半导体制造
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士兰微:截至2025年9月30日股东总数为296179户
Zheng Quan Ri Bao Wang· 2026-01-06 11:09
证券日报网讯1月6日,士兰微(600460)在互动平台回答投资者提问时表示,截至2025年9月30日,公 司股东总数为296179户。 ...
意法半导体取得压控振荡器及其使用方法专利
Jin Rong Jie· 2026-01-06 10:52
声明:市场有风险,投资需谨慎。本文为AI基于第三方数据生成,仅供参考,不构成个人投资建议。 本文源自:市场资讯 国家知识产权局信息显示,意法半导体股份有限公司取得一项名为"压控振荡器及其使用方法"的专利, 授权公告号CN116248047B,申请日期为2022年12月。 作者:情报员 ...
合肥新汇成微电子股份有限公司关于 2025年第四季度可转债转股结果暨股份变动及控股股东、实际控制人及其一致行动人权益变动的公告
Sou Hu Cai Jing· 2026-01-06 03:56
Summary of Key Points Core Viewpoint - The company has provided an update on the status of its convertible bonds, detailing the conversion amounts and the impact on its share capital. Group 1: Convertible Bond Issuance and Conversion - The company was approved to issue 11,487,000 convertible bonds at a face value of RMB 100 each, raising a total of RMB 1,148,700,000, with a net amount of RMB 1,142,527,891.52 after expenses [2] - The convertible bonds, named "汇成转债," began trading on the Shanghai Stock Exchange on September 2, 2024, with an initial conversion price of RMB 7.70 per share [2] - As of December 31, 2025, the total amount converted from the bonds was RMB 218,660,000, resulting in 28,732,697 shares, which is approximately 3.4288% of the total shares before conversion [5] Group 2: Conversion Status and Remaining Bonds - From October 1, 2025, to December 31, 2025, the conversion amount was RMB 83,565,000, leading to 10,980,820 shares converted, about 1.3104% of the total shares before conversion [5] - As of December 31, 2025, the amount of convertible bonds that had not been converted was RMB 930,040,000, representing 80.9646% of the total issuance [5] Group 3: Share Capital Changes - Following the conversion of bonds, the total share capital increased to 868,942,978 shares, resulting in a dilution of the controlling shareholder's stake from 30.9933% to 29.9687% [7] - The change in equity was a result of the bond conversion and did not affect the company's control structure or governance [7] Group 4: Adjustments to Conversion Price - The conversion price was adjusted from RMB 7.70 to RMB 7.61 per share due to the implementation of the 2024 annual equity distribution [3][4]
东微半导成交额创上市以来新高
Zheng Quan Shi Bao Wang· 2026-01-06 03:26
(文章来源:证券时报网) 数据宝统计,截至10:18,东微半导成交额15.43亿元,创上市以来新高。最新股价上涨6.59%,换手率 11.56%。上一交易日该股全天成交额为11.51亿元。(数据宝) ...
3D NAND,靠它了
半导体行业观察· 2026-01-06 01:42
Core Insights - The demand for higher capacity flash memory is driven by the growing storage needs at the edge and in the cloud [1] - 3D NAND flash technology is advancing rapidly, with new generations offering 50% faster read/write speeds, 40% higher bit density, lower latency, and improved energy efficiency [1] - Innovations in etching technology, such as low-temperature etching, are crucial for reducing energy consumption and carbon emissions in the semiconductor industry [1] Group 1: 3D NAND Flash Technology - 3D NAND flash manufacturers stack and connect storage cells using increasingly smaller and deeper channels, achieving remarkable production speeds [1] - Major producers of 3D NAND chips include Samsung Electronics, Western Digital, Toshiba's Kioxia, and SK Hynix, who increase the number of word lines by 30% with each generation [2] - The transition from 2D to 3D NAND has led to a focus on vertical construction, allowing for more compact designs and increased bit storage per cell [5] Group 2: Etching Technology - The etching process for NAND flash faces challenges in maintaining vertical profiles while ensuring reasonable etching rates [2] - AI plays a significant role in optimizing etching profiles, which directly impacts NAND flash performance metrics such as read/write speed and programming/erase efficiency [2] - Low-temperature etching techniques are being explored to enhance etching rates and reduce carbon emissions, with estimates suggesting an 84% reduction in greenhouse gas emissions compared to traditional methods [12] Group 3: Manufacturing Challenges and Innovations - The introduction of low-k dielectric materials and air gaps is being researched to mitigate inter-cell interference and improve data retention [18][19] - The complexity and cost of manufacturing increase as manufacturers aim for higher stacking layers and tighter dimensional control [10][11] - AI-assisted optimization methods are being developed to reduce wafer consumption during the early stages of process development, significantly lowering costs and accelerating product development timelines [16]
台积电股价再度大涨3.4%,报330美元/股,再创历史新高,总市值达1.7万亿美元
Mei Ri Jing Ji Xin Wen· 2026-01-05 14:50
每经AI快讯,1月5日,台积电股价再度大涨3.4%,报330美元/股,再创历史新高,总市值达1.7万亿美 元。 (文章来源:每日经济新闻) ...
缺芯,本田工厂继续停产
半导体芯闻· 2026-01-05 10:13
安世半导体出现发货延迟后,日本汽车制造商本田称因晶片库存不足,此前已停产的三家中国工厂 复工时间推迟两周至1月19日。 综合路透社和日经新闻报道,日本第二大汽车制造商本田发言人星期一(1月5日)宣布,受晶片 库存不足影响,三座与广汽集团共同运营的停产工厂,复工时间将从原计划的星期一推迟至1月19 日,凸显车商持续存在的供应链压力。 据悉,此次停产始于2025年12月29日,最初计划停产五天至今年1月2日,后因晶片供应问题未 缓解,复工时间两度延后,目前燃油车型生产线将持续停至1月16日。 本田此番宣布紧随闻泰旗下的荷兰安世半导体出现发货延迟,这一问题过去几个月已迫使部分汽车 制造商大幅削减产量。 不过,本田没有将此次复工延后直接归因于安世半导体。去年10月底至11月期间,本田也因为晶 片短缺,而令其在北美的工厂停产或减产。 作为本田在华核心生产基地,三家工厂的停摆时间延长预计将造成上万辆产能缺口,热门车型交付 周期已从原本的一至两周拉长至两至三个月,部分稀缺配置车型提车时间或超一个月。 资料显示,安世的总部位于荷兰,2019年12月被中国公司闻泰科技收购,此后一直向全球制造商 供应基础但不可或缺的芯片。 9月 ...
量化观市:内稳外缓信号确立,跨年行情如何布局?
SINOLINK SECURITIES· 2026-01-05 07:24
以上结果通过历史数据统计、建模和测算完成,在政策、市场环境发生变化时模型存在失效的风险。 过去一周,国内主要市场指数上涨,其中上证 50、沪深 300、中证 500 和中证 1000 涨跌幅分别为-0.47%、-0.59%、 0.09%和-0.13%。 微盘股指标监控:综合来看,当前轮动模型由于微盘股滚动 20 天斜率收负,茅指数为正斜率,当前轮动模型发出切 换至茅指数信号,中期配置茅指数的预期能有更高相对收益。从中期微盘股择时角度来看,目前风控信号还没触发。 对于持有微盘板块投资者建议做好风险控制,以及密切跟踪相对净值、动量及中期风险指标的动态。 过去一周,中国公布了 12 月的中采制造业 PMI 数据,报 50.1%。其重回扩张区间,显示国内制造业景气度在年底出现 明显边际回暖,给元旦节后的潜在跨年行情提供了经济景气度利好。而政策端,财政部提前下达 2026 年首批 625 亿 元"两新"资金。这一动作实现了补贴政策在年度交替之际的无缝衔接,有助于维持 2026 年一季度实物工作量的落地强 度。此外,房地产政策在北京的进一步松绑(如北京放宽非京籍及多子女家庭限购),配合全国层面增值税免征年限 调整的正式生 ...
紫光国微拟收购瑞能半导体:“设计+制造”协同开新局
半导体行业观察· 2026-01-05 01:49
行业分析认为,若交易顺利完成,紫光国微将通过整合在功率半导体领域拥有全球市场地位和制造 能力的瑞能半导体, 实现构建"设计+制造"的完整产业链,并将牢牢抓住汽车电子、工业控制等关 键领域的国产化机遇,改变中国功率半导体市场的竞争格局。 此外,本次交易也折射出新紫光集 团加速半导体全产业链整合的战略动向。 2025年12月30日,新紫光集团旗下紫光国微发布重大资产重组公告,拟通过发行股份及支 付现金方式收购瑞能半导体控股权或全部股权,并同步募集配套资金。 中国工程院院士丁荣军曾强调, 功率半导体是保障能源革命推进与国家产业安全的核心关键, 是 中国半导体自主突围的核心抓手。而瑞能半导体,作为 中资控股 下的功率半导体企业,不仅继承 了欧洲老牌半导体产业的深厚技术积淀,也在过去十年间完成了精准的赛道布局,使其在功率半导 体领域形成独特竞争力。 | 证券代码:002049 | 证券简称:紫光国微 | 公告编号:2025-108 | | --- | --- | --- | | 债券代码:127038 | 债券简称:国微转债 | | 设计+制造:强强联手的产业链协同 瑞能半导体前身为恩智浦半导体标准产品事业部,2015 ...
台积电传今年启动大扩产计划 先进制程协力厂大补
Jing Ji Ri Bao· 2026-01-04 23:28
中砂有钻石碟、晶圆再生、传统砂轮等三大业务,其中钻石碟是获利主力项目,去年受益于大客户3纳 米与5纳米制程应用挹注甚多。 中砂持续扩充钻石碟产能,预计今年相关月产能将超过5万颗。 另外,受惠2纳米制程进入产能跳升期,业界指出,光洋科凭借领先同业的贵金属回收技术与材料设计 能力,已稳坐N3与N2制程中,本土靶材独家供应商的地位,业绩吃补。 升阳半提供先进制程必备的再生晶圆与晶圆薄化服务。升阳半看好,半导体制程愈先进,对再生晶圆需 求同步提高,例如在28纳米制程的投片与再生晶圆利用比率约为1:0.8,进入2纳米制程后,相关比率 大增为1:2.6甚至1:2.7,呈现数倍增长。 法人估升阳半现有85万片月产能中,约六、七成供应5纳米以下先进制程所需。升阳半正持续扩产,今 年整体月产能将达120万片。 台积电(2330)传今年启动先进制程大扩产计划,2纳米月产能将倍增以上成长,3纳米增幅约三成,带 动先进制程关键耗材用量同步激增。 法人看好,升阳半(8028)、中砂(1560)、光洋科(1785)、创控等台积电先进制程重要协力厂未来 几年营运将跟着大爆发。 ...