国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 10月23日消息，据台媒报道，随着技术节点进一步微缩 1.4 纳米（A14）及 1 纳米 （A10），台积电面临新的制造瓶颈， 该公司决定放弃采购单价高达 4 亿美元的 ASML 高 数值孔径（High-NA）EUV 光刻机。 理论上，采购荷兰 ASML 公司尖端的高数值孔径（High-NA）EUV 光刻机是解决该问题的 直接方案。然而，最新报道指出，台积电并未选择采购， 而是决定采用"光掩模护膜"技术作 为替代方案，以推进其 2 纳米等先进制程的研发与生产。 | | 光罩護膜(Pellicle)概況 | | --- | --- | | 重點 | 說明 | | 主要功能 | 保護光罩免受塵埃污染,使塵粒離焦不影響晶片成像,提升良 率與使用量命 | | 主要材料 | ●DUV 採氟聚合物(CYTOP):EUV 採超薄矽氮化物(SiNx)、碳 膜或行毒烯 | | | ·EUV 因吸收率高,需極薄、高透光材質 | | 關鍵性能指標 | 透光率、膜厚控制、熱穩定性、機械強度、缺陷密度、可穿透 梗測 | | ...

IT之家 10 月 23 日消息，特斯拉公司首席执行官埃隆・马斯克表示，三星电子正在更多地参与制造这家汽车制造商的芯片，表明这家韩国企业正逐步进入原 本由台积电主导的市场。 特斯拉依赖这些人工智能芯片来驱动其自动驾驶汽车功能以及尚处于初期阶段的人形机器人产品线。该公司将这些自研芯片与英伟达公司生产的领先 AI 计 算处理器结合使用。 马斯克还表示，特斯拉正在努力实现"超额生产"，任何未用于汽车或机器人的芯片都可以用于其公司的数据中心。 在特斯拉第三季度的投资者电话会议上，马斯克透露，三星将与台积电共同承担特斯拉当前一代人工智能芯片 AI5 的制造任务。此前，他曾表示该芯片将 由全球最大的定制化半导体代工企业台积电（TSMC）独家生产。 "我需要澄清一下我此前公开言论中的一些内容：实际上，我们最初将同时依托台积电和三星来生产 AI5 芯片，"马斯克表示。 今年 7 月，马斯克曾表示特斯拉将委托三星生产下一代 AI6 芯片。双方签署了一项价值 165 亿美元（IT之家注：现汇率约合 1170.74 亿元人民币）的协议， 被视为三星代工业务的重大胜利，该业务专门为客户代为制造芯片。 当时，马斯克表示，三星已在生产上 ...

Core Insights - Tesla is deepening its collaboration with Samsung Electronics, with Samsung now sharing the production of Tesla's current AI chip, AI5, alongside TSMC, which marks a shift from previous statements by CEO Elon Musk [1][2] - The dual-supplier strategy aims to ensure "overproduction" of AI5 chips, allowing any surplus to be utilized in Tesla's data centers [3] - Tesla emphasizes a complementary relationship with NVIDIA, stating that it does not intend to replace NVIDIA's processors but rather to combine its own chips with NVIDIA's GPUs for different tasks [4][6] Group 1: Collaboration and Production Strategy - Tesla's partnership with Samsung signifies a significant victory for Samsung in the chip foundry market, as it expands its role in Tesla's product roadmap [1][2] - The AI5 chips will be produced at both Samsung's Texas facility and TSMC's Arizona facility, ensuring redundancy and flexibility in supply [3] - This proactive approach reflects Tesla's risk management strategy in the face of global semiconductor supply chain uncertainties [3] Group 2: Chip Development and Efficiency - Tesla's self-developed chips are designed for "extreme simplicity," allowing for optimization in efficiency and cost due to the absence of components needed for other clients [5][6] - The company claims that its chips could achieve a performance-to-cost ratio that is potentially ten times better than competitors [5][6] - Tesla currently possesses computing power equivalent to 81,000 NVIDIA H100 chips, showcasing its significant investment in in-house chip development [4]

来 源： 内容来自工商时报 较新的 2 纳米制程可以继续利用台积电现有的 EUV 光刻机进行量产，并提高良率。但随着这家台湾 半导体巨头向 1.4 纳米和 1 纳米（也称为 A14 和 A10）等 2 纳米以下节点迈进，它将面临制造方面 的障碍。现在，通过购买 ASML 先进的高数值孔径 EUV 光刻机可以轻松解决这个问题，但一份新 报告指出，台积电将不再购买 ASML 光刻机，而是转向光掩模薄膜。 2纳米晶圆预计将于2025年底全面投产，之后台积电将最终过渡到1.4纳米节点。该公司已为 迈向先 进制程奠定了基础，预计将于2028年左右开始量产。台积电初期投资高达1.5万亿新台币（约合490 亿美元），目前正以闪电般的速度推进，在新竹工厂启动1.4纳米制程的研发，并购置了30台EUV光 刻机。 然而，台积电拒绝采取的一项举措是购买ASML高数值孔径EUV光刻机，单台售价4亿美元。然而， 这台设备将确保以更高的良率可靠地生产1.4纳米和1纳米晶圆。该公司可能认为，这台设备的价值与 其实际价值不符，因此，据Dan Nystedt和《商业时报》报道，台积电正在转向光掩模防护膜。亚2纳 米工艺必须使用防护膜，以防止灰 ...

特斯拉CEO马斯克今日在电话会议上透露，台积电、三星将参与特斯拉人工智能5号芯片（AI 5）的设 计工作。"我们不会取代英伟达"。AI5芯片被用来驱动自动驾驶及机器人产品线。此前他曾表示，AI5芯 片性能是AI4的40倍，算力提升8倍，内存增加9倍。（一财科技） 微信编辑 | 龙王 ...

（文章来源：第一财经） 特斯拉CEO马斯克今日在电话会议上透露，台积电、三星将参与特斯拉人工智能5号芯片（AI 5）的设 计工作。"我们不会取代英伟达"。AI5芯片被用来驱动自动驾驶及机器人产品线。此前他曾表示，AI5芯 片性能是AI4的40倍，算力提升8倍，内存增加9倍。 ...

Core Insights - Tesla's CEO Elon Musk announced that Samsung Electronics will play a larger role in the production of Tesla's automotive chips, indicating Samsung's entry into a market previously dominated by TSMC [1] - Musk clarified that both TSMC and Samsung will focus on the AI5 chip project, which is Tesla's current generation artificial intelligence chip [1] Group 1 - Samsung is set to share manufacturing responsibilities for Tesla's AI5 chip, expanding its involvement in the automotive semiconductor market [1] - The AI5 chip was initially expected to be produced solely by TSMC, highlighting a shift in Tesla's supply chain strategy [1] - Musk emphasized the importance of collaboration between TSMC and Samsung for the AI5 project during the third-quarter earnings call [1]

Group 1 - The article discusses the evolution of semiconductor processes, highlighting the dual-track competition between advanced and mature processes, with significant implications for global technology competition [2][3]. - The price of chips generally increases as the process node decreases, with current 3nm chips priced around 20,000 yuan per piece, expected to rise to over 30,000 yuan for 2nm chips by 2026 [5][6]. - Different companies adopt varied strategies regarding process technology, with Apple focusing on a gradual transition, Nvidia prioritizing cost-performance balance, and Qualcomm and MediaTek actively pursuing next-generation processes [7][8]. Group 2 - TSMC plays a crucial role in defining industry trends, with projected 3nm chip production reaching 200,000 pieces next year and 2nm production lines entering risk production soon [9][10]. - The investment required for advanced production lines is substantial, with a 2nm line costing around $10 billion, significantly higher than previous nodes [11]. - Key technological challenges include advancements in lithography, architecture transitions, and design-technology co-optimization (DTCO), which are essential for the successful implementation of advanced processes [12][13]. Group 3 - The global semiconductor landscape shows TSMC leading, while Samsung and Intel face distinct challenges, such as Samsung's aggressive equipment procurement strategy leading to higher costs and Intel's financial struggles impacting its advanced process ambitions [18][21]. - The equipment market is competitive, particularly in the etching sector, where Lam Research and Tokyo Electron dominate, with Tokyo Electron having a unique advantage with its clean track equipment [22][23]. Group 4 - The competition in semiconductors is characterized by a dual-track system, with advanced processes led by TSMC and Samsung, while mature processes (28nm and above) present opportunities and challenges for Chinese manufacturers [24][25]. - Chinese companies like SMIC have made significant progress in mature processes, achieving a 95% yield in 28nm technology, but still face challenges such as higher production costs and reliance on foreign equipment [25][26]. - The future of semiconductor technology is expected to continue evolving, with advancements below 2nm anticipated, driven by innovations in materials and processes [27][28].

Group 1 - U.S. chip stocks experienced a broad decline on Wednesday, with Intel (INTC.US) and AMD (AMD.US) dropping over 4% [1] - Micron Technology (MU.US) fell by more than 3%, while TSMC (TSM.US) and NVIDIA (NVDA.US) saw declines of over 1% [1]

以下文章来源于36氪财经 ，作者范亮 张帆 36氪财经 . 36氪旗下官方账号。洞见市场，比99%的投资者更聪明。 市场低估了台积电的长期风险。 文 ｜ 范亮 编辑 ｜ 张帆 来源｜ 36氪财经（ID:krfinance） 封面来源 ｜ IC Photo 2025年以来，在算力芯片利好频出、iPhone 17销量预期增加、2纳米制程量产开启三重利好叠加之下，台积电股价持续突破新高，年内累计涨幅超50%，市 值更是突破1.5万亿美元大关。 最大的助力来自于业绩的强劲增长。最新的财报数据显示，2025年三季度，台积电营收增速同比增长30.3%，超过彭博一致预期2.8个百分点，净利率为 45.7%，超过彭博一致预期3.6个百分点，对应净利润金额则超过彭博一致预期10%。 但2025年，情况出现了边际变化，一是英特尔对标台积电2nm工艺的18A工艺，将在2025年下半年启动量产；二是美国政府有意扶持英特尔的芯片代工业 务。 那么，英特尔是否能对台积电产生威胁，市场是否忽略了台积电的同业竞争风险？ 但股价高歌猛进之下，市场似乎选择性地忽略了台积电的一个潜在的长期风险，即英特尔的冲击。 此前《 特朗普"国有化"后，英特尔 ...