电子元器件
Search documents
天微电子 技术筑基领航发展 开辟民用市场新航道
Shang Hai Zheng Quan Bao· 2025-12-12 19:25
天微电子灭火抑爆产品展示图 ◎记者 李少鹏 今年前三季度营收同比增长72.66%,净利润同比增长550.37%,在国家重点领域拼搏多年的四川天微电 子股份有限公司(下称"天微电子"或"*ST天微"),展现出不俗的发展势头。 "受行业周期波动影响,2024年公司发展的确遇到一些困难,如今困难期已过,我们也会继续努力。"近 日,公司董事、副总经理巨万夫表示,前三季度业绩大增主要得益于国家重点领域需求提升,公司抢抓 市场机遇,为业绩增长打下坚实基础。未来,*ST天微将依托在国家重点领域多年的技术积累, 借"AI+安全"之匙积极布局开拓民用市场,以期打造出穿越行业周期的第二增长曲线。 订单驱动增长 经营状况稳步回升 在巨万夫看来,*ST天微能够实现业绩触底回升,除了行业回暖外,核心底气在于公司二十余年积累的 技术实力和研发能力。 *ST天微长期专注于综合防护领域的核心器件及系统集成,在灭火抑爆、高能点火、高精度熔断等细分 领域形成了独特的技术优势。公司拥有较为完善的科研生产设备、试验检测设备以及配套设施,建立了 完整的重点装备科研生产平台,已成为重点装备整机/总体单位的重要配套商,受到用户单位的高度认 可。 研发投入 ...
宏明电子创业板IPO过会,未来经营业绩的稳定性被追问
Bei Jing Shang Bao· 2025-12-12 13:06
在上市委会议现场,上市委要求宏明电子结合行业竞争格局及下游市场需求变化、主要产品价格和销量 变动趋势、在手订单及执行情况,以及预计期后研发投入规模等,说明未来经营业绩的稳定性。 据了解,宏明电子创业板IPO于2025年5月30日获得受理,当年6月16日进入问询阶段。公司主要从事以 阻容元器件为主的新型电子元器件的研发、生产和销售,致力于向客户提供高性能、高可靠性的电子元 器件产品。同时,公司还涉及精密零组件业务,产品主要应用于平板电脑、笔记本电脑等消费电子领域 和新能源电池及汽车电子结构件等领域。本次冲击上市,宏明电子拟募集资金约19.51亿元。 北京商报讯(记者 马换换 李佳雪)12月12日晚间,深交所官网显示,成都宏明电子股份有限公司(以 下简称"宏明电子")创业板IPO当日上会获得通过。 ...
士兰微:12月12日召开董事会会议
Mei Ri Jing Ji Xin Wen· 2025-12-12 13:04
每经AI快讯,士兰微(SH 600460,收盘价:28.12元)12月12日晚间发布公告称,公司第九届第六次董 事会会议于2025年12月12日以通讯的方式召开。会议审议了《关于修订〈董事会战略与投资委员会议事 规则〉的议案》等文件。 2025年1至6月份,士兰微的营业收入构成为:电子元器件占比96.9%,其他业务占比3.1%。 截至发稿,士兰微市值为468亿元。 每经头条(nbdtoutiao)——实施城乡居民增收计划、降准降息等工具灵活高效运用、增加普通高中学 位……深度解读中央经济工作会议 (记者 张明双) ...
国内老牌电子元器件制造商宏明电子创业板IPO过会
Zheng Quan Shi Bao Wang· 2025-12-12 12:31
Core Viewpoint - Chengdu Hongming Electronics Co., Ltd. successfully passed the IPO review by the Shenzhen Stock Exchange, indicating strong market confidence in the company's growth potential in the electronic components sector [1]. Group 1: Company Overview - Hongming Electronics specializes in the research, production, and sales of new electronic components, primarily focusing on passive components such as capacitors and resistors [1]. - The company has over 60 years of experience in the electronic components industry and possesses a comprehensive product system with multiple proprietary core technologies [1][2]. - Key products include multilayer ceramic capacitors (MLCC), chip ceramic capacitors, organic and mica capacitors, tantalum electrolytic capacitors, thermistors, and displacement sensors [1]. Group 2: Industry Position - Hongming Electronics is one of the few companies in China that has the capability to produce both high-quality electronic materials and electronic components, achieving several domestic firsts in production lines for various components [2]. - The company ranks first in sales revenue among competitors in the ceramic capacitor and electronic components market from January to June 2025 [3]. Group 3: Financial Performance - For the first three quarters of 2023, Hongming Electronics reported revenues of 2.727 billion yuan, 2.494 billion yuan, and 2.113 billion yuan, with net profits of 412 million yuan, 268 million yuan, and 303 million yuan respectively [3]. - The company plans to raise 1.951 billion yuan through its IPO to fund eight projects, including three industrialization projects and three R&D projects, along with a digital capability enhancement project and working capital supplementation [3].
超声电子跌停,机构净买入2667.58万元,深股通净卖出4564.65万元
Zheng Quan Shi Bao· 2025-12-12 12:03
买/卖会员营业部名称买入金额(万元)卖出金额(万元) 超声电子今日跌停,全天换手率10.78%,成交额8.11亿元,振幅4.30%。龙虎榜数据显示,机构净买入 2667.58万元,深股通净卖出4564.65万元,营业部席位合计净买入177.60万元。 深交所公开信息显示,当日该股因日跌幅偏离值达-10.66%上榜,机构专用席位净买入2667.58万元,深 股通净卖出4564.65万元。 证券时报·数据宝统计显示,上榜的前五大买卖营业部合计成交2.17亿元,其中,买入成交额为9966.21 万元,卖出成交额为1.17亿元,合计净卖出1719.46万元。 具体来看,今日上榜的营业部中,共有3家机构专用席位现身,即买二、买五、卖五,合计买入金额 4471.20万元,卖出金额1803.62万元,合计净买入2667.58万元,深股通为第一大买入营业部及第一大卖 出营业部,买入金额为2153.47万元,卖出金额为6718.11万元,合计净卖出4564.65万元。 资金流向方面,今日该股主力资金净流出3189.99万元,其中,特大单净流入2293.72万元,大单资金净 流出5483.71万元。近5日主力资金净流出8045. ...
宏明电子创业板IPO通过上市委会议 曾创造国内第一条有机薄膜介质电容器国军标生产线
智通财经网· 2025-12-12 11:55
Core Viewpoint - Chengdu Hongming Electronics Co., Ltd. has successfully passed the listing committee meeting of the Shenzhen Stock Exchange's Growth Enterprise Market, aiming to raise 1.95071 billion yuan through its IPO [1] Company Overview - Hongming Electronics specializes in the research, production, and sales of new electronic components, primarily focusing on passive components such as capacitors and resistors, and aims to provide high-performance, high-reliability products to customers [1][2] - The company has over 60 years of experience in electronic component manufacturing and possesses a comprehensive product system with multiple proprietary core technologies [2] Product and Market Position - Key products include multilayer ceramic capacitors (MLCC), chip ceramic capacitors, organic and mica capacitors, tantalum electrolytic capacitors, thermistors, and displacement sensors, among others [2] - In the defense sector, the company has a competitive advantage with its high-reliability products and has participated in national key projects in aerospace, weaponry, and nuclear industries [2] - The company is one of the few in China capable of producing both high-quality electronic materials and electronic components, achieving several domestic firsts in production lines for various components [2] Financial Performance - The company reported revenues of approximately 3.146 billion yuan, 2.727 billion yuan, 2.494 billion yuan, and 1.528 billion yuan for the years 2022, 2023, 2024, and the first half of 2025, respectively [3] - Net profits for the same periods were approximately 690 million yuan, 598 million yuan, 386 million yuan, and 370 million yuan [3] - Total assets as of June 30, 2025, are projected to be 57.201 billion yuan, with a total equity attributable to shareholders of 27.653 billion yuan [4]
方邦股份:可剥铜产品订单预计在1-2年内有望加快放量
Xin Lang Cai Jing· 2025-12-12 11:29
转自:智通财经 【方邦股份:可剥铜产品订单预计在1-2年内有望加快放量】智通财经12月12日电, 方邦股份在互动平 台表示,公司带载体可剥离超薄铜箔主要应用于IC载板和类载板的制备。公司可剥铜产品在与客户长期 应用沟通中持续提升质量和良率,目前已逐步突破"从0到1"的最艰难阶段,预计在1–2年内订单有望加 快放量。在AI技术快速发展、CoWoP先进封装路线、800G/1.6T光模块采用SLP类载板等趋势下,可剥 铜需求有望实现较快增长。 ...
方邦股份(688020.SH):公司带载体可剥离超薄铜箔主要应用于IC载板和类载板的制备
Ge Long Hui· 2025-12-12 10:36
格隆汇12月12日丨方邦股份(688020.SH)在投资者互动平台表示,公司带载体可剥离超薄铜箔主要应用 于IC载板和类载板的制备。截至目前,相关型号已陆续通过部分代表性载板和相关头部芯片终端客户的 批量验证,持续获得小批量订单。公司可剥铜产品在与客户长期应用沟通中持续提升质量和良率,目前 已逐步突破"从0到1"的最艰难阶段,预计在1-2年内订单有望加快放量。在AI技术快速发展、CoWoP先 进封装路线、800G/1.6T光模块采用SLP类载板等趋势下,可剥铜需求有望实现较快增长。 ...
方邦股份:三星、Google、Meta等知名海外终端的相关产品均有使用公司屏蔽膜
Mei Ri Jing Ji Xin Wen· 2025-12-12 10:34
方邦股份(688020.SH)12月12日在投资者互动平台表示,公司的电磁屏蔽膜产品在全球范围内具有良 好竞争力,三星、Google、Meta等知名海外终端的相关产品均有使用我司屏蔽膜。公司将持续推进海外 市场拓展,产品品类除屏蔽膜外,亦涵盖可剥铜、极薄FCCL、薄膜电阻等产品。 (记者 张明双) 每经AI快讯,有投资者在投资者互动平台提问:请问公司海外业务情况如何,海外主要客户有哪些? ...
达瑞电子(300976):加码碳纤维业务,深度布局AI终端
GUOTAI HAITONG SECURITIES· 2025-12-12 05:10
Investment Rating - The investment rating for the company is "Accumulate" with a target price of 87.50 CNY [4][12]. Core Insights - The company is increasing its investment in carbon fiber structural components, which is expected to benefit from the ramp-up of foldable devices. The introduction of new material numbers for major clients is anticipated to lead to significant growth in 2026 [2][12]. - The company has acquired an 80% stake in Weiste, which specializes in carbon fiber structural components for foldable phones, with projected revenues of 180 million CNY and a net profit of 16 million CNY in 2024 [12]. - The company is also expanding its presence in AI terminal products, with significant collaboration with Meta, expecting accelerated growth in 2026 [12]. Financial Summary - Total revenue is projected to grow from 1,398 million CNY in 2023 to 6,513 million CNY by 2027, reflecting a compound annual growth rate (CAGR) of approximately 32.2% [10]. - Net profit attributable to shareholders is expected to increase from 73 million CNY in 2023 to 692 million CNY in 2027, with a notable growth rate of 47.5% in 2027 [10]. - The earnings per share (EPS) is forecasted to rise from 0.55 CNY in 2023 to 5.16 CNY in 2027, indicating strong profitability growth [10]. Market Data - The company's market capitalization is approximately 7,885 million CNY, with a 52-week stock price range of 43.42 CNY to 76.69 CNY [5]. - The current price of the stock is 58.80 CNY, with a price-to-earnings (P/E) ratio of 107.48 for 2023, decreasing to 11.39 by 2027 [12][10].