Core Viewpoint - The article discusses the advancements in semiconductor technology, particularly in AI applications, focusing on key trends such as advanced packaging, CPO technology, and cooling solutions to address performance and efficiency challenges in AI accelerators [2][3]. Advanced Packaging Technology - Advanced packaging is evolving through Chiplet technology and hybrid bonding to enhance AI processor performance. The shift from silicon interposers to silicon bridges and organic RDL is aimed at cost reduction, with a future transition to panel-level packaging expected by 2028-2029 [4][5]. - Hybrid bonding is crucial for improving performance by reducing the bonding area through enhanced alignment precision [5]. CPO Technology - CPO (Co-Packaged Optics) is identified as the next-generation connection technology for AI data center servers, effectively reducing power consumption in high-bandwidth scenarios. However, high costs and the complexity of precise assembly remain significant challenges [6]. - The introduction of next-generation 448Gb SerDes technology may increase CPO adoption, as it addresses signal degradation issues by minimizing transmission distances [6]. Client Device Packaging - In client devices, semiconductor manufacturers are carefully selecting between Chiplet and monolithic architectures based on cost and performance considerations. For instance, AMD's latest Radeon series GPU has integrated previously Chiplet-based SRAM into a monolithic design [7]. - Apple's Vision Pro features a Chiplet package with two high-bandwidth custom DRAM chips, showcasing the trend towards specialized high-performance processors [7]. Cooling Solutions - Traditional cooling methods like air and water cooling are becoming less effective due to increasing power density in AI accelerators. Two-phase liquid cooling is emerging as a key solution due to its high energy efficiency and broad applicability [3][9]. - Different cooling technologies are suited for varying thermal densities: air cooling for below 10W/cm², two-phase liquid cooling for 10-100W/cm², and water cooling for above 100W/cm². The next-generation 3nm AI data center GPUs are expected to have thermal densities around 100W/cm², making two-phase liquid cooling particularly relevant [10][11][12].

Core Viewpoint - The Japanese stock market is experiencing a strong rebound, with the Tokyo Stock Exchange index rising 1.1% and the Nikkei 225 index increasing by 1.4%, marking the longest consecutive rise since August 2009 [1][2] Group 1: Market Performance - The Tokyo Stock Exchange index has achieved a consecutive rise for 13 trading days, while the Nikkei 225 index has risen for four consecutive days [1] - The rebound in the Japanese stock market is attributed to the easing of global trade tensions, particularly the reduction of tariffs between China and the U.S. [2][3] Group 2: Impact of Tariff Reductions - According to JPMorgan's latest research, the easing of tariffs is expected to reduce the negative impact on Japanese corporate earnings to between -6.4% and -4.2% [4][6] - If U.S.-Japan negotiations lead to a reduction of tariffs on specific goods like automobiles to 10%, the negative impact could further decrease to -4.2% [6] - In a high tariff scenario, if the U.S. maintains high tariffs, the overall impact on Japanese corporate earnings could reach -10.9% [6][7] Group 3: Factors Driving Market Recovery - JPMorgan identifies three main factors driving the market recovery: stable U.S. economic data, progress in trade agreements, and potential easing of semiconductor technology export restrictions [5][10] - The market's performance is also supported by expectations of trade negotiations between the U.S. and Japan, which are anticipated to conclude by mid-June or early July [10] Group 4: Future Market Outlook - Despite the current strong trend, JPMorgan warns that global markets may face downward pressure in the summer, influenced by potential economic slowdowns [10][11] - The Japanese stock market is expected to be buoyed by trade negotiation outcomes and easing yen appreciation pressures, alongside ongoing corporate reforms [10]