证券之星消息，8月14日半导体板块较上一交易日上涨1.06%，龙图光罩领涨。当日上证指数报收于 3666.44，下跌0.46%。深证成指报收于11451.43，下跌0.87%。半导体板块个股涨跌见下表： | 代码 | 名称 | 收盘价 | 涨跌幅 | 成交量(手) | 成交额(元) | | | --- | --- | --- | --- | --- | --- | --- | | 688721 | 龙图光罩 | 53.72 | 12.98% | 12.93万 | | 7.12亿 | | 688256 | 寒武纪 | 949.00 | 10.35% | 15.07万 | | 140.35 Z | | 688041 | 海光信息 | 152.49 | 8.83% | 78.90万 | | 120.20亿 | | 688110 | 东芯股份 | 93.25 | 4.58% | 39.86万 | | 37.14亿 | | 688591 | 泰凌微 | 52.40 | 4.26% | 18.81万 | | 9.97亿 | | 688347 | 表可公司 | 70.50 | 3.62% | 28.94万 | | 20.3 ...

Group 1 - The company has not established factories overseas and does not have a branch in the Greater Bay Area [1] - The company is currently focusing on its business layout in artificial intelligence [1] - The company expressed gratitude for investor interest in its future business breakthroughs [1]

Group 1 - The company, Xinhenghui Electronics Co., Ltd., is set to hold its online roadshow for its initial public offering on June 10, 2023, on the P5W platform [1] - Key executives from the company, including Chairman Ren Zhijun and CFO Wu Zhongtang, will participate in the roadshow alongside representatives from the lead underwriter, Founder Securities [2] - Xinhenghui specializes in integrated circuit solutions, focusing on chip packaging materials, and has established itself as a national high-tech enterprise and a "little giant" in the industry [2][3] Group 2 - The company has a significant market share of approximately 30% in the smart card business, ranking second globally, with applications in communications, finance, transportation, and identity verification [2] - In the etching lead frame business, the company has developed core technologies such as laser direct imaging and continuous etching, leading to improved product yield and increased capacity [3] - The IoT eSIM chip packaging sector is emerging as a new revenue growth point for the company, leveraging its advantages in traditional SIM card packaging [3] Group 3 - The company is committed to independent research and product innovation, with established laboratories and a high-level R&D team, holding over 120 patents and software copyrights [3] - Future strategies include increasing investment in core technology research, enhancing the R&D system, and expanding product varieties and applications [4] - The company aims to become a leading enterprise in the global integrated circuit packaging materials sector through collaboration with top global partners [4]

此外，由于激光直接成像曝光工艺省去了传统制作工艺需要制作电路曝光掩膜版的环节，将新品导入周 期从传统的8~10周时间，缩短到2~4周，显著节省了客户开发新品的周期与成本，具有明显的客户吸引 力。公司目标是在稳定工艺与提高产品品质的同时，计划用三年的时间提高蚀刻引线框架产能，致力于 成为全球主流的蚀刻金属引线框架供应商。（全景网） 更多精彩请点击：https://rs.p5w.net/html/147882.shtml 新恒汇（301678）首次公开发行股票并在创业板上市网上路演6月10日成功举行。新恒汇董事长任志军 在回答投资者提问时表示，蚀刻金属引线框架是集成电路封装的关键材料，近年来集成电路封测市场对 蚀刻金属引线框架的需求量在逐年增大。目前蚀刻引线框架的主要供应商还集中在日本、韩国、中国香 港等地区，国内大陆地区自给率较低。公司在技术工艺方面采用独特的激光直接成像曝光技术，生产工 艺不同于传统厂家，可以有效提升产品良率，因此在成本方面有较大的潜力与竞争优势。 ...

Group 1 - The core viewpoint of the article is that Xinhenghui (301678) successfully held an online roadshow for its initial public offering (IPO) and listing on the ChiNext board on June 10 [1] - The company introduced new products and services in the field of IoT eSIM chip packaging, including IoT QFN/DFN packaging and MP2 packaging, to meet the needs of downstream IoT customers [1]

Group 1 - The core viewpoint of the article highlights the successful online roadshow for the initial public offering of Xinhenghui (301678) on June 10, which indicates strong investor interest and market confidence [1] - According to statistics from Eurosmart, the global smart card shipment volume has remained stable at around 9.5 billion units in recent years, with SIM cards accounting for approximately 4.5 billion units, banking chip cards for about 3.3 billion units, and ID and industry application cards for around 1.5 billion units [1] - By the end of 2024, the market share of the company's core packaging material, flexible lead frames for smart cards, is projected to reach 32%, while the market share for smart card module products is expected to be around 13% [1]

更多精彩请点击：https://rs.p5w.net/html/147882.shtml 新恒汇（301678）首次公开发行股票并在创业板上市网上路演6月10日成功举行。方正证券承销保荐有 限责任公司保荐代表人侯传凯在回答投资者提问时表示，公司坚持自主研发，并针对不同的业务板块制 定不同的研发方向和策略。针对智能卡业务，鉴于该业务相关的生产工艺与技术已经基本成熟，行业内 主要厂商的产品在性能与品质方面趋于同质化，因此公司主要致力于保证产品质量和性能的同时，通过 开发新工艺或新技术、采用新材料不断降低产品成本；针对蚀刻引线框架和物联网eSIM芯片封测两项 新业务，公司主要致力于开发新技术、新工艺和新产品，提升生产效率和产品品质、拓展产品品类。 （全景网） ...

Core Viewpoint - The company Xin Heng Hui is positioning itself as a leading player in the integrated circuit packaging materials sector, leveraging its technological innovations and commitment to quality service in the global market [1][2]. Company Overview - Xin Heng Hui is an integrated circuit enterprise that focuses on the research, production, sales, and testing services of chip packaging materials. Its main business areas include smart card operations, etching lead frame business, and IoT eSIM chip testing services [1]. - The company has developed over 120 patents and software copyrights and has established national standards for integrated circuit card packaging frameworks [1]. IPO Details - The company successfully held an online roadshow for its initial public offering (IPO) on June 10, with key executives participating alongside representatives from the underwriting firm, Founder Securities [1]. - Xin Heng Hui plans to issue 59.888867 million new shares, accounting for 25% of the total shares post-IPO, with an offering price of 12.80 yuan per share. The subscription date is set for June 11, and payment is due by June 13 [3]. Fund Utilization - The funds raised from the IPO will primarily be allocated to the industrialization upgrade of packaging materials and the construction of a research and development center. This is expected to enhance the company's global competitiveness and facilitate a transition towards intelligent services [3].

8月12日，新恒汇今日收盘88.69元，上涨1.09%，滚动市盈率PE（当前股价与前四季度每股收益总和的 比值）达到114.98倍，总市值212.46亿元。 资金流向方面，8月12日，新恒汇主力资金净流入2498.41万元，近5日总体呈流出状态，5日共流出 30290.64万元。 作者：行情君 序号股票简称PE(TTM)PE(静)市净率总市值(元)13新恒汇114.98114.2516.71212.46亿行业平均 106.81119.0611.08305.18亿行业中值71.6773.834.73130.30亿1扬杰科技28.5431.183.46312.53亿2新洁能 31.7632.363.46140.63亿3天德钰32.7438.874.74106.84亿4盛剑科技34.0734.532.4541.40亿5晶晨股份 34.3836.924.55303.45亿6聚辰股份34.8040.605.09117.86亿7华海清科35.7236.815.60376.73亿8盛美上海 36.0843.996.16507.26亿9长电科技37.4439.022.26628.08亿10江丰电子37.5146.643.99 ...

天眼查商业履历信息显示，新恒汇电子股份有限公司，成立于2017年，位于淄博市，是一家以从事计算 机、通信和其他电子设备制造业为主的企业。企业注册资本17966.66万人民币，实缴资本16666.66万人 民币。公司法定代表人为任志军。 通过天眼查大数据分析，新恒汇电子股份有限公司共对外投资了1家企业，参与招投标项目41次，知识 产权方面有商标信息5条，专利信息108条，此外企业还拥有行政许可107个。 来源：金融界 新恒汇最新一期业绩显示，截至2025一季报，公司营业总收入2.41亿元、同比增长24.71%，归属净利润 5131.65万元，同比减少2.26%，扣非净利润4924.13万元，同比增长9.48%，流动比率6.724、速动比率 5.892、资产负债率11.36%。 金融界消息 截至2025年8月12日收盘，新恒汇（301678）报收于88.69元，上涨1.09%，换手率30.94%， 成交量14.08万手，成交金额12.85亿元。 资金流向方面，今日主力资金净流入2498.41万元，占比成交额1.94%。其中，超大单净流入3474.13万 元、占成交额2.7%，大单净流出975.72万元、占成交额0 ...