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知名独角兽机器人获得雄安基金投资;无锡各大基金数亿元注资芯享|每周十大股权投资
Sou Hu Cai Jing· 2025-09-01 12:27
每周精选 不可错过 WEEKLY NEWS IT桔子出品 1.梅卡曼德再获新融资 融资交易 01 September 星期一 西藏诺迪康药业发布公告,拟通过在香港设立全资子公司TopRidge Pharma Limited对Accuredit Therapeutics Limited(锐正基因)进行股权投资,投资金额6000万美元(全部为自有资金),持有其 40.82%的股权;诺迪康大股东关联公司CMS Medical Venture Investment(HK)Limited,投资1500万美 元,持有其10.20%的股权。锐正基因(苏州)本次A轮融资总额7500万美元,用于研发基于LNP的体内 基因编辑产品。 3.芯片封装设备研发商微见智能获超亿元B轮融资 微见智能近日完成超亿元B轮融资,新投资方包括前海金控、明势资本、力合科创,老股东海通开元、 分享投资追投,深渡资本继续担任本轮独家财务顾问。资金将主要用于产品研发,面向AI时代对传 输、存储、计算等未来先进封装方向,加大研发和产品布局力度。 微见智能成立于2019年12月,专注于高精度复杂工艺芯片封装设备研发和生产,主要产品为MV全系列 高精度固晶装备 ...
中国公司全球化周报|滴滴二季度国际业务日均订单增至1196万单/京东旗下跨境电商品牌Joybuy登陆法国市场
3 6 Ke· 2025-08-31 04:59
Company Dynamics - Didi's Q2 orders increased by 15.2% year-on-year, with a total transaction value (GTV) of 109.6 billion yuan, reflecting a 15.9% growth at fixed exchange rates [2] - JD's cross-border e-commerce brand Joybuy officially launched in France, with plans to enter the German market soon [2] - Temu topped Brazil's e-commerce traffic with 410 million visits in July, a 70% increase month-on-month, surpassing competitors like Mercado Livre and Shopee [2] - TikTok Shop upgraded its logistics in Southeast Asia, implementing next-day delivery services across six countries, with over 170,000 merchants participating [3] - Leapmotor's European manufacturing base will be established in Zaragoza, Spain, with production expected to start in Q3 2026 [3] - BYD announced plans to build an assembly plant in Malaysia, expected to commence production in 2026 [3] Investment and Financing - Mech-Mind Robotics completed a nearly 500 million yuan financing round, with overseas business revenue accounting for 50% [6] - AI toy company Haivivi raised 200 million yuan in Series A financing, becoming the global leader in AI toy shipments [6] - Hefei Tianyao, a semiconductor materials developer, completed a multi-million yuan Series A financing to expand overseas markets [6] - Tianxing Exploration, focused on satellite internet, secured angel round financing for core technology development [6] - Weijian Intelligent, a chip packaging equipment developer, raised over 100 million yuan in Series B financing, with over 20% of orders coming from exports [6] Policy & Market - Amazon's Prime Day will globally launch on October 7-8, covering 16 countries, providing cross-border sellers with significant traffic opportunities [8] - The Ministry of Commerce announced measures to optimize the service export zero tax rate declaration process, enhancing export tax refund efficiency [8] - New US tariff regulations create uncertainty, with 25 countries suspending parcel shipments to the US due to changes in tax exemptions [8]
完成三期扩产,年产600台固晶机,芯片封装设备研发商「微见智能」获超亿元B轮融资 | 36氪首发
3 6 Ke· 2025-08-26 04:00
Group 1 - The core viewpoint of the article is that Weijian Intelligent has successfully completed over 100 million yuan in Series B financing, with funds primarily allocated for product research and development in advanced packaging technologies for the AI era [1] - Weijian Intelligent, established in December 2019, focuses on the research and production of high-precision complex process chip packaging equipment, particularly the MV series of high-precision die bonding machines, which cater to the packaging needs of third-generation semiconductor chips [1][2] - The company has secured orders from leading domestic and international optical module clients from 2023 to 2024, with revenue growing at an exponential rate [1] Group 2 - The die bonding process is critical in the packaging stage, requiring high precision to ensure product performance, especially in optical communication modules where alignment must be within microns [2] - Weijian Intelligent has developed a 1.5μm series die bonding machine, achieving a cumulative error control within 1.5μm and actual production accuracy of ±3μm, which is a significant improvement over previous domestic products [2][4] - The company faced market challenges initially, but the explosion of AI demand in late 2022 created new opportunities, allowing Weijian Intelligent to validate its technology with benchmark clients [4] Group 3 - Weijian Intelligent is expanding its product line to include sub-micron level products (0.5μm) and 10μm level products, broadening its market reach [5] - The company is also diversifying into storage and computing sectors to create a "transmission-storage-computing" product matrix, addressing the advanced packaging requirements of AI chips [6] - The company has achieved significant improvements in mass production capabilities, with equipment that allows for quick deployment and minimal need for original factory personnel on-site [6] Group 4 - In 2023, Weijian Intelligent successfully exported its 1.5μm high-precision die bonding machines to the European and American markets, with over 20% of total orders coming from exports [7] - The company has completed the expansion of its third delivery center ahead of schedule and is advancing its fourth production line, aiming to enhance its product matrix in optical communication and invest in new growth areas [7]