据中国台湾工商时报，AI需求强劲，封测订单能见度高，日月光封测价格涨幅可达5%-20%，高于先前的5%-10% 涨幅预期。 【中泰电子】半导体全面涨价，重视重资产封测！ 据中国台湾工商时报，AI需求强劲，封测订单能见度高，日月光封测价格涨幅可达5%-20%，高于先前的5%-10% 涨幅预期。 需求：先进封装为AI芯片必选项，随着26年先进制造端的扩产爬坡放量，封测端有望迎来需求爆发节点。 供给：本土封测厂商积极布局2.5D/3D封装，并持续高Capex投入扩产，具备承接需求爆发的基础。 2.5D/3D封装（以盛合晶微的芯粒多芯片集成封装为例）单价有 【中泰电子】半导体全面涨价，重视重资产封测！ 需求：先进封装为AI芯片必选项，随着26年先进制造端的扩产爬坡放量，封测端有望迎来需求爆发节点。 供给：本土封测厂商积极布局2.5D/3D封装，并持续高Capex投入扩产，具备承接需求爆发的基础。 2.5D/3D封装（以盛合晶微的芯粒多芯片集成封装为例）单价有望达5万元/片，毛利率约30%+（产能爬坡，稼动率 63%情况下）。假设1万片/月，一年有望带来60亿增量营收，带来高净利增厚！ 先进封装深度报告： 【中泰电子】 ...

Group 1 - The core viewpoint of the article emphasizes the transition of the integrated circuit industry from traditional transistor scaling to system-level integration and architecture innovation, particularly highlighting the importance of advanced packaging and testing in enhancing chip performance and optimizing system power consumption [2][4][9]. Group 2 - The integrated circuit manufacturing industry consists of three main segments: chip design, wafer manufacturing, and packaging testing, with packaging testing further divided into packaging and testing processes [4][6]. - Advanced packaging is a critical aspect of modern integrated circuit manufacturing, focusing on enhancing functionality density and system-level optimization, distinguishing itself from traditional packaging methods [9][11]. Group 3 - The global integrated circuit packaging and testing industry has shifted from its early development in Europe and the United States to emerging markets in Asia, with Taiwan, mainland China, and the United States forming a triad in the current market landscape [14][16]. - The market size of the global integrated circuit packaging and testing industry is projected to grow from $55.46 billion in 2019 to $101.47 billion in 2024, with a compound annual growth rate (CAGR) of 12.8% [16]. - The advanced packaging market is expected to grow at a CAGR of 10.6% from 2024 to 2029, significantly outpacing the traditional packaging market's 2.1% CAGR [17]. Group 4 - In mainland China, major players in the integrated circuit packaging and testing industry include Longsys Technology, Tongfu Microelectronics, and Huatian Technology, with a market size projected to grow from ¥234.98 billion in 2019 to ¥331.90 billion in 2024, reflecting a CAGR of 7.2% [20][22]. - The advanced packaging market in mainland China is expected to grow at a CAGR of 14.4% from 2024 to 2029, with its market share reaching 22.9% by 2029 [22]. Group 5 - The global advanced packaging industry includes participants from both wafer manufacturing and packaging backgrounds, with significant growth driven by the demand for high-performance computing applications such as artificial intelligence and data centers [24][25]. - The market for Flip Chip (FC) packaging is projected to grow from $18.75 billion in 2019 to $26.97 billion in 2024, with a CAGR of 7.5% [28]. - Chiplet integration packaging is identified as a key growth area, with its market size expected to increase from $2.49 billion in 2019 to $8.18 billion in 2024, reflecting a remarkable CAGR of 26.9% [29]. Group 6 - The advanced packaging technology is widely applied across various sectors, including consumer electronics, mobile communications, and high-performance computing, with significant growth driven by the demand for advanced packaging in smartphones and AI applications [34][42]. - The global computing power is expected to grow from 309.0 EFlops in 2019 to 2,207.0 EFlops in 2024, with a CAGR of 48.2% [36]. Group 7 - The article outlines several trends in the integrated circuit advanced packaging and testing industry, including the acceleration of domestic substitution, the rise of chiplet integration packaging, and the increasing importance of industry chain collaboration [48][50][51]. - The value of advanced packaging is expected to continue rising, driven by the shift towards high-performance applications in AI and data centers [52].

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. is set to launch an IPO on the Sci-Tech Innovation Board, showcasing significant growth in performance, transitioning from a net loss in 2022 to a profit exceeding 400 million yuan in the first half of this year. However, the company exhibits a high dependency on its largest customer, which accounts for over 70% of its revenue, raising concerns about its revenue stability and bargaining power [1][3][4]. Group 1: Financial Performance - Shenghe Jingwei's revenue has shown explosive growth, with figures of approximately 16.33 billion yuan in 2022, 30.38 billion yuan in 2023, 47.05 billion yuan in 2024, and 31.78 billion yuan in the first half of 2024. Corresponding net profits were -3.29 billion yuan, 341.3 million yuan, 2.14 billion yuan, and 435 million yuan [3][4]. - The company's reliance on its top five customers has increased, with their combined sales revenue percentages being 72.83%, 87.97%, 89.48%, and 90.87% over the reporting periods. Specifically, the revenue from customer A constituted 40.56%, 68.91%, 73.45%, and 74.4% [3][4]. Group 2: Customer Dependency - The high customer concentration is a notable concern, as the semiconductor packaging industry is characterized by a few dominant players. Shenghe Jingwei has established long-term relationships with major clients, which may mitigate risks but also places the company in a vulnerable position if customer A faces operational issues [4][5]. - The company has signed long-term framework agreements with key clients, which aids in ensuring business stability and enhancing competitive advantages [4]. Group 3: Capacity Expansion Plans - Shenghe Jingwei plans to raise approximately 4.8 billion yuan for capacity expansion, with 4 billion yuan allocated to a 3D multi-chip integration packaging project and 800 million yuan for a high-density interconnect project [5][6]. - Despite the planned expansion, the company’s current capacity utilization rates have not reached saturation, with figures of 65.61%, 75.22%, 77.76%, and 79.09% for the years 2022 to 2024 and the first half of 2024 [6][7]. Group 4: Research and Development - The proportion of R&D personnel at Shenghe Jingwei has been declining, with figures of 18.13%, 14.11%, 13.77%, and 11.11% over the reporting periods, nearing the minimum requirement for the Sci-Tech Innovation Board [8][9]. - Although R&D expenditures have increased, the R&D expense ratio has decreased from 15.72% in 2022 to 11.53% in the first half of 2024, attributed to faster revenue growth compared to R&D spending [9]. Group 5: Corporate Governance - Shenghe Jingwei has a dispersed shareholding structure with no controlling shareholder, which may lead to challenges in decision-making due to differing interests among shareholders [9][10]. - The company asserts that it has established a clear and effective corporate governance structure to ensure efficient strategic decision-making and operational management [10].

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. has initiated its IPO process on the Sci-Tech Innovation Board, showcasing significant revenue growth from a net loss in 2022 to over 400 million yuan in profit in the first half of 2025, despite increasing reliance on a major client for revenue [1][5]. Financial Performance - Shenghe Jingwei's revenue for the years 2022 to 2025 (first half) is reported as approximately 1.633 billion yuan, 3.038 billion yuan, 4.705 billion yuan, and 3.178 billion yuan respectively, with net profits of -329 million yuan, 34.13 million yuan, 214 million yuan, and 435 million yuan [5][8]. - The company has seen a significant increase in revenue concentration from its top five clients, with sales to the largest client (Client A) accounting for 40.56%, 68.91%, 73.45%, and 74.4% of total revenue during the same periods [5][6]. Client Dependency - The high dependency on Client A raises concerns about operational stability, as any issues with this client could severely impact revenue [7]. - Shenghe Jingwei has established long-term cooperative relationships with major clients, which may help mitigate risks associated with client concentration [6][7]. Capital Expenditure and Capacity Expansion - The company plans to raise approximately 4.8 billion yuan for capacity expansion, with 4 billion yuan allocated to a 3D multi-chip integration packaging project and 800 million yuan for a high-density interconnect project [8][9]. - Despite the planned expansion, the current capacity utilization rates for various segments remain below saturation, with rates of 65.61%, 75.22%, 77.76%, and 79.09% from 2022 to the first half of 2025 [9]. Research and Development - The proportion of R&D personnel has been declining, with figures of 486, 624, 734, and 663 employees, leading to a decrease in the R&D personnel ratio from 18.13% to 11.11% over the reporting periods [10][11]. - Although R&D expenditures have increased, the R&D expense ratio has decreased due to faster revenue growth compared to R&D spending, with rates of 15.72%, 12.72%, 10.75%, and 11.53% [11]. Corporate Governance - Shenghe Jingwei has a dispersed shareholding structure with no controlling shareholder, which may lead to challenges in decision-making due to differing interests among shareholders [12]. - The company claims to have established a clear governance structure to ensure effective decision-making and operational efficiency [12].

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. has submitted its prospectus for an IPO on the Sci-Tech Innovation Board, marking a significant event in the semiconductor industry as it follows a trend of chip companies listing in Hong Kong [1] Company Overview - Shenghe Jingwei is an advanced packaging and testing enterprise for integrated circuits, with a market share second only to Changdian Technology, Tongfu Microelectronics, and Huatian Technology in mainland China [1][4] - The company was established in August 2014 in the Cayman Islands, with its main operations located in Jiangyin, Jiangsu Province [3] - The company has no actual controller or major shareholder, with its largest shareholder holding a 10.89% stake [3] Financial Performance - In 2022, the company reported a loss of 329 million yuan, but revenue has been increasing due to rising demand for advanced packaging [8] - Revenue figures for the years 2022 to 2025 (first half) are 1.633 billion yuan, 3.038 billion yuan, 4.705 billion yuan, and 3.178 billion yuan respectively, with net profits turning positive in 2023 and 2024 [8] - The company's gross profit margin has improved significantly from 6.85% in 2022 to 31.64% in the first half of 2025, reflecting better cost control and product mix [14][15] Business Structure - The revenue composition has shifted from mid-stage silicon wafer processing to multi-chip integration packaging, with the latter's share increasing from 5.32% in 2022 to 56.24% in the first half of 2025 [11] - The company primarily serves high-performance computing chips, smartphone processors, RF chips, storage chips, power management chips, communication chips, and network chips [4] Market Position - Shenghe Jingwei holds approximately 1.6% of the global packaging and testing market, ranking as the tenth largest globally and fourth in mainland China [24][32] - The global integrated circuit packaging and testing market is projected to grow from $55.46 billion in 2019 to $101.47 billion in 2024, with a compound annual growth rate (CAGR) of 12.8% [29] Investment and Future Outlook - The company plans to raise 4.8 billion yuan to invest in multi-chip integration packaging projects, aiming to enhance its production capacity [36] - Despite positive cash flow from operations, the company requires external financing to cover its investment needs, indicating a reliance on both equity and debt financing [23][36]

Group 1: IPO Market Developments - The week of October 27 to November 2 saw significant IPO activity, including the listing of the first batch of newly registered companies in the Sci-Tech Innovation Board's growth tier, with three unprofitable companies making their debut [1] - The companies He Yuan Bio-U, Xi'an Yicai-U, and Bi Bei Te-U collectively listed on the Sci-Tech Innovation Board, with closing prices on October 31 showing substantial increases compared to their issue prices, with gains of 3.25 times, 2.33 times, and 92% respectively [1] - Mo Er Thread received its IPO registration approval on October 30, taking four months from application acceptance to registration effectiveness [1][2] Group 2: Mo Er Thread Company Overview - Mo Er Thread, established in June 2020, focuses on the research, design, and sales of GPUs and related products, aiming to raise 8 billion yuan through its IPO for various AI and graphics chip development projects [2] - The company plans to allocate funds for the development of a new generation of AI training and inference chips, graphics chips, and AI SoC chips, as well as to supplement working capital [2] Group 3: Tian Su Measurement Company Insights - Tian Su Measurement, which provides calibration, testing, and certification services, received its IPO registration approval during the same week, but highlighted risks related to declining certificate prices that could impact performance [2][3] - The company's calibration business revenue accounted for over 91% of its main business income during the reporting period, with a noted decrease in certificate prices from 142.01 yuan to 119.43 yuan [2] Group 4: Sheng He Jing Wei Semiconductor Company Profile - Sheng He Jing Wei Semiconductor's IPO application was accepted on October 30, with plans to raise 4.8 billion yuan, focusing on advanced packaging and testing for integrated circuits [3] - The company reported revenues of 16.33 billion yuan in 2022, with projections of 30.38 billion yuan and 47.05 billion yuan for the following years, but also noted a significant customer concentration risk [3][4] Group 5: Zhu Zhou Ke Neng New Materials Company Status - Zhu Zhou Ke Neng New Materials' IPO application was terminated after being in a stagnant state since July 2023, despite meeting the R&D investment criteria for the Sci-Tech Innovation Board [4][5] - The company specializes in the research, production, and sales of rare metal elements and reported fluctuating revenues and net profits, alongside deteriorating cash flow from operating activities [5]

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. has received acceptance for its IPO on the Sci-Tech Innovation Board, indicating a significant step in its growth trajectory in the semiconductor industry [3]. Company Overview - Shenghe Jingwei is an advanced packaging and testing enterprise for integrated circuits, focusing on 12-inch silicon wafer processing and providing wafer-level packaging (WLP) and multi-chip integration packaging services [3]. - The company aims to support high-performance chips, particularly GPUs, CPUs, and AI chips, through heterogeneous integration methods that enhance performance metrics such as computing power, bandwidth, and energy efficiency [3]. Financial Performance - The company reported revenues of 1.633 billion yuan, 3.038 billion yuan, and 4.705 billion yuan for the years 2022, 2023, and 2024 respectively, with a projected revenue of 3.178 billion yuan for the first half of 2025 [3]. - Net profits for the same periods were -329 million yuan, 34.13 million yuan, 214 million yuan, and 43.5 million yuan for the first half of 2025 [3]. Market Position - According to Gartner, Shenghe Jingwei is projected to be the 10th largest packaging and testing company globally and the 4th largest domestically by 2024, with the highest compound annual growth rate in revenue among the top ten companies from 2022 to 2024 [3]. Shareholding Structure - As of the date of the prospectus, the largest shareholder is Wuxi Chanfang Fund with a 10.89% stake, followed by a group of shareholders from the China Merchants Bank system with a combined 9.95% [4]. - The company has no controlling shareholder or actual controller, ensuring a dispersed shareholding structure where no single shareholder can dominate the shareholder meetings [5].

Core Insights - Gansu Shangfeng Cement Co., Ltd. has established a private equity investment fund, Suzhou Puyun, through its wholly-owned subsidiary Ningbo Shangrong Logistics, to invest in Shenghe Jingwei Semiconductor Co., Ltd., which has recently had its IPO application accepted by the Shanghai Stock Exchange [2][3] - Shenghe Jingwei is a leading global integrated circuit wafer-level advanced packaging enterprise, focusing on advanced 12-inch silicon wafer processing and providing comprehensive advanced packaging services for high-performance chips [2] - The investment in Shenghe Jingwei reflects Shangfeng Cement's strategic shift towards emerging industries such as semiconductors, new energy, and new materials, aiming to diversify its asset portfolio and enhance its long-term growth potential [3] Company Investment Strategy - Ningbo Shangrong has invested 150 million yuan, holding a 67.72% stake in Suzhou Puyun, which in turn holds 1.086% of Shenghe Jingwei with 17.45 million shares prior to the IPO [3] - The company has adopted a dual-driven development strategy of "main business + investment" to navigate the cyclical challenges of the traditional cement industry and align with national strategic directions [3] - The acceptance of Shenghe Jingwei's IPO application is expected to lead to a public revaluation of the company's worth, boosting market confidence in Shangfeng Cement's ability to capture value in new economic sectors [3]

Core Insights - Shenghe Jingwei's application for listing on the Sci-Tech Innovation Board has been accepted, marking a significant step in the ongoing trend of semiconductor companies going public in China [1] - Shenghe Jingwei is a leading global provider of advanced packaging services for integrated circuits, focusing on high-performance chips such as GPUs, CPUs, and AI chips, with a strong technological platform in the 2.5D integration field [2] - Since 2020, Shangfeng has invested over 2 billion yuan in more than 20 semiconductor companies, with a significant portion of these companies either in the listing process or already listed, showcasing its strategic focus on the semiconductor sector [3] Company Overview - Shenghe Jingwei specializes in advanced wafer-level packaging and multi-chip integration packaging, aiming to enhance performance metrics like computing power, bandwidth, and energy efficiency [2] - The company is recognized as one of the earliest and largest producers of 2.5D integration technology in mainland China, achieving a market share of approximately 85% in this segment for 2024 [2] Investment Strategy - Shangfeng's investment in Shenghe Jingwei amounted to 150 million yuan, part of a broader strategy to strengthen its competitive edge in the semiconductor industry [3] - The company has focused on investing in sectors that address critical technology gaps, with a significant portion of its investments directed towards semiconductor and new materials companies [3] - Over 60% of the invested companies are either in the process of applying for listing or have already gone public, indicating a successful investment strategy that enhances financial returns and industry influence [3]

Core Viewpoint - The company, through its wholly-owned subsidiary Ningbo Shangrong Logistics Co., Ltd., has established a private equity investment fund to invest in Shenghe Jingwei Semiconductor Co., Ltd., which has applied for an IPO on the Sci-Tech Innovation Board [1] Group 1: Company Overview - Shenghe Jingwei is a leading global advanced packaging and testing enterprise for integrated circuits, focusing on advanced 12-inch silicon wafer processing [1] - The company provides a full range of advanced packaging and testing services, including wafer-level packaging (WLP) and chiplet multi-chip integration packaging [1] Group 2: Industry Focus - Shenghe Jingwei aims to support various high-performance chips, particularly graphics processing units (GPUs), central processing units (CPUs), and artificial intelligence chips [1] - The company emphasizes performance enhancement through heterogeneous integration methods that exceed Moore's Law, achieving high computing power, high bandwidth, and low power consumption [1]