Core Viewpoint - The article emphasizes the rapid growth of the electronic materials industry in China, driven by advancements in artificial intelligence and the increasing demand for intelligent computing capabilities. It highlights the strategic importance of electronic materials in modern electronics and the necessity for continuous innovation in this sector [2][3]. Industry Overview - The electronic materials sector is crucial for the manufacturing of semiconductors, integrated circuits, optoelectronic devices, and new components, serving as the material foundation for modern electronics and technology [2]. - Electronic materials can be categorized into three main types: electronic functional materials, packaging and assembly materials, and process and auxiliary materials. China has developed self-sufficient capabilities in these areas, but still lags in some high-end fields compared to global leaders [2]. Policy Support - Multiple favorable policies have been issued at the national and local government levels to support the development of electronic materials. For instance, the Ministry of Industry and Information Technology released the "Action Plan for the Development of Basic Electronic Components Industry (2021-2023)" to promote the research and production of electronic materials [3]. - The National Development and Reform Commission has also included the development of key electronic chemicals and materials in its 2024 guidance, further setting a positive tone for innovation in the electronic materials sector [3]. Upcoming Forum - TrendBank, in collaboration with Yongjiang Laboratory, is organizing the "2025 Heterogeneous Integration Frontier Forum" from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies [3]. - The forum will feature various topics and presentations from industry experts, including a keynote speech by a researcher from the Chinese Academy of Sciences [3]. Event Details - The forum is expected to attract 300-500 participants and will include a range of activities such as keynote speeches, panel discussions, and networking opportunities [29]. - Early bird registration is available until October 31, with different pricing tiers for general attendees and students [30].

Core Points - The 2025 Heterogeneous Integration Frontier Forum will be held from November 17 to 19, 2025, in Ningbo, organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association [2][41]. - The forum aims to discuss advancements in heterogeneous integration technologies and their applications in various sectors, including micro-nano manufacturing and advanced packaging [20][41]. Event Details - The forum will take place at the Ningbo Pan Pacific Hotel, with an expected attendance of 300 to 500 participants [41]. - A verification line for information materials and micro-nano device preparation will also be inaugurated during the event [2]. Accommodation Information - Special hotel rates have been arranged for attendees at the Ningbo Pan Pacific Hotel, with prices ranging from 350 to 600 RMB per night depending on room type [6][10]. - Additional nearby hotels are suggested for accommodation, including the Ningbo Radisson and the Ningbo Yidong Howard Johnson Hotel [8][11]. Agenda Highlights - The forum will feature a series of keynote speeches, panel discussions, and specialized forums focusing on topics such as advanced packaging, micro LED technology, and optical chip innovations [14][36]. - Notable speakers include industry leaders and experts from various organizations, discussing trends, challenges, and technological advancements in the semiconductor and micro-nano sectors [20][31][38]. Registration and Fees - Registration for the forum is priced at 2500 RMB per person, with early bird discounts available for those who register before October 31 [42]. - Student discounts are also offered, allowing students to attend for 1500 RMB [42].

Core Viewpoint - The article discusses the upcoming "2025 Heterogeneous Integration Frontier Forum" organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association, focusing on advancements and challenges in heterogeneous integration technology within the semiconductor industry [2][31]. Group 1: Event Details - The forum will take place from November 17-19, 2025, at the Pan Pacific Hotel in Ningbo, with an expected attendance of 300-500 participants [31]. - The event aims to facilitate discussions among industry experts, academic institutions, and investment organizations regarding the current state and future trends of advanced packaging technologies [2][31]. Group 2: Participants and Speakers - Notable companies and professionals from various sectors, including Huawei, Longxin Storage, and the Chinese Academy of Sciences, are expected to participate, showcasing a diverse range of expertise [2][3]. - The forum will feature keynote speeches and panel discussions led by industry leaders and researchers, addressing critical topics such as micro-nano manufacturing technologies and advanced packaging integration [16][18]. Group 3: Forum Agenda - The agenda includes specialized forums on topics like heterogeneous integration, advanced packaging, and micro LED technology, with sessions dedicated to discussing the latest innovations and challenges in these fields [19][28]. - Specific sessions will cover advancements in chiplet technology, high-performance sensors, and the application of polymer materials in semiconductor packaging [16][18][29]. Group 4: Registration and Fees - Registration for the forum is available, with ticket prices set at RMB 2500 per person, offering various benefits such as access to conference materials and meals [32]. - Early bird discounts are available for those who register before October 31, with student discounts also offered [32].

Core Points - The 2025 Heterogeneous Integration Frontier Forum will be held from November 17-19, 2025, in Ningbo, organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association [2][41]. - The forum aims to discuss advancements in heterogeneous integration technologies and will feature various parallel sessions and keynote speeches from industry leaders and experts [20][41]. Event Details - The forum will take place at the Ningbo Pan Pacific Hotel, with an expected attendance of 300-500 participants [41]. - A verification line for information materials and micro-nano device preparation will also be inaugurated during the event [2]. Accommodation Information - Special hotel rates have been arranged for attendees at the Ningbo Pan Pacific Hotel, with prices ranging from 350 to 600 RMB per night depending on room type [6][10]. - Additional nearby hotels are suggested for accommodation, including the Ningbo Radisson and the Ningbo Yidong Howard Johnson [8][11]. Agenda Highlights - The forum will include a series of keynote speeches, panel discussions, and workshops focusing on topics such as micro-nano manufacturing, advanced packaging, and optical chip innovations [14][31]. - Notable sessions include discussions on the latest trends in 2.5D/3D chip stacking and the development of high-performance integrated sensors [25][30]. Registration and Fees - Registration for the forum is priced at 2500 RMB per person, with early bird discounts available for those who register before October 31 [42]. - Student discounts are also offered at a reduced rate of 1500 RMB [42].

Core Points - The 2025 Heterogeneous Integration Frontier Forum will be held from November 17 to 19, 2025, in Ningbo, organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association [2][41]. - The forum aims to discuss advancements in heterogeneous integration technologies and their applications in micro-nano manufacturing and semiconductor packaging [20][41]. Event Details - The forum will take place at the Ningbo Pan Pacific Hotel, with an expected attendance of 300 to 500 participants [41]. - A verification line for information materials and micro-nano device preparation will also be inaugurated during the event [2]. Accommodation Information - Special hotel rates have been arranged for attendees at the Ningbo Pan Pacific Hotel, with prices ranging from 350 to 600 RMB per night depending on room type [6][10]. - Additional nearby hotels include the Ningbo Radisson Hotel and the Ningbo Yidong Howard Johnson Hotel, with varying rates and availability [8][11]. Agenda Highlights - The forum will feature a series of keynote speeches, panel discussions, and workshops focusing on topics such as micro LED technology, advanced packaging, and the latest innovations in semiconductor manufacturing [19][36]. - Notable speakers include industry leaders and researchers from various institutions, discussing trends, challenges, and technological advancements in the field [20][30][36]. Registration and Fees - Registration for the forum is available at a fee of 2500 RMB per person, with early bird discounts and student rates offered [42]. - The registration includes access to conference materials, lunch, and a gala dinner on November 18 [42].

Core Viewpoint - The article discusses the upcoming "2025 Heterogeneous Integration Frontier Forum" organized by TrendBank and the Yongjiang Laboratory, focusing on advancements in semiconductor integration technology and its applications in the chip industry [2][27]. Event Overview - The forum will take place from November 17-19, 2025, at the Pan Pacific Hotel in Ningbo, Zhejiang [2][27]. - It aims to gather experts from academic institutions, industry groups, and investment firms to discuss challenges and breakthroughs in heterogeneous integration technology [2]. Agenda Highlights - The opening ceremony will feature speeches from government leaders and key stakeholders, including the CEO of TrendBank [8]. - Various parallel forums will cover topics such as advanced packaging, micro LED integration, and optical chip innovations [10][18][22]. - Notable presentations will include discussions on micro-nano manufacturing technologies, advanced packaging trends, and the latest developments in optical chip technology [11][15][23]. Participation Details - The forum expects to host between 300 to 500 participants, with different ticket options available, including early bird discounts [27][28]. - The ticket prices range from RMB 1,500 for students to RMB 2,500 for general attendees, excluding accommodation [28].

Core Viewpoint - The article discusses the upcoming Heterogeneous Integration Annual Conference organized by TrendBank and the Yongjiang Laboratory, focusing on the strategic opportunities in the new generation of chip development, particularly in heterogeneous integration technology [10][11]. Conference Overview - The conference will take place from November 17-19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo, with an expected attendance of 300-500 participants [11]. - The theme of the conference is "Focusing on the Frontier of Heterogeneous Integration Technology, Advancing the Journey of Advanced Packaging" [10][11]. Key Topics and Sessions - The conference will cover various advanced packaging technologies, including 2.5D/3D heterogeneous integration, optoelectronic co-packaging, wafer-level bonding, and glass-based packaging [11]. - Notable sessions will include discussions on the challenges and opportunities in heterogeneous integration technology, advanced packaging trends, and the impact of AI on semiconductor manufacturing [4][6][9]. Strategic Importance - Ningbo is highlighted as a core port city with a strong foundation in advanced manufacturing, making it an ideal location for this conference aimed at enhancing the electronic information industry in the Yangtze River Delta region [9][10]. - The Yongjiang Laboratory is recognized as a provincial-level laboratory approved by the Zhejiang provincial government, focusing on electronic information materials and micro-nano device preparation [9][11]. Participation and Registration - The conference offers various ticket options, including early bird discounts for registrations completed by October 31, 2025 [13]. - Participants will have access to conference materials, lunch, and a banquet on November 18 [13].

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 重要会议： 11 月 17-19 日，2025势银异质异构集成年会（浙江·宁波） 点此报名 添加文末微信，加 异质异构集成产业 群 随着高性能计算、光通信以及传感器行业技术与市场需求快速扩张，异构集成技术正在加速迭代，从 2D异构集成到2.5D芯粒集成，再到3D堆叠 集成，并向3.5D系统集成拓展，索尼、台积电、三星、英特尔以及AMD等芯片大厂都在竞相开发异构集成工艺。 同时，会中设置了混合键合相关议题，且目前已有 青禾晶元、芯慧联芯、 迈为科技、拓荆键科、 EVG Group 五家混合键合相关企业确认出席本次大 会并将发表相关演讲。 母凤文 青禾晶元半导体科技(集团) 有限责任公司 创始人兼董事长 演讲主题: 先进封装时代的半导体混合键合集 成技术 2025异质异构集成年会 ◎ 浙江·宁波 扫描二维码报名 左右滑动查看更多 会 议 日 程 在 2D异构集成路线中，倒装芯粒直接并排键合至RDL/有机IC载板封装，通过回流焊工艺，C4 Bump间距在150～110μm，随着集成技术精进， 通过热压键合及毛细填充工艺，C4 Bum ...

Core Viewpoint - The establishment of testing standards for extreme ultraviolet (EUV) photoresists is crucial for the development of China's semiconductor industry, particularly as the country aims for self-sufficiency in advanced chip manufacturing [2][3]. Group 1: Standards and Testing Methods - The National Standardization Administration has announced three key standards related to photoresists, including methods for testing EUV photoresists, which are essential for semiconductor manufacturing at nodes of 3 nm and below [2][3]. - The EUV photoresist testing standard will systematically integrate material characteristics and performance parameters, focusing on critical performance indicators such as purity, etch resistance, line edge roughness, and sensitivity [3]. Group 2: Industry Implications - The development of these standards is significant as China's current domestic production rate of EUV photoresists is nearly zero, and the R&D efforts are still in the early stages [3]. - Establishing a unified testing methodology will not only fill the technical standard gap in the EUV photoresist field but also provide an objective benchmark for performance evaluation, promoting innovation in the domestic photoresist industry [3]. Group 3: Upcoming Events - TrendBank is organizing the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [4][5].

Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and the Yongjiang Laboratory, focusing on the strategic opportunities in the new generation of chip development and the importance of heterogeneous integration technology in the semiconductor industry [10][12]. Event Details - The conference will take place from November 17 to 19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo, aiming to create a high ground for advanced electronic information industry in Ningbo and the Yangtze River Delta region [10][13]. - The event will feature a series of discussions and presentations on cutting-edge topics related to heterogeneous integration and advanced packaging technologies [12][13]. Conference Agenda - The agenda includes a closed-door meeting on heterogeneous integration, government speeches, and various technical discussions on topics such as advanced packaging trends, optical chip innovations, and the challenges of heterogeneous integration technology [3][5][6]. - Notable speakers include experts from various organizations, including Alibaba Cloud, COMSOL, and Zhejiang University, discussing topics like optical interconnect solutions and advanced semiconductor manufacturing techniques [5][6][10]. Industry Context - The conference is positioned against the backdrop of increasing demands for chip performance, power consumption, and cost efficiency driven by applications in artificial intelligence and high-performance computing [10]. - Heterogeneous integration is highlighted as a crucial direction for the semiconductor industry, especially in the context of 2.5D/3D integration and optical-electrical co-packaging [10][12]. Participation and Costs - The conference is expected to attract 300-500 participants, with registration fees set at RMB 2500 per person, offering early bird discounts and student rates [13][14].