午 13:00-15:00；通过深圳证 券交易所互联网投票系统投票的具体时间为：2025 年 9 月 4 日 9:15—15:00 期间 的任意时间。 5、会议召集人：公司董事会 6、会议主持人：公司董事长任志军先生 7、本次会议的召集、召开符合有关法律、行政法规、部门规 ...

北京市中伦律师事务所 关于新恒汇电子股份有限公司 2025 年第二次临时股东大会的法律意见书 致：新恒汇电子股份有限公司 北京市中伦律师事务所（以下简称"本所"）接受新恒汇电子股份有限公司（以 下简称"公司"）的委托，就公司 2025 年第二次临时股东大会（以下简称"本次会 议"）相关事宜，根据《中华人民共和国公司法》《中华人民共和国证券法》《上 市公司股东会规则》《深圳证券交易所创业板股票上市规则》等法律、法规和规 范性文件及现行有效的《新恒汇电子股份有限公司章程》（以下简称"《公司章 程》"），依法出具本法律意见书。 本法律意见书仅就本次会议的召集和召开程序、出席会议人员资格、召集人 资格、本次会议表决程序及表决结果等事项发表法律意见，并不对本次大会所审 议议案的内容以及前述议案所表述的事实或数据的真实性和准确性发表意见。本 所律师并假定：公司提交给本所律师的所有资料（包括但不限于有关人员的居民 身份证、授权委托书、营业执照、股东名册、网络投票结果等）均真实、准确、 完整；该等资料上的签字、印鉴均系真实，签署人均具有完全的民事行为能力， 且其签署行为已获得恰当、有效的授权或履行了必要的法定程序；该等资料的 ...

Group 1 - The core viewpoint of the news highlights the recent performance of Xin Heng Hui, which saw a decline of 6.40% in stock price on August 29, with a trading volume of 821 million yuan [1] - On August 29, Xin Heng Hui had a financing buy-in amount of 91.73 million yuan and a financing repayment of 100 million yuan, resulting in a net financing buy of -8.46 million yuan [1] - As of August 29, the total balance of margin trading for Xin Heng Hui was 428 million yuan, accounting for 10.45% of its circulating market value [1] Group 2 - As of June 30, the number of shareholders for Xin Heng Hui was 37,300, a decrease of 30.05% compared to the previous period [2] - The average circulating shares per person increased by 42.96% to 1,219 shares [2] - For the first half of 2025, Xin Heng Hui reported an operating income of 474 million yuan, representing a year-on-year growth of 14.51%, while the net profit attributable to shareholders decreased by 11.94% to 88.95 million yuan [2]