（来源：天津日报） 为此，北京大学联合鹏城实验室、上海科技大学、国家信息光电子创新中心等研发团队，创出"光纤— 无线一体化融合通信"概念，并采用集成光学方案，成功研制出250GHz（千兆赫兹）以上超宽带集成光 子器件。在此基础上开发出的新系统实现了光纤通信单通道512Gbps（千兆比特每秒）信号传输、无线 通信单通道400Gbps信号传输。 "新系统破解'带宽鸿沟'，数据传输速率刷新目前已知的新纪录。"论文通讯作者、北京大学电子学院副 院长王兴军说，这一系统可支持光纤通信和无线通信双模式传输，显著提升了抗干扰能力。团队还模拟 了6G大规模用户接入场景，实现86个信道的多路实时8K视频接入演示，传输带宽较目前5G标准提升10 倍以上。 《自然》审稿人认为，这项工作"对融合光学和太赫兹通信系统的进步作出重要贡献"。 转自：天津日报 据新华社北京2月19日电（记者 魏梦佳）我国科学家近日在光通信和6G领域取得突破性进展，在国际上 率先实现光纤通信和无线通信系统间的跨网络融合，自主研发的"光纤—无线一体化融合通信系统"的数 据传输速率刷新纪录。该成果19日凌晨在线发表于《自然》。 AI数据中心算力提升和下一代无线通信 ...

#最新科技消息#【创三项世界纪录 ！#我国在6G和光通信领域取得新突破#】我国科学家团队在6G及光 通信领域取得突破性进展，在国际上首次实现光纤与无线通信系统间跨网络无缝融合。相关成果2月19 日发表于《自然》杂志。实验表明，该系统刷新了三项世界纪录：调制器带宽突破250GHz；一根光纤1 秒能传512Gbit数据；无线传输1秒能飙到400Gbit。该成果的所有关键技术和制备均基于全国产集成光 学工艺平台，助力我国在半导体芯片领域实现"换道超车"。（科技日报记者 赵卫华 马爱平） （来源：科技日报） ...

我国科学家在光通信及6G领域取得新进展 我国科学家近日在光通信和6G领域取得突破性进展，在国际上率先实现光纤通信和无线通信系统间的跨网络融合，自主研发的"光纤—无线一 体化融合通信系统"的数据传输速率刷新纪录。该成果2月19日凌晨在线发表于《自然》。 AI数据中心算力提升和下一代无线通信网络6G的蓬勃发展，要求在多样化场景满足信号的高速、低时延传输。然而，光纤通信与无线通信在 信号架构与硬件约束上存在"带宽鸿沟"。 为此，北京大学联合鹏城实验室、上海科技大学、国家信息光电子创新中心等研发团队，创出"光纤—无线一体化融合通信"概念，并采用集成 光学方案，成功研制出250GHz（千兆赫兹）以上超宽带集成光子器件。在此基础上开发出的新系统实现了光纤通信单通道512Gbps（千兆比特 每秒）信号传输、无线通信单通道400Gbps信号传输。 "新系统破解'带宽鸿沟'，数据传输速率刷新目前已知的新纪录。"论文通讯作者、北京大学电子学院副院长王兴军说，这一系统可支持光纤通 信和无线通信双模式传输，显著提升了抗干扰能力。团队还模拟了6G大规模用户接入场景，实现86个信道的多路实时8K视频接入演示，传输 带宽较目前5G标准提升 ...

Core Insights - Broadcom Inc. has launched BroadPeak™, a highly integrated radio digital front-end (DFE) SoC device aimed at enhancing 5G massive MIMO and remote radio head (RRH) applications, setting the stage for next-generation 5G Advanced and 6G wireless infrastructure [1][2] Product Features - BroadPeak features a 5nm CMOS DFE and ADC/DAC blocks on a single chip, achieving up to 40% power reduction compared to existing solutions for massive MIMO and RRHs [1] - The device operates across a frequency range from 400 MHz to 8.5 GHz, making it the first product to meet the technical requirements for both 5G Advanced and 6G standards [2][4] - It supports advanced functionalities such as digital predistortion, carrier aggregation, and gain control, with ADC/DAC sampling rates up to 19.6 GS/s [6] Industry Context - Massive MIMO technology is crucial for enhancing mobile network coverage, capacity, and user throughput, especially as data consumption rises due to AI-driven applications [2] - The introduction of BroadPeak allows mobile operators and OEMs to design high-capacity networks that can support the demands of AI-driven applications and personalized digital experiences [2] Collaboration and Development - Broadcom is collaborating with Altera to ensure interoperability between BroadPeak SoCs and Altera Agilex™ 7 FPGAs, which is essential for the development of next-generation radio platforms [4] - Hitachi GlobalLogic is co-developing the BroadPeak SDK with Broadcom to simplify hardware complexity and ensure that next-gen mMIMO and RRH architectures are ready for deployment at scale [4] Availability - Broadcom has commenced shipping samples of the BroadPeak BCM85021 to early access customers and partners [5]

Core Insights - Broadcom has launched BroadPeak™, a highly integrated radio digital front-end (DFE) SoC device aimed at enhancing 5G Advanced and 6G networks, featuring a 40% power reduction compared to existing solutions [1][2] - The device operates within a frequency range of 400 MHz to 8.5 GHz, making it the first product to meet the technical requirements for both 5G Advanced and 6G standards [1][2] Group 1: Product Features - BroadPeak integrates state-of-the-art 5nm CMOS DFE and ADC/DAC blocks on a single chip, enabling significant advancements in massive MIMO and remote radio head applications [1] - The SoC delivers up to 40% greater efficiency for next-generation base stations, supporting high-capacity and high-throughput networks [4] - Key specifications include a scalable RF carrier frequency range of 400 MHz to 8.5 GHz, integrated digital predistortion, and ADC/DAC sampling rates up to 19.6 GS/s [6] Group 2: Industry Impact - Massive MIMO technology is crucial for enhancing mobile network coverage, capacity, and user throughput, especially as data consumption rises due to AI-driven applications [2] - The introduction of BroadPeak allows mobile operators and OEMs to design next-generation networks that support advanced digital experiences [2] - Collaboration with partners like Altera and Hitachi GlobalLogic aims to ensure that the new technology is deployment-ready at scale, addressing the evolving demands of RAN evolution [4]

【重点关注】 ·记者19日从交通运输部获悉，2月18日（春运第17天，农历正月初二）全社会跨区域人员流动量为 32298.8万人次，比2025年同期增长9.7%，2026年春运单日交通出行人数首次超3亿人次。 ·今天（2月19日）全国高速公路车流量预计超6000万辆次。随着新能源车辆的增多，每天从十时开始， 高速充电场站车辆增多。许广高速湖南段、京沪高速江苏段、成巴高速四川段车流量较多。 ·据灯塔专业版，截至2月19日11时12分，2026年春节档（2月15日—2月23日）档期总票房（含预售）突 破50亿元。 ·天津大学许运华教授团队联合华南理工大学黄飞教授团队等单位，成功研制出一种新型有机正极材 料，突破了传统有机锂电池"电量低""难以实用化"等瓶颈。相关研究成果于北京时间2月19日在线发表 于国际学术期刊《自然》。 ·我国科学家近日在光通信和6G领域取得突破性进展，在国际上率先实现光纤通信和无线通信系统间的 跨网络融合，自主研发的"光纤—无线一体化融合通信系统"的数据传输速率刷新纪录。该成果19日凌晨 在线发表于《自然》。 ·两部门：加强烟花爆竹"产储运销"和燃放全链条安全管控 ·2026年春运单日交通出 ...

编导：畅舒婷 新华社音视频部制作 记者：魏梦佳 0:00 ...

"新系统破解'带宽鸿沟'，数据传输速率刷新目前已知的新纪录。"论文通讯作者、北京大学电子学院副 院长王兴军说，这一系统可支持光纤通信和无线通信双模式传输，显著提升了抗干扰能力。团队还模拟 了6G大规模用户接入场景，实现86个信道的多路实时8K视频接入演示，传输带宽较目前5G标准提升10 倍以上。 我国科学家近日在光通信和6G领域取得突破性进展，在国际上率先实现光纤通信和无线通信系统间的 跨网络融合，自主研发的"光纤—无线一体化融合通信系统"的数据传输速率刷新纪录。该成果2月19日 凌晨在线发表于《自然》。 AI数据中心算力提升和下一代无线通信网络6G的蓬勃发展，要求在多样化场景满足信号的高速、低时 延传输。然而，光纤通信与无线通信在信号架构与硬件约束上存在"带宽鸿沟"。 为此，北京大学联合鹏城实验室、上海科技大学、国家信息光电子创新中心等研发团队，创出"光纤— 无线一体化融合通信"概念，并采用集成光学方案，成功研制出250GHz（千兆赫兹）以上超宽带集成光 子器件。在此基础上开发出的新系统实现了光纤通信单通道512Gbps（千兆比特每秒）信号传输、无线 通信单通道400Gbps信号传输。 王兴军表示，新系统在 ...

为此，北京大学联合鹏城实验室、上海科技大学、国家信息光电子创新中心等研发团队，创出"光纤— 无线一体化融合通信"概念，并采用集成光学方案，成功研制出250GHz（千兆赫兹）以上超宽带集成光 子器件。在此基础上开发出的新系统实现了光纤通信单通道512Gbps（千兆比特每秒）信号传输、无线 通信单通道400Gbps信号传输。 新华社北京2月19日电（记者魏梦佳）我国科学家近日在光通信和6G领域取得突破性进展，在国际上率 先实现光纤通信和无线通信系统间的跨网络融合，自主研发的"光纤—无线一体化融合通信系统"的数据 传输速率刷新纪录。该成果19日凌晨在线发表于《自然》。 AI数据中心算力提升和下一代无线通信网络6G的蓬勃发展，要求在多样化场景满足信号的高速、低时 延传输。然而，光纤通信与无线通信在信号架构与硬件约束上存在"带宽鸿沟"。 《自然》审稿人认为，这项工作"对融合光学和太赫兹通信系统的进步作出重要贡献"。 王兴军表示，新系统在6G基站、无线数据中心等场景中极具应用潜力，有望为下一代超宽带高速光纤 —无线一体化融合通信奠定研究基础。（完） "新系统破解'带宽鸿沟'，数据传输速率刷新目前已知的新纪录。"论文通讯作 ...

Core Viewpoint - The 2026 Future Industries New Materials Expo (FINE 2026) aims to lead global innovation in new materials, emphasizing their critical role in the transformation of high-tech industries and future economic development [1][2]. Group 1: Event Overview - FINE 2026 will take place from June 10 to June 12, 2026, at the Shanghai New International Expo Center, featuring a total exhibition area of 50,000 square meters and over 300 strategic and cutting-edge technology reports [2][18]. - The expo will focus on popular innovations applicable to various industries, including artificial intelligence, aerospace, smart vehicles, and renewable energy, while addressing five common needs in future industries: advanced semiconductors, advanced batteries, lightweight functionalization, low-carbon sustainability, and thermal management [2][10]. Group 2: Historical Context and Participation - The previous editions of the expo, including the 2025 International Carbon Materials Expo and the 2025 Thermal Management Expo, achieved record attendance with over 35,000 professional visitors from 27 countries and regions, showcasing more than 500 exhibitors [7][36]. - The event is expected to attract over 100,000 professional visitors, including representatives from major companies such as BYD, Huawei, and Xiaomi, as well as over 5,000 industry investors [37][36]. Group 3: Thematic Focus and Special Features - FINE 2026 will feature seven specialized thematic exhibition areas, including advanced semiconductors, AI chips, thermal management, and sustainable materials, aiming to present a comprehensive chain of innovation from components to cutting-edge technologies [13][15]. - The expo will host over 30 forums with more than 300 renowned experts discussing trends in technology, investment strategies, and advanced manufacturing techniques related to new materials [22][24]. Group 4: Strategic Importance - The event is positioned as a critical opportunity for companies to connect with industry funds, government parks, and project resources, facilitating the integration of technological and industrial innovation in the new materials sector [2][10]. - The timing of the expo in June is highlighted as a strategic window for seizing business opportunities in the second half of the year, leveraging Shanghai's advantages as a major international exhibition platform [10].