引言 2025 年 ， 仅 半 年 时 间 内 ， ST 、 恩 智 浦 、 瑞 萨 等 头 部 MCU 厂 商 几 乎 同 时 发 布 搭 载 新 型 嵌 入 式 存 储 （ 如 PCM 、 MRAM）的汽车MCU产品，打破了MCU长期以来以嵌入式Flash为主的技术格局。虽然谈"标配"仍为时尚早，但可 以肯定的是：新型存储已经从"尝试"跃升为"战略布局"，并开始对MCU生态产生深远影响。 | ） | 新存储路径 | 代表产品 | 工艺节点 | 面向应用 | | --- | --- | --- | --- | --- | | ST | PCM | Stellar P/G系列 | FD-SOI | SDV、电动化平台 | | NXP | MRAM | S32K5系列 | 16nm FinFET | 分区架构/OTA | | Renesas | MRAM | RA8P1系列 | 22nm | AI语音、多模态 | | Infineon | eRRAM | AURIX Next | 台积电合作 | 车规控制 | 公众号记得加星标⭐️，第一时间看推送不会错过。 过去，MCU是一种"小而美"的器件，用于基本控制逻辑。 ...

Core Viewpoint - TSMC is establishing its first design center in Europe, located in Munich, focusing on automotive applications and aiming for significant advancements in memory technology [1][2]. Group 1: TSMC's Strategic Shift - TSMC's new design center represents a strategic shift from solely chip manufacturing to providing design services, addressing the lack of advanced design expertise in Europe [1][2]. - The European Design Center (EUDC) is expected to support TSMC's €10 billion investment in the European Semiconductor Manufacturing Company (ESMC) located in Dresden, which TSMC operates with a 70% stake [1][2]. Group 2: Focus Areas and Technology Development - The design center will focus on high-density, high-performance, and energy-efficient chips, particularly in automotive, industrial, AI, and IoT applications [1][2]. - TSMC plans to introduce 5nm MRAM and 6nm RRAM technologies, which are critical for automotive applications and AI chip memory expansion [4][5]. Group 3: Market Projections and Future Plans - By 2030, the automotive sector is projected to account for 15% of a $1 trillion market, surpassing IoT's 10% share, with data centers and AI driving significant growth [6]. - TSMC's N3 technology is expected to achieve high yield and long-term operation, with over 70 new wafers anticipated by April 2025 [5][6].

如果您希望可以时常见面，欢迎标星收藏哦~ 如今，随着先进制程研发成本激增、量子隧穿效应等物理极限逼近，传统工艺升级的红利日 益收窄。在摩尔定律逐渐放缓的当下，半导体行业正从单一依赖制程微缩的路径转向多元化 创新。 其中，先进封装技术的兴起为芯片性能的进一步优化提供了新的思路。此外，特色工艺的发 展更是成为推动半导体产业多元化和差异化竞争的关键力量。 不同于追求晶体管密度极致的先进制程（如3nm、2nm），特色工艺以其定制化、多样化制程优化 能力，聚焦特定应用场景的深度优化，通过整合异构技术、材料创新、器件架构革新等手段，实现 性能、功耗与成本的精准平衡，在汽车电子、工业控制、物联网等对可靠性与功能集成要求严苛的 领域，展现出不可替代的优势。 据相关数据统计，当前全球特色工艺市场规模已突破500亿美元，年复合增长率达15%，远超半导 体行业平均增速。 在此背景和趋势下，台积电、联电、中芯国际等厂商正加速布局，其中台积电以"技术广度+生态 深度"构建起特色工艺的全球标杆：从存储技术领域的RRAM、MRAM，到满足汽车电子严苛要求 的车规级工艺，再到针对特定应用的功率器件和射频工艺，凭借其深厚的技术积累和强大的研发 ...

QuickLogic (QUIK) Q1 2025 Earnings Call May 13, 2025 05:30 PM ET Company Participants Alison Ziegler - Managing Director - IR ServicesBrian Faith - President & Chief Executive OfficerElias Nader - CFO & SVP of FinanceRick Neaton - President Conference Call Participants Quinn Bolton - Senior AnalystRichard Shannon - Senior Research AnalystMartin Yang - Senior Analyst Operator Ladies and gentlemen, good afternoon. At this time, I'd like to welcome everyone to QuickLogic Corporation's Fiscal First Quarter twen ...

Financial Data and Key Metrics Changes - Total revenue for Q1 2025 was $4.3 million, down 28% from Q1 2024 and down 24% from Q4 2024 [31] - New product revenue in Q1 was $3.8 million, down 23% from Q1 2024 and down 19% from Q4 2024 [31] - Non-GAAP gross margin in Q1 was 45.7%, significantly lower than 71.3% in Q1 2024 and 62.9% in Q4 2024 [32] - Non-GAAP net loss was $1.1 million or $0.07 per diluted share, compared to a net income of $1.7 million or $0.12 per diluted share in Q1 2024 [33] Business Line Data and Key Metrics Changes - Mature product revenue was $600,000, down from $1.1 million in Q1 2024 and $1 million in Q4 2024 [31] - Non-GAAP operating expenses in Q1 were approximately $3 million, compared to $2.5 million in Q1 2024 and $2.9 million in Q4 2024 [32] Market Data and Key Metrics Changes - The discrete FPGA market for U.S. military applications is approximately $1.5 billion, with significant interest in integrating eFPGA technology into ASICs and SoCs [14][44] - The defense industrial base is increasingly interested in using eFPGA technology to reduce costs and improve integration [70][71] Company Strategy and Development Direction - The company aims to capitalize on its unique position as the first available source for eFPGA hard IP for Intel 18A technology, focusing on integration to drive growth [10][14] - The partnership with Faraday is expected to accelerate expansion into new end markets and generate future revenue through storefront services [15][46] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in achieving solid revenue growth, non-GAAP profitability, and positive cash flow for the full year 2025 despite a slower start [46][41] - The company anticipates a revenue rebound beginning in Q3 2025, driven by new IP contracts and existing mature product sales [39][60] Other Important Information - The company raised approximately $1.5 million from institutional investors and $1.2 million net from an ATM offering [37] - The strategic RadHard FPGA government contract is expected to contribute significantly to future revenue, with ongoing engagement with the defense industrial base [19][86] Q&A Session Summary Question: Can you walk us through the ramp of Intel 18A and its revenue stream? - Management discussed the progress of Intel 18A and its importance in accelerating customer engagement, particularly in defense applications, with revenue expected from licensing and royalties [50][54] Question: What are the key drivers for revenue ramp in the second half of the year? - Key drivers include ongoing Anafuse FPGA business, the strategic RadHard contract, and new IP contracts, particularly in advanced process technologies [58][60] Question: Can you provide insights on storefront opportunities? - Management highlighted several storefront opportunities, including contracts with defense customers and participation in chiplet ecosystems, indicating a growing trend towards storefront services [64][66] Question: How does the company plan to address the $1.5 billion FPGA market? - The company aims to reduce verification costs and improve integration, which is critical for defense applications, thereby enhancing its market position [68][71] Question: Are there opportunities with Faraday beyond the current node? - Management expressed interest in exploring smaller nodes with Faraday as they gain confidence in the integration of eFPGA technology [74][76]

台积电特色工艺全景 台积电作为全球领先的晶圆代工厂，拥有丰富的特色工艺组合，涵盖多个技术领域。在台积电 2025技术研讨会上，台积电执行副总经理暨共同营运长米玉杰博士介绍了台积电的特色工艺技 术 ， 为 汽 车 、 ULP/IoT （ 超 低 功 耗 和 物 联 网 ） 、 RF （ 射 频 ） 、 eNVM （ 嵌 入 式 非 易 失 性 存 储 器）、高电压显示、CIS（CMOS图像传感器）和电源IC提供最全面的解决方案，助力连接数字世 界与现实世界。 汽车电子与高压技术： 汽车客户采用台积电最先进的逻辑技术，从N7A、N5A到N3A，通过汽车 级认证，专为ADAS、自动驾驶和智能座舱设计，支持高可靠性和长生命周期需求；BCD-Power 工艺：集成双极晶体管、CMOS和DMOS器件，提供高压（如40-90V）解决方案，适用于汽车电 源管理、工业控制等场景，提升系统集成度。 低功耗与物联网： 台积电N4e工艺针对超低功耗物联网AI设备优化，结合嵌入式非易失性存储器 （eNVM），实现高效能与低成本的平衡；ULP（超低功耗）技术提供超低漏电晶体管和低电压 解决方案，适用于可穿戴设备和传感器节点。 射频： 边 ...

每经记者｜朱成祥 每经编辑｜马子卿 赵海军介绍称，中芯国际第一季度工业与汽车收入额环比增长超过两成，占比从8%上升至10%。尤其 是汽车电子，得益于主要客户在汽车领域取得的进展和公司过去几年加大对汽车电子平台的投入和重点 布局，在BCD（一种特色工艺）、CIS（图像处理器）、MCU（微控制器）、域控制器等领域，与产业 链紧密合作，车规产品的出货量稳步提升。 5月9日上午，中芯国际（SH688981,股价89.98元，市值7185亿元）召开2025年第一季度业绩说明会。按 照国际财务报告准则，一季度，中芯国际整体实现销售收入22.47亿美元，环比增长1.8%。从服务类型 来看，收入分为晶圆收入和其他收入，占比分别为95.2%和4.8%。从金额来看，晶圆收入环比增长5%。 其中8英寸、12英寸晶圆收入环比增长18%和2%。 对于晶圆收入环比增长，中芯国际联合首席执行官（联席CEO）赵海军表示，主要是受益于国际形势变 化引起的客户提拉出货、国内以旧换新的消费补贴等政策推动的大宗类产品的需求上升，以及工业与汽 车产业的触底补货；公司整体出货数量达到229万片（折合八英寸标准）逻辑晶圆，出货量环比增长 15%。但由于工 ...

证券研究报告 公司研究 [Table_ReportType] 公司点评报告 [Table_StockAndRank] 赛轮轮胎(601058.SH) 投资评级 买入 上次评级 买入 [Table_Author] 张燕生 化工行业首席分析师 执业编号：S1500517050001 邮箱：zhangyansheng@cindasc.com 洪英东 化工行业分析师 执业编号：S1500520080002 邮箱：hongyingdong@cindasc.com 尹 柳 化工行业分析师 执业编号：S1500524090001 邮箱：yinliu@cindasc.com 信达证券股份有限公司 CINDA SECURITIES CO.,LTD 北京市西城区宣武门西大街甲127号金隅大厦 B座 邮编：100031 [Table_Title] 千帆过尽显韧性，逆风扬楫启新程 [Table_ReportDate] 2025 年 4 月 29 日 [Table_S 事件：202ummar 5 年y]4 月 28 日，赛轮轮胎公布 2024 年报及 2025 一季报。公司 2024 年实现营业总收入 318.02 亿元，同比+22. ...

证券研究报告 公司研究 [Table_ReportType] 公司点评报告 投资评级 买入 上次评级 买入 [Table_Author] 张燕生 化工行业首席分析师 执业编号：S1500517050001 邮箱：zhangyansheng@cindasc.com 洪英东 化工行业分析师 执业编号：S1500520080002 邮箱：hongyingdong@cindasc.com 尹 柳 化工行业分析师 执业编号：S1500524090001 邮箱：yinliu@cindasc.com 信达证券股份有限公司 CINDA SECURITIES CO.,LTD 北京市西城区宣武门西大街甲127号金隅大厦 B座 邮编：100031 [Table_Title] 千帆过尽显韧性，逆风扬楫启新程 [Table_ReportDate] 2025 年 4 月 29 日 [Table_S 事件：202ummar 5 年y]4 月 28 日，赛轮轮胎公布 2024 年报及 2025 一季报。公司 2024 年实现营业总收入 318.02 亿元，同比+22.42%，归母净利润 40.63 亿 元，同比+31.42%。公司 2025 ...

Core Insights - QuickLogic Corporation has integrated its eFPGA IP into Faraday Technology Corporation's FlashKit™-22RRAM SoC Development Platform, enhancing flexibility for IoT applications [1][3] - The FlashKit-22RRAM platform is built on UMC's 22ULP process technology and supports both Arm Cortex-M7 and VeeR EH1 RISC-V processors, making it suitable for AIoT, consumer, and industrial applications [2][4] - The integration allows for post-silicon hardware adaptability, reducing time-to-market and extending product lifecycles through field upgradability [3][5] Company Overview - Faraday Technology Corporation focuses on sustainable IC solutions and offers a wide range of ASIC solutions and silicon IP, including various memory and interface technologies [6] - QuickLogic Corporation specializes in eFPGA Hard IP and endpoint AI solutions, providing customizable and low-power silicon solutions for various markets [7]