Core Viewpoint - The article emphasizes the significance of technology in the Hong Kong stock market for the second half of the year, suggesting that it will be a decisive factor in market performance [6]. Group 1: Market Insights - The Hong Kong stock market is identified as the main battleground for the current bull market, with specific focus on the importance of marginal factors and top picks [6]. - Historical trends indicate that the performance of the Hong Kong stock market is driven by various factors, including the impact of U.S.-China trade tensions and global industrial upgrades [6][7]. Group 2: Sector Analysis - The series of lectures includes discussions on the evolution of technology in the semiconductor industry, particularly the transition from 14nm to N2 processes, which is expected to drive innovation in Electronic Design Automation (EDA) [6][7]. - The analysis of the pricing power in the Hong Kong market highlights the influence of different types of capital and the restructuring of industries following significant mergers, such as Synopsys and Ansys [6][7]. Group 3: Investment Opportunities - The research series explores the growth potential of companies like Tencent Music Entertainment (TME) and NetEase Cloud Music, drawing parallels with Spotify's success [7]. - The focus on AI applications and new consumer trends in the Hong Kong market suggests that companies like Kuaishou and Bilibili are positioned for significant growth, driven by their unique content ecosystems [7].

Core Viewpoint - The article discusses the retirement of TSMC's Vice President of R&D, Dr. Yu Zhenhua, highlighting his significant contributions to the semiconductor industry, particularly in advanced packaging technologies and the establishment of TSMC as a leader in the foundry sector [3][5][7]. Group 1: Contributions of Dr. Yu Zhenhua - Dr. Yu Zhenhua joined TSMC in 1994 and played a pivotal role in the development of advanced packaging technologies such as CoWoS and InFO, which have been crucial for TSMC's success in the semiconductor industry [3][5][9]. - He has accumulated over 190 U.S. patents and 173 Taiwanese patents, focusing on low dielectric materials and packaging integration technologies [9]. - Dr. Yu's leadership in the development of 3D chip integration and TSV technology has strengthened the Taiwanese semiconductor supply chain [9]. Group 2: Transition of Leadership - Following Dr. Yu's retirement, his responsibilities will be taken over by Xu Guojin, who has over 30 years of experience in the semiconductor industry and previously held senior positions at Micron [5][11][13]. - Xu Guojin is currently the Vice President of Integrated Interconnect & Packaging at TSMC, focusing on 3D IC and advanced packaging technologies [13]. Group 3: Historical Context and Achievements of TSMC - TSMC's rise to prominence in the semiconductor industry is attributed to key technological breakthroughs, including the 0.13-micron copper process developed in 2003, which significantly enhanced its market position [16][17]. - The article refers to the "Six Knights of TSMC," a group of key figures, including Dr. Yu, who have been instrumental in TSMC's technological advancements and overall success [15][17][22]. - TSMC's focus on advanced packaging has become a major area of growth, with the establishment of the "3D Fabric" brand for its 2.5D and 3D packaging products [25].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容编译自semiengineering，谢谢。 从平面 SoC 到 3D-IC 和先进封装的转变需要更薄的晶圆，以提高性能和降低功率，从而减少信号 需要传输的距离和驱动信号所需的能量。 对超薄晶圆的需求正在增长。包含 12 个 DRAM 芯片和基础逻辑芯片的 HBM 模块的总厚度仍小于 优质硅晶圆的厚度。薄晶圆在组装扇出晶圆级封装和用于 AI 应用的先进 2.5D 和 3D 封装方面也发 挥着关键作用，这些封装的增长速度远快于主流 IC。再加上业界对轻薄手机、可穿戴设备和医疗电 子产品的需求，似乎如果没有可靠地加工薄硅晶圆的能力，现代微电子就不可能实现。 薄硅通孔 (TSV) 的揭示工艺是一种需要背面处理的经典工艺。"几乎任何堆叠设备都必须有硅通 孔，" Amkor Technology高级 3D/技术总监 Rick Reed 说道。"在许多当前应用中引入硅通孔需要 非常受控的减薄工艺，而且由于您几乎总是需要进行背面处理，因此该工艺立即需要临时键合和解 键合工艺。" 任何晶圆减薄工艺的第一步都是确定目标。"如果硅片中有我们所谓的盲 TSV，并且您不了解晶圆中 ...