AI需求拉动存储芯片暴涨，超级周期下，中国存储芯片公司在二级市场受到追捧。 其中，A股上市公司兆易创新（603986.SH）近一年股价涨幅超过115%，截至2025年12月31日，兆易创新市值已达1430.87亿元，是A股存储行 业屈指可数的千亿市值企业之一。 如今，兆易创新不仅是半导体板块的"压舱石"，更因其在全球NOR Flash（代码型闪存芯片）、SLC NAND Flash（单层单元闪存）、利基型 DRAM（动态随机存取内存）和微控制器（MCU）赛道的竞争力，成为国内存储芯片龙头企业。公开资料显示，兆易创新是全球排名第一的 无晶圆厂Flash供应商，以及中国品牌排名第一的Arm通用型MCU供应商。 朱一明的故事始于一个近乎偏执的想法。 1994年，朱一明从清华大学物理系本科毕业，随后留校取得硕士学位。那是全球半导体的黄金时代，硅谷的每一个角落都跳动着创新的脉搏。 毕业后，朱一明远赴美国纽约州立大学攻读电子工程硕士，随后进入硅谷，并在Monolithic System Technologies等公司任职。 在硅谷的日子里，他发现了一个不合理的现象：在庞大的半导体版图中，存储芯片是消耗量最大、标准化程度最 ...

Core Viewpoint - The embedded computing world is undergoing a transformation where AI is reshaping the architecture of MCUs, moving from traditional designs to those that natively support AI workloads while maintaining reliability and low power consumption [2][5]. Group 1: MCU Evolution - The integration of NPU in MCUs is driven by the need for real-time control and stability in embedded systems, particularly in industrial and automotive applications [3][4]. - NPU allows for "compute isolation," enabling AI inference to run independently from the main control tasks, thus preserving real-time performance [3][5]. - Current edge AI applications typically utilize lightweight neural network models, making hundreds of GOPS sufficient for processing, which contrasts with the high TOPS requirements in mobile and server environments [5]. Group 2: Major MCU Players' Strategies - TI focuses on deep integration of NPU capabilities in real-time control applications, enhancing safety and reliability in industrial and automotive scenarios [7][8]. - Infineon leverages the Arm ecosystem to create a low-power AI MCU platform, aiming to reduce development barriers for edge AI applications across various sectors [9][10]. - NXP emphasizes hardware scalability and a full-stack software approach with its eIQ Neutron NPU, targeting diverse neural network models while ensuring low power and real-time response [11][12]. - ST aims for high-performance edge visual applications with its self-developed NPU, pushing the boundaries of traditional MCU AI capabilities [13][14]. - Renesas combines high-performance cores with dedicated NPU and security features, focusing on reliable edge AIoT applications [15][16]. Group 3: New Storage Technologies - The introduction of NPU in MCUs necessitates a shift from traditional Flash storage to new storage technologies that can handle the demands of AI workloads and frequent updates [17][18]. - New storage solutions like MRAM, RRAM, PCM, and FRAM are emerging to address the limitations of Flash, offering advantages in reliability, speed, and endurance [21][22][25][28][30]. - MRAM is particularly suited for automotive and industrial applications due to its high reliability and endurance, with companies like NXP and Renesas leading in its adoption [22][23][24]. - RRAM offers benefits in speed and flexibility, making it a strong candidate for AI applications, with Infineon actively promoting its integration into next-generation MCUs [25][26][27]. - PCM provides high storage density and efficiency, suitable for complex embedded systems, with ST advocating for its use in advanced MCU designs [28][29]. Group 4: Future Implications - The dominance of Flash storage is being challenged as new storage technologies demonstrate superior performance and reliability for embedded systems [33]. - The integration of NPU and new storage technologies in MCUs represents a shift towards system-level optimization, enhancing overall performance and efficiency [33]. - The transformation in the MCU market presents structural opportunities for domestic manufacturers to innovate and compete against established international players [33].

当前消费电子领域的存量竞争并未削弱MCU市场的整体潜力，反而催生出工业自动化、新能源、汽车电子等高附加值赛道的增量空间。 先楫半导体成立五年间已推出六大系列近百个料号产品，在伺服驱动器、光伏逆变、仪器仪表等领域形成成熟应用案例，更精准卡位人形机器人这一新兴 蓝海市场——单个人形机器人通常需要30至40颗关节控制芯片，随着2025年人形机器人从实验室走向规模化量产，相关MCU需求将迎来指数级增长。此 次B+轮融资资金明确投向机器人专用芯片研发及解决方案规模化应用，正是瞄准这一万亿级市场的前瞻布局。 国产替代浪潮的深化，为本土MCU企业打开了前所未有的市场空间。长期以来，全球高端MCU市场被欧美日厂商垄断，前六大国际厂商占据87%的市场 份额，但地缘政治变化与关税政策调整正在重塑市场格局。越来越多美系品牌用户主动寻求国产替代方案，而先楫半导体的HPM6E00系列作为国内首款 获得德国倍福正式授权EtherCAT从站控制器的MCU，成功打破国外技术垄断，成为工业控制领域国产替代的标杆产品。与此同时，浦东科创集群形成 的"设计-制造-封装"完整产业链闭环，为本土MCU企业提供了从技术研发到量产落地的全周期支撑，加速了 ...

Investment Rating - The report assigns a "Trading Buy" rating to the company, indicating a potential upside of 5% to 15% [7][12]. Core Insights - The company is experiencing a favorable supply-demand dynamic in the DRAM industry, leading to a significant increase in revenue and net profit. In Q3 2025, revenue grew by 31% year-over-year, while net profit surged by 61% [7][10]. - The company is positioned as a leader in the storage market, having achieved large-scale production of 45nm NOR Flash and successfully introduced DDR4 niche products to clients. It is also the largest supplier of 32-bit MCUs in China [7][10]. - The report anticipates continued price increases in storage products driven by AI computing demand and supply constraints, projecting further revenue growth for the company [10]. Financial Summary - For the fiscal year ending December 31, 2025, the company is expected to achieve a net profit of RMB 1,876 million, representing a year-over-year growth of 70% [9]. - The earnings per share (EPS) for 2025 is projected at RMB 2.81, with a corresponding price-to-earnings (P/E) ratio of 84.3 [9][10]. - The company’s revenue is forecasted to reach RMB 9,769 million in 2025, with a gross margin of 38.6% for the first three quarters of 2025 [10][14].

Core Viewpoint - The global ultra-low power (ULP) microcontroller market is experiencing strong growth, projected to increase from $9.78 billion in 2025 to $15.27 billion by 2030, driven by rising energy efficiency demands in consumer electronics and the proliferation of smart home and building management systems [1][2]. Group 1: Market Growth and Drivers - The ULP microcontroller market is expected to grow significantly due to the increasing demand for battery-powered devices that are smaller and more feature-rich [1]. - The analog device segment is anticipated to lead the market in 2025, highlighting the importance of precise signal measurement, conditioning, and conversion in sensors, medical devices, and industrial automation [1][3]. - The demand for ULP MCUs is accelerating in wearable medical devices, environmental sensors, and connected electronics, bridging consumer electronics and industrial sectors [1][3]. Group 2: Automotive Sector Impact - ULP MCUs are crucial for advanced driver-assistance systems (ADAS), infotainment systems, battery management, and in-vehicle sensors, with their low-power standby mode and quick wake-up features being essential for electric and hybrid vehicles [2][4]. - The automotive sector is expected to hold a significant share of the ULP MCU market, driven by the integration of these controllers in key functionalities like tire pressure monitoring systems and climate control modules [4]. Group 3: Regional Insights - North America is projected to lead the global ULP MCU market, fueled by strong applications in IoT, industrial automation, and energy-efficient consumer electronics [2][5]. - The surge in demand for smart home deployments, wearable medical devices, and battery-powered industrial sensors is creating substantial market opportunities in North America [5][6]. - Government initiatives like the CHIPS and Science Act are promoting semiconductor innovation, further enhancing the competitive landscape for ULP MCUs in the region [5]. Group 4: Key Players and Innovations - Major players in the ULP MCU market include Infineon Technologies, NXP Semiconductors, Renesas Electronics, and STMicroelectronics, emphasizing the strategic importance of ULP microcontrollers in the next-generation electronic ecosystem [3]. - Companies are focusing on low-power designs and collaborating with OEMs in high-growth verticals to strengthen their market position [6].

Core Viewpoint - The semiconductor industry is shifting from a singular focus on process miniaturization to diversified innovation, with advanced packaging and specialty processes becoming key drivers for performance optimization and differentiation [1][2]. Group 1: Specialty Processes and Market Growth - The global specialty process market has surpassed $50 billion, with a compound annual growth rate (CAGR) of 15%, significantly outpacing the average growth rate of the semiconductor industry [1]. - Specialty processes focus on customized and diverse process optimizations, achieving a precise balance of performance, power consumption, and cost, particularly in demanding fields like automotive electronics and IoT [1]. Group 2: TSMC's Leadership in Specialty Processes - TSMC is establishing itself as a global benchmark in specialty processes through a combination of technological breadth and ecosystem depth, expanding its capabilities across various domains including automotive and RF technologies [2][4]. - TSMC's advanced logic technologies, such as N7A, N5A, and N3A, are specifically designed for automotive applications, ensuring high reliability and long lifecycle [4]. Group 3: Innovations in Embedded Non-Volatile Memory (eNVM) - TSMC is addressing the limitations of traditional eFlash memory by advancing RRAM and MRAM technologies, which are expected to replace eFlash in automotive and IoT applications [6][8]. - The introduction of RRAM and MRAM technologies allows for significant improvements in performance, reliability, and power efficiency, with TSMC's RRAM already in mass production at 40, 28, and 22 nm nodes [7][8]. Group 4: Competitive Landscape and Future Trends - Major MCU manufacturers are collaborating with foundries to leverage specialty processes, with companies like Infineon and NXP adopting eNVM technologies to enhance their product offerings [9][16]. - The market for embedded NVM is projected to grow rapidly, with wafer production expected to increase from approximately 3 KWPM in 2023 to about 110 KWPM by 2029, indicating a strong shift towards new storage technologies [26]. Group 5: Diverse Storage Technologies - Various new storage technologies, including eRRAM, eMRAM, and ePCM, are being explored by different manufacturers, each offering unique advantages in terms of speed, power consumption, and integration capabilities [30][32]. - The trend indicates a move towards a multi-storage technology ecosystem rather than a single dominant solution, reshaping the MCU landscape in the post-eFlash era [32].

Group 1: Core Insights - The article discusses the recent advancements in microcontroller units (MCUs) from various companies, highlighting their competitive edge against traditional giants in the market [1][2][4][12]. Group 2: Texas Instruments (TI) - TI launched the world's smallest MCU, the MSPM0C1104, with a wafer chip scale package (WCSP) area of only 1.38mm², aimed at compact applications like medical wearables [2][3]. - The MSPM0 MCU product line includes over 100 cost-effective microcontrollers, enhancing embedded design capabilities without increasing circuit board size [2][3]. Group 3: NXP Semiconductors - NXP introduced the S32K5 series automotive MCUs, the first to utilize 16nm FinFET technology and embedded magnetic RAM (MRAM), enhancing performance and energy efficiency [4][5][6]. - The S32K5 series features a dedicated eIQ® Neutron NPU for efficient real-time sensor data processing, supporting advanced AI applications [6][7]. Group 4: Microchip Technology - Microchip announced the PIC32A series MCUs designed for smart sensing and control applications, featuring a clock speed of up to 200MHz and integrated high-speed peripherals [8][9]. Group 5: Renesas Electronics - Renesas launched the RZ/V2N MPU, equipped with a dynamic reconfigurable processor (DRP) for AI applications, achieving up to 15 TOPS of AI inference performance [10][11]. Group 6: Infineon Technologies - Infineon plans to introduce a new series of automotive MCUs based on RISC-V architecture, aiming to meet the growing demands for real-time performance and flexibility in the automotive sector [12][13][14]. Group 7: STMicroelectronics - STMicroelectronics unveiled two new MCU series for IoT applications: the STM32WBA6 for short-range wireless connectivity and the STM32U3 for ultra-low power operation, enhancing functionality and efficiency [15][16][17][18].