【华西中小盘】官媒点名SiC，下游需求急速增长 2.1人民日报报道，数据中心变压器爆单至27年，点名使用SiC有望成为变压器未来重要趋势。 利空出尽，行业迎来反转 11.21台达电子宣布称，美团的数据中心采用了他们搭载了SiC技术的固态变压器（SST）。 近期各家SiC企业发布25年业绩预期，市场误读认为行业继续下行，叠加科技情绪不佳，市场表现下 【华西中小盘】官媒点名SiC，下游需求急速增长 2.1人民日报报道，数据中心变压器爆单至27年，点名使用SiC有望成为变压器未来重要趋势。 11.21台达电子宣布称，美团的数据中心采用了他们搭载了SiC技术的固态变压器（SST）。 利空出尽，行业迎来反转 近期各家SiC企业发布25年业绩预期，市场误读认为行业继续下行，叠加科技情绪不佳，市场表现下行，但实际市 场交易的是未来需求的增量，属于错杀。 未来三大需求AI电力、先进封装、AR眼镜需求量有望是当前市场7倍以上。 如人民日报点名的AI电力领域，下游已经在加速扩产， ➠50亿投资的泗水8英寸碳化硅晶圆厂竣工 11月 ➠株洲8英寸碳化硅晶圆线量产（36万片） 1月 ➠8英寸碳化硅芯片生产线通线（72万片） 据以上不完 ...

【华西中小盘】官媒点名SiC，下游需求急速增长 2.1人民日报报道，数据中心变压器爆单至27年，点名使用SiC有望成为变压器未来重要趋势。 11.21台达电子宣布称，美团的数据中心采用了他们搭载了SiC技术的固态变压器（SST）。 利空出尽，行业迎来反转 近期各家SiC企业发布25年业绩预期，市场误读认为行业继续下行，叠加科技情绪不佳，市场表现下行， 【华西中小盘】官媒点名SiC，下游需求急速增长 2.1人民日报报道，数据中心变压器爆单至27年，点名使用SiC有望成为变压器未来重要趋势。 11.21台达电子宣布称，美团的数据中心采用了他们搭载了SiC技术的固态变压器（SST）。 利空出尽，行业迎来反转 10月 # 三菱电机 50亿投资的泗水8英寸碳化硅晶圆厂竣工 11月 # 安森美 获36亿补贴新建8英寸碳化硅工厂 12月 # 意法半导体 获83亿信贷建8英寸碳化硅工厂（72万片） # 时代电气 株洲8英寸碳化硅晶圆线量产（36万片） 近期各家SiC企业发布25年业绩预期，市场误读认为行业继续下行，叠加科技情绪不佳，市场表现下行，但实际市 场交易的是未来需求的增量，属于错杀。 未来三大需求AI电力、先进封装、 ...

证券日报网讯2月2日，沃格光电（603773）在互动平台回答投资者提问时表示，公司芯片用玻璃基板相 关技术处于行业领先水平，如TGV技术可实现最小孔径5μm、最大深宽比100：1，可加工玻璃厚度范围 0.05-1.1mm，且掌握"薄化、镀膜、TGV、精密镀铜、多层线路制作"全制程工艺，是全球少数具备全制 程产业化能力的企业之一。目前芯片用玻璃基板产品正稳步推进客户验证，全资子公司湖北通格微的 1.6T光模块玻璃基载板已完成小批量送样。公司推出的全玻璃堆叠结构(GCP)方案，已与北极雄芯等战 略合作伙伴进入产品方案确定和联合开发阶段。产能方面，公司已建成首条年产10万平米TVG产线并 实现小批量供货，成都沃格8.6代线预计2026年量产，达产后月产能预计可达2.4万片，将为业务放量提 供坚实支撑。随着玻璃基板在AI大算力芯片、高速光通信(CPO)、先进封装等领域的加速应用，公司技 术与产能优势有望持续转化为业绩增量，具体经营数据请以公司后续披露的定期报告为准。 ...

Core Insights - The report indicates that after a period of volatility, the market is expected to regain momentum in February, supported by a decrease in the volatility index from a peak of 102 to around 32, which is historically low [2][3] - The report emphasizes the importance of focusing on two main investment themes: technology growth and cyclical recovery, as funds are likely to rotate towards underperforming sectors [3][4] Investment Themes - **Technology Growth**: The AI industry is experiencing significant positive changes, with expectations for OAI listings and advancements in storage, CPU, and packaging sectors. The report highlights the importance of monitoring policy catalysts and industry developments, particularly in emerging sectors like aerospace, new materials, and quantum technology [6][6] - **Cyclical Recovery**: The report suggests that sectors such as chemicals, real estate, and core consumer assets are expected to see a rebound as market sentiment improves. The report notes that these sectors are currently at low points in their economic cycles, with potential for recovery as institutional positions are historically low [6][6] Recommended Stocks - **Jingsheng Electromechanical (300316.SZ)**: The company is positioned to benefit from increasing demand in space and overseas photovoltaic equipment, with a market cap of 58.3 billion and projected EPS growth from 0.95 in 2026 to 1.17 in 2027 [7][7] - **Nuwai Co., Ltd. (603699.SH)**: As a leading industrial valve manufacturer, the company is expected to see growth driven by LNG and marine vessel demand, with a projected EPS increase from 2.51 in 2026 to 3.00 in 2027 [7][7] - **Longjing Environmental Protection (600388.SH)**: The company is focusing on green electricity and energy storage, with a projected EPS growth from 1.20 in 2026 to 1.37 in 2027 [7][7] - **Chip Microelectronics (688630.SH)**: The company anticipates significant profit growth, with EPS expected to rise from 4.18 in 2026 to 6.08 in 2027 [7][7] - **AVIC High-Tech (600862.SH)**: The company is expected to benefit from the increasing demand for aerospace materials, with projected EPS growth from 1.17 in 2026 to 1.29 in 2027 [7][7] - **Ping An Insurance (601318.SH)**: The company is projected to maintain strong growth in new business value (NBV), with EPS expected to rise from 8.59 in 2026 to 9.74 in 2027 [7][7] - **Rabbit Baby (002043.SZ)**: The company is expected to see steady growth in the decorative board industry, with projected EPS growth from 1.05 in 2026 to 1.15 in 2027 [7][7] - **Wanhua Chemical (600309.SH)**: The company is expected to benefit from improving MDI and TDI market conditions, with projected EPS growth from 5.13 in 2026 to 5.79 in 2027 [7][7] - **Tianfu Communication (300394.SZ)**: The company is positioned to benefit from the demand for optical modules, with projected EPS growth from 4.10 in 2026 to 5.38 in 2027 [7][7] - **Shaanxi Tourism (603402.SH)**: The company is expected to see growth driven by its core tourism operations, with projected EPS growth from 6.65 in 2026 to 7.61 in 2027 [7][7]

证券研究报告：电子 | 公司点评报告 股票投资评级 买入 |维持 个股表现 2025-02 2025-04 2025-06 2025-09 2025-11 2026-01 -21% -9% 3% 15% 27% 39% 51% 63% 75% 87% 通富微电 电子 资料来源：聚源，中邮证券研究所 公司基本情况 | 最新收盘价（元） | 52.06 | | --- | --- | | 总股本/流通股本（亿股）15.18 | / 15.17 | | 总市值/流通市值（亿元）790 | / 790 | | 52 周内最高/最低价 | 56.34 / 22.78 | | 资产负债率(%) | 60.1% | | 市盈率 | 115.69 | | 第一大股东 | 南通华达微电子集团股 | | 份有限公司 | | 研究所 分析师:吴文吉 SAC 登记编号:S1340523050004 Email:wuwenji@cnpsec.com 分析师:翟一梦 SAC 登记编号:S1340525040003 Email:zhaiyimeng@cnpsec.com 通富微电(002156) 拟定增加码先进封装 l 投资要点 中高端产 ...

Core Insights - TSMC's advanced process capacity competition has officially begun, with global tech giants accelerating their entry into the 2nm process node, which is fully booked, highlighting the ongoing pressure on the semiconductor supply chain due to the combined demand for AI and mobile chips [1][2] - Nvidia's CEO Jensen Huang emphasized the urgent need for TSMC to operate at full capacity, confirming the industry's concerns about the tight supply of 2nm capacity [1] - Apple has secured over half of the initial 2nm capacity, with Qualcomm also being a major customer for 2026, while AMD plans to start 2nm CPU production in 2026 [1][2] Group 1: Capacity and Demand - The 2nm and 3nm process nodes at TSMC are facing capacity constraints, with high-performance computing and mobile chips competing for limited supply [2] - The 2nm family is expected to become a long-lifecycle node, with initial capacity ramp-up potentially exceeding that of the 3nm generation [2] - TSMC's CoWoS monthly capacity is projected to grow over 70% year-on-year by 2026, but this growth may still fall short of market demand [4] Group 2: Technological Developments - Nvidia plans to skip the 2nm process and move directly to the 1.6nm node, focusing on the A16 process, which features backside power delivery technology [3] - The A16 process is designed for high-performance computing products, improving signal integrity and power transmission efficiency, which is critical for large AI accelerators [3] - TSMC is upgrading its advanced packaging ecosystem to meet the demands of AI chips, which are increasingly adopting chiplet architectures and larger package sizes [4] Group 3: Challenges in Advanced Packaging - The supply-demand imbalance is a significant bottleneck, with challenges in improving the yield of large-scale system-level packaging [4] - As the packaging size of AI chips continues to grow, maintaining high yield rates has become increasingly difficult, potentially further constraining the supply capacity of advanced chips [4]

❖ 评论： 证 券 研 究 报 告 KLA（KLAC）FY26Q2 业绩点评及业绩说明会纪要 CY2025 营收创新高，2026 年锁定 WFE 份额 提升+先进封装双轮驱动 ❖ 事项： 2026 年 1 月 30 日 KLA 发布 FY26Q2 报告，并召开业绩说明会。公司财务季 度 FY26Q2 截至 2025 年 12 月 31 日，即自然季度 CY2025Q4。CY25Q4，公司 实现营收 32.97 亿美元，同比增长 7%，环比增长 3%；Non-GAAP 毛利率 62.6%。 CY 2025 全年，公司实现营收 127.4 亿美元，同比增长 17%。Non-GAAP 毛利 率 62.8%。 1. 业绩情况：CY2025Q4（FY2026Q2），KLA 实现营收 32.97 亿美元，同比增 长 7%，环比增长 3%，高于指导范围中值（32.25±1.5 亿美元）。Non-GAAP 毛 利率 62.6%，高于指导范围中值（62%±1pct），主要受益于服务业务表现超预 期及制造效率提升。 CY2025 全年，KLA 实现营收 127.4 亿美元，同比增长 17%。Non-GAAP 毛利 率 62.8% ...

Group 1 - The article emphasizes the importance of timely and professional information interpretation in investment decision-making [1] - It highlights the focus on uncovering investment value from significant events, analyzing industry chain companies, and interpreting key policies [1] - The product aims to provide users with quick information that serves as an investment reference for market impacts [1] Group 2 - The company has developed TGV laser micro-hole equipment that covers both wafer-level and panel-level packaging, and has shipped glass substrate through-hole equipment [1] - This technology has been applied to perovskite batteries and components, indicating a diversification into renewable energy solutions [1] - Additionally, the company has launched high-power SOFC (Solid Oxide Fuel Cell) power generation products to meet the surging power demands of AI data centers, establishing partnerships with leading enterprises [1]

Core Viewpoint - KLA Corporation (NASDAQ: KLAC) reported strong financial results for FY26Q2 (CY25Q4), with revenue of $3.297 billion, a year-over-year increase of 7.15% and a quarter-over-quarter increase of 2.71%, indicating a solid performance in the semiconductor process control market [2][11]. Financial Performance - The company achieved a record annual revenue of $12.745 billion for 2025, representing a 17% growth compared to 2024, with 70% of this growth driven by investments in advanced logic, high bandwidth memory (HBM), and DRAM [2][12]. - The gross margin for Q4 was 62.6%, up 0.9 percentage points year-over-year and 0.1 percentage points quarter-over-quarter, exceeding the guidance midpoint of 62% [2][11]. - Free cash flow reached $4.4 billion for 2025, a 30% increase year-over-year, with $3 billion returned to shareholders through dividends and stock buybacks [11]. Segment Performance - Semiconductor process control revenue was $3.005 billion in Q4, up 9.07% year-over-year and 3.62% quarter-over-quarter, accounting for 91.1% of total revenue [3][8]. - Revenue from specialty semiconductor process decreased by 12.5% year-over-year but increased by 16.67% quarter-over-quarter, contributing 4.2% to total revenue [3][8]. - PCB and component inspection revenue was $152 million, down 5.59% year-over-year and down 20% quarter-over-quarter, representing 4.6% of total revenue [3][8]. Product Breakdown - Wafer inspection revenue was $1.573 billion, a slight increase of 1% year-over-year and 2% quarter-over-quarter, making up 47.7% of total revenue [9]. - Service revenue reached $786 million, up 18% year-over-year and 6% quarter-over-quarter, contributing 24% to total revenue [9]. - Revenue from advanced packaging grew significantly, with total system revenue for 2025 estimated at $950 million, reflecting over 70% year-over-year growth [12]. Market Outlook - For Q1 2026, KLA expects revenue of $3.35 billion, with a gross margin guidance of 60.75%-62.75%, indicating a slight decrease compared to the previous year due to rising DRAM costs [4][15]. - The WFE market is projected to grow at a high single-digit to low double-digit percentage, reaching approximately $120 billion, with the Chinese market expected to see moderate growth [5][14]. - The advanced packaging market is anticipated to grow to around $12 billion, with a similar growth rate, contributing to an overall market size of approximately $135 billion [5][14]. Regional Performance - Revenue from mainland China was $989 million, down 10.7% year-over-year and 21% quarter-over-quarter, accounting for 30% of total revenue [3][9]. - Taiwan's revenue was $857 million, down 3.9% year-over-year but up 6.8% quarter-over-quarter, representing 26% of total revenue [3][9]. - South Korea saw a revenue increase of 25% year-over-year and 59.8% quarter-over-quarter, contributing 14% to total revenue [3][9].

Core Viewpoint - The competition in the semiconductor lithography equipment market is intensifying, particularly in the back-end process, where Canon currently holds a dominant position. However, ASML is entering this market, posing a significant threat to Canon's market share [2][6]. Group 1: Market Dynamics - Canon entered the back-end lithography equipment market in 2011 and has nearly monopolized the sector used by semiconductor giants [2][6]. - ASML, the largest lithography equipment manufacturer, has begun to challenge Canon by launching equipment for the back-end process, which is increasingly important for enhancing the performance of advanced semiconductors [2][4]. - Nikon plans to start mass production of back-end lithography equipment by 2026, further intensifying competition in this space [2][6]. Group 2: Technological Advancements - ASML's new "XT:260" equipment reportedly has a production efficiency four times that of front-end lithography equipment and can handle thicker substrates, addressing issues related to substrate warping caused by multiple chip stacking [6]. - The demand for advanced packaging technology, which combines multiple chips like GPUs and memory, is growing, leading ASML to expand into this area [4][7]. - Canon's sales of lithography equipment are projected to reach 241 units by 2025, nearly doubling over five years, driven by the demand for back-end solutions [6]. Group 3: Industry Trends - The trend towards larger intermediate substrates is emerging, with a shift from 300mm round silicon wafers to larger square substrates to reduce waste [7]. - Companies like Panasonic are also entering the advanced packaging market, developing equipment for vertically stacked chips to meet AI semiconductor demands [7]. - The development direction for back-end technology remains unclear, requiring equipment manufacturers to be adept at capturing industry trends and demands [7].