每周精选 不可错过 WEEKLY NEWS IT桔子出品 1.梅卡曼德再获新融资 融资交易 01 September 星期一 西藏诺迪康药业发布公告，拟通过在香港设立全资子公司TopRidge Pharma Limited对Accuredit Therapeutics Limited（锐正基因）进行股权投资，投资金额6000万美元（全部为自有资金），持有其 40.82%的股权；诺迪康大股东关联公司CMS Medical Venture Investment（HK）Limited，投资1500万美 元，持有其10.20%的股权。锐正基因（苏州）本次A轮融资总额7500万美元，用于研发基于LNP的体内 基因编辑产品。 3.芯片封装设备研发商微见智能获超亿元B轮融资 微见智能近日完成超亿元B轮融资，新投资方包括前海金控、明势资本、力合科创，老股东海通开元、 分享投资追投，深渡资本继续担任本轮独家财务顾问。资金将主要用于产品研发，面向AI时代对传 输、存储、计算等未来先进封装方向，加大研发和产品布局力度。 微见智能成立于2019年12月，专注于高精度复杂工艺芯片封装设备研发和生产，主要产品为MV全系列 高精度固晶装备 ...

Group 1 - Meikaman's recent financing round raised nearly 500 million yuan, with investments from various funds aimed at enhancing its embodied intelligence technology and expanding product lines [2] - The Suzhou Kuanyu Equity Investment Fund was established with a registered capital of approximately 22.43 billion yuan, focusing on private equity investments and asset management [3] - The Horgos Silk Road Rongtong Industrial Investment Fund was established with a capital contribution of 1 billion yuan, also focusing on private equity investments [4] Group 2 - Weijian Intelligent completed a Series B financing round exceeding 100 million yuan, with funds directed towards product development in advanced packaging technologies for the AI era [6] - Two venture capital funds initiated by Shenzhen's collective economy, focusing on AI and emerging industries, have a total scale of 3 billion yuan [7] - Tianjin Jiayu Equity Investment Fund was established with a capital of 4.5 billion yuan, involving several insurance companies [8] Group 3 - Dowsure, a cross-border e-commerce platform, completed a C1 financing round with strategic investment from HSBC, enhancing its funding solutions for sellers [9] - A QFLP fund with a scale of 30 million USD has settled in Nantong, focusing on investments in the domestic medical and pharmaceutical sectors [10] - Shibeikang completed a nearly 100 million yuan Series B financing round, with funds aimed at accelerating R&D and expanding laboratory capabilities [11] Group 4 - The Guoxin Venture Capital Fund was established with a capital of 10 billion yuan, focusing on early-stage investments in hard technology sectors [13] - Prologis received a 1.5 billion USD investment from the Abu Dhabi Investment Authority to support its growth in supply chain and new energy sectors [14] - The first seed fund in Henan, with a scale of 200 million yuan, aims to support early-stage tech enterprises and facilitate technology transfer [16][17]

Group 1 - The core viewpoint of the article is that Weijian Intelligent has successfully completed over 100 million yuan in Series B financing, with funds primarily allocated for product research and development in advanced packaging technologies for the AI era [1] - Weijian Intelligent, established in December 2019, focuses on the research and production of high-precision complex process chip packaging equipment, particularly the MV series of high-precision die bonding machines, which cater to the packaging needs of third-generation semiconductor chips [1][2] - The company has secured orders from leading domestic and international optical module clients from 2023 to 2024, with revenue growing at an exponential rate [1] Group 2 - The die bonding process is critical in the packaging stage, requiring high precision to ensure product performance, especially in optical communication modules where alignment must be within microns [2] - Weijian Intelligent has developed a 1.5μm series die bonding machine, achieving a cumulative error control within 1.5μm and actual production accuracy of ±3μm, which is a significant improvement over previous domestic products [2][4] - The company faced market challenges initially, but the explosion of AI demand in late 2022 created new opportunities, allowing Weijian Intelligent to validate its technology with benchmark clients [4] Group 3 - Weijian Intelligent is expanding its product line to include sub-micron level products (0.5μm) and 10μm level products, broadening its market reach [5] - The company is also diversifying into storage and computing sectors to create a "transmission-storage-computing" product matrix, addressing the advanced packaging requirements of AI chips [6] - The company has achieved significant improvements in mass production capabilities, with equipment that allows for quick deployment and minimal need for original factory personnel on-site [6] Group 4 - In 2023, Weijian Intelligent successfully exported its 1.5μm high-precision die bonding machines to the European and American markets, with over 20% of total orders coming from exports [7] - The company has completed the expansion of its third delivery center ahead of schedule and is advancing its fourth production line, aiming to enhance its product matrix in optical communication and invest in new growth areas [7]