东软载波在互动平台表示，公司和阿里的合作重点是阿里达摩院授权RISC-V架构CPU，公司研发微控 制器芯片，共同推进RISC-V生态建设。 ...

Group 1 - The company Changying Holdings plans to acquire a total of 88.79% equity in Guangzhou Ligong Technology Co., Ltd. to gain actual control over the target company [1] - The transaction price is set at 708.879 million RMB, with an adjustment cap of no more than 133.1864 million RMB [1] Group 2 - Ligong Technology specializes in the distribution of electronic components, focusing on high-end chip agency and technical services in the automotive electronics and industrial control sectors for over 20 years [2] - The company has built a product matrix covering core components such as MCU, power devices, and sensors, driven by user demand and technological innovation [2] - Ligong Technology's distribution products are widely used in various fields including industrial IoT, automotive electronics, rail transportation, power energy, medical equipment, and home security [2] - The company represents major chip brands such as NXP, ISSI, 3PEAK, Rockchip, and GigaDevice, and serves as a key supplier for well-known enterprises, providing products and solutions to over 2,000 companies [2]

Core Viewpoint - The report highlights the rapid growth of Jinghe Integrated Circuit's performance in the first half of 2025, with a significant increase in revenue and net profit, driven by higher sales volume and improved production efficiency [2][9]. Financial Performance - In the first half of 2025, the company achieved operating revenue of 5.198 billion yuan, an 18.21% increase compared to 4.398 billion yuan in the same period of 2024 [2]. - The net profit attributable to shareholders reached 332 million yuan, marking a 77.61% increase from 187 million yuan in the first half of 2024 [2]. - The increase in net profit and non-recurring net profit is attributed to revenue growth, high capacity utilization, reduced unit sales costs, and improved gross profit margins [2]. Market Position - The company holds a leading position in the global market for LCD panel display driver chip foundry, ranking ninth globally and third among mainland Chinese companies [3]. - The company is actively expanding into the OLED display driver chip foundry market, with expectations of increasing shipment volumes as OLED panel demand rises [3][4]. Product Development - The company has successfully commenced mass production of its 40nm high-voltage OLED display driver chips and is making progress on the 28nm OLED display driver chips, which are expected to enter risk production by the end of 2025 [4]. - The company’s CIS products cover process nodes from 90nm to 55nm, with the 55nm CIS chips being widely used in smartphone cameras [6]. Industry Trends - The global CIS market is projected to grow to 27 billion USD by 2029, with a compound annual growth rate of 6% from 2023 to 2029, driven by demand in smartphones and the automotive sector [5]. - The company is enhancing its product variety and optimizing its product structure to improve gross profit levels, with a significant portion of revenue coming from DDIC and CIS products [7]. Investment Outlook - Revenue projections for the company from 2025 to 2027 are estimated at 11.169 billion yuan, 12.715 billion yuan, and 14.184 billion yuan, respectively, with net profits expected to be 990 million yuan, 1.297 billion yuan, and 1.485 billion yuan [9].

成都华微电子科技股份有限公司2025 年半年度报告 公司代码：688709 公司简称：成都华微 成都华微电子科技股份有限公司 成都华微电子科技股份有限公司2025 年半年度报告 重要提示 一、 本公司董事会、监事会及董事、监事、高级管理人员保证半年度报告内容的真实性、准确 性、完整性，不存在虚假记载、误导性陈述或重大遗漏，并承担个别和连带的法律责任。 二、 重大风险提示 公司已在本报告中详细说明公司在经营过程中可能面临的各种风险，敬请查阅本报告"第三 节 管理层讨论与分析 四、风险因素"。 三、 公司全体董事出席董事会会议。 四、 本半年度报告未经审计。 五、 公司负责人王策、主管会计工作负责人刘永生及会计机构负责人（会计主管人员）刘永生 声明：保证半年度报告中财务报告的真实、准确、完整。 六、 董事会决议通过的本报告期利润分配预案或公积金转增股本预案 无。 七、 是否存在公司治理特殊安排等重要事项 □适用 √不适用 八、 前瞻性陈述的风险声明 √适用 □不适用 本报告所涉及未来计划、发展战略等前瞻性描述不构成公司对投资者的实质性承诺，敬请投 资者注意投资风险。 九、 是否存在被控股股东及其他关联方非经营性占 ...

Core Viewpoint - The China Securities Regulatory Commission (CSRC) has issued guidelines to encourage listed companies to establish long-term incentive mechanisms, emphasizing the alignment of interests between management, employees, and the company to enhance value creation [1] Group 1: Company Overview - Puran Co., Ltd. specializes in the design and sales of non-volatile memory chips, including NOR Flash and EEPROM, as well as microcontroller chips and analog products [2] - The company went public on the Shanghai Stock Exchange's Sci-Tech Innovation Board in August 2021, raising a net amount of 1.246 billion yuan from the issuance of 9.0572 million shares at a price of 148.90 yuan per share [2] Group 2: Equity Incentive Plans - Puran has implemented four equity incentive plans since its listing, with the first plan proposed just two months after the IPO, indicating a proactive approach to incentivizing employees [3][4] - The 2021 incentive plan aimed to grant 350,000 restricted stocks at a price of 44.67 yuan per share, significantly lower than the average trading price prior to the announcement [3] - The performance targets for the 2021 plan were not met in the first two assessment periods, with revenues of 9.25 billion yuan and 11.27 billion yuan in 2022 and 2023, respectively, falling short of the required targets [3][4] Group 3: Performance and Targets - The 2022 incentive plan also set ambitious revenue targets, with the company achieving 11.27 billion yuan in 2023, which did not meet the first target but was close to the trigger value for the second [4] - The 2024 plan set a target of 18.04 billion yuan for 2024, which was achieved, resulting in a 100% vesting rate for that period [6] - The 2025 plan has set even higher targets, with required revenue growth rates of 70% and 120% for the first two assessment periods [7] Group 4: Shareholder Actions - Major shareholders and executives have been actively reducing their holdings, with significant amounts of shares sold shortly after the expiration of lock-up periods [9][11] - The total shares sold by major shareholders amounted to approximately 2.8027 million shares, generating around 390 million yuan, while another major shareholder completely exited their position, realizing about 584 million yuan [12]

Core Points - The company, Hefei Jinghe Integrated Circuit Co., Ltd., is preparing for its 2024 annual shareholders' meeting, focusing on various proposals including the 2025 restricted stock incentive plan and the confirmation of related party transactions for 2024 [1][2][3] Meeting Procedures - Shareholders and their representatives must sign in at least half an hour before the meeting, presenting necessary identification and documentation [2][3] - The meeting will follow a structured agenda, allowing shareholders to exercise their rights to speak, inquire, and vote [2][3][4] - Voting will be conducted both on-site and online, with results announced after the meeting [4][5] Proposals Overview - Proposal 1: Revision of the company's articles of association and related registration matters [6][9] - Proposal 2: Amendments to governance rules to enhance corporate governance [9] - Proposal 3: Termination of certain fundraising projects and reallocation of funds to other projects, specifically increasing investment in the 28nm logic and OLED chip process platform project [10][15] - Proposal 4: Implementation of the 2025 restricted stock incentive plan to attract and retain talent [16][19] - Proposal 5: Establishment of assessment management measures for the 2025 restricted stock incentive plan [18] - Proposal 6: Authorization for the board to manage the 2025 restricted stock incentive plan [19] - Proposal 7: Approval of the 2024 annual report and summary [21] - Proposal 8: Approval of the 2024 financial settlement report [22] - Proposal 9: Approval of the 2025 financial budget [22] - Proposal 10: Profit distribution plan for 2024, proposing a cash dividend of 1.00 yuan per 10 shares [22][23] - Proposal 11: Presentation of the 2024 board work report [24] - Proposal 12: Presentation of the 2024 supervisory board work report [25] - Proposal 13: Presentation of the 2024 independent directors' performance reports [25] - Proposal 14: Anticipated related party transactions for 2025 and confirmation of 2024 transactions [25]

英集芯终止收购辉芒微：交易对价分歧成并购拦路 虎 此次并购计划的终止对英集芯和辉芒微都产生了一定的影响。对英集芯而言，失去了拓展产品线和 完善业务布局的机会，但避免了因高估值并购而带来的财务风险。对辉芒微而言，则失去了借助英集芯 实现快速发展的机会，可能需要继续寻求其他融资途径以推动企业发展。 总体来看，英集芯终止收购辉芒微的事件再次提醒我们，半导体行业的并购市场并非一帆风顺。企 业在进行并购决策时，需要充分考虑交易对价、行业周期、市场需求等多种因素，避免因盲目并购而带 来的风险。同时，监管部门也应加强对并购市场的监管力度，维护市场的公平、公正和透明。 注：本文结合AI生成，文中观点不构成投资建议，仅供参考。市场有风险，投资需谨慎。 MACD金叉信号形成，这些股涨势不错！ 2025年3月17日晚，半导体行业传来一则重要消息，深圳英集芯科技股份有限公司（以下简称"英集 芯"）正式宣布终止筹划收购辉芒微电子（深圳）股份有限公司（以下简称"辉芒微"）控制权的重大资 产重组事项。这一决定不仅让市场感到意外，也引发了业界对半导体行业并购市场现状的深入思考。 据英集芯公告显示，此次终止收购的主要原因在于交易相关方未能就重 ...

星标 ★ IPO日报 精彩文章第一时间推送 一起A股重大资产重组，"黄了"！ 近期，深圳英集芯科技股份有限公司（SH688209，下称"英集芯"）发布公告称，此前，公司因筹划支付现金、发行定向可转换公司债券购买辉芒微电子 （深圳）股份有限公司（下称"辉芒微"）控制权，同时拟募集配套资金的事项，公司股票自2025年3月4日（星期二）开市起停牌。但最终，公司决定终止 筹划重大资产重组事项，自3月18日开市起复牌。 据悉，英集芯为数模混合芯片商，于2022年4月19日在上交所科创板上市。标的公司辉芒微是国内少数具备微控制器芯片、电源管理芯片和存储芯片设计 能力的企业。 复牌当日，英集芯股价收报19.81元，下跌0.65%，总市值约85.03亿元。 制图：佘诗婕 01 未达成一致 此次重组终止原因系核心条款未能最终达成一致意见，主要为交易对价等核心条款。 英集芯表示，本次重组自启动以来，公司及重组相关各方积极推动本次重组的相关工作，与本次重组有关各方进行了积极磋商、反复探讨和沟通。由于交 易相关方未能就本次重组方案的交易对价等核心条款最终达成一致意见。经认真听取相关各方意见并与交易相关方协商一致，为切实维护公司及广大 ...