Core Viewpoint - The semiconductor sputtering target materials industry, often overlooked, is crucial for the semiconductor supply chain, with significant investment potential as domestic alternatives emerge to replace long-standing foreign monopolies [2][4]. Industry Overview: What are Sputtering Target Materials? - Sputtering target materials are essential for physical vapor deposition (PVD) processes, creating functional thin films on substrates like silicon wafers through magnetron sputtering technology [6][8]. - These materials are critical for manufacturing integrated circuits, specifically in metal interconnect layers, barrier layers, and contact layers, requiring ultra-high purity (typically above 99.9995%) and precise dimensions [8][12]. Classification of Targets - Targets are categorized by material type: metal targets (e.g., copper, aluminum), alloy targets (e.g., copper-manganese), and ceramic targets (e.g., indium tin oxide) [12][10]. - Each type serves specific functions in semiconductor applications, with increasing purity and structural uniformity requirements as technology advances [12][13]. Upstream Supply: High-Purity Metals and Equipment - The upstream supply involves high-purity metal and non-metal raw materials, with significant reliance on imports for high-purity materials [15][16]. - Key domestic producers include Xinjiang Zhonghe for aluminum and Jiangfeng Electronics for tungsten, while global leaders include Hydro for high-purity aluminum and Hitachi Metals for tungsten [16][15]. Midstream Manufacturing: Technically Intensive Core Segment - The midstream segment encompasses the manufacturing of sputtering targets, involving complex processes such as melting, forming, and binding, requiring significant R&D investment [18][17]. - Precision in temperature, time, and atmosphere during melting is crucial for ensuring material uniformity and purity [18]. Downstream Coating: Sputter Coating - The main coating processes include PVD and chemical vapor deposition (CVD), with PVD being the predominant method in semiconductor and display applications [19][21]. - The sputtering coating market is largely dominated by American and Japanese multinational corporations [21]. Terminal Applications: Core Demand from Semiconductor Industry - Downstream applications are primarily in semiconductor chip manufacturing, where sputtering target materials are vital for forming key chip structures [22][23]. - The demand for high-quality sputtering targets is driven by the increasing performance requirements of chips in high-performance computing, AI, and 5G communications [22][23]. Market Situation - The global sputtering target market has grown from 82.1 billion yuan in 2018 to 116.3 billion yuan in 2022, with a compound annual growth rate (CAGR) of 9.1% [47]. - The market is projected to reach 194.5 billion yuan by 2027, with a CAGR of 10.7% during the forecast period [47]. Competitive Landscape - The global sputtering target market is characterized by an oligopoly, with major players like JX Nippon Mining, Honeywell, and Tosoh dominating approximately 80% of the market [60][62]. - Domestic companies such as Jiangfeng Electronics and Yuyuan New Materials are making significant strides in technology and market penetration, particularly in the midstream segment [64]. Future Development Trends - The industry is expected to see increased demand for higher purity and quality sputtering targets as semiconductor processes advance to 3nm and below [68]. - Emerging applications in AI, IoT, and automotive sectors are anticipated to drive further growth in the sputtering target market [69]. Core Investment Logic - Investing in semiconductor sputtering targets is fundamentally about investing in certainty, as demand remains closely tied to capital expenditures in wafer manufacturing [74]. - The industry is protected by high technical barriers, long certification cycles, and strong customer loyalty, making it difficult for new entrants [75]. - The narrative of domestic substitution presents a significant investment opportunity, with domestic leaders poised to capture market share from established foreign players [76].

Group 1 - The company has successfully established a product system centered on ultra-pure metal sputtering targets, semiconductor precision components, and key materials for the third-generation semiconductors, achieving a leading position in both technology and market share globally [1] - In 2024, the revenue from sputtering targets is projected to be 2.333 billion yuan, representing a year-on-year growth of 39.51%, with a gross margin of 31.35%, an increase of 2.90 percentage points compared to the previous year [1] - The company has become a leading global manufacturer of semiconductor sputtering targets, supplying major chip manufacturers such as TSMC, SMIC, SK Hynix, and UMC, with a market share of nearly 40% [1] Group 2 - The revenue from precision components is expected to reach 0.887 billion yuan in 2024, showing a year-on-year increase of 55.53%, with a gross margin of 24.27% [2] - The company has successfully developed and mass-produced over 40,000 types of components, achieving full-category coverage in precision components [2] - A cooperation framework agreement was signed with KSTE INC. for the electrostatic chuck project, which will enhance the company's competitive edge in the semiconductor precision components sector [2] Group 3 - The company is expected to see revenue growth from 4.642 billion yuan in 2025 to 7.606 billion yuan in 2027, with net profits projected to be 0.525 billion yuan, 0.679 billion yuan, and 0.919 billion yuan respectively [3] - The strong demand for sputtering targets is driven by the new capacity being established by downstream manufacturers, while the precision components are benefiting from the trend of supply chain localization [3]