无线连接芯片

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AI系列专题报告(三):AIot端侧:智能硬件百花齐放,国产SoC大有可为
Ping An Securities· 2025-06-19 11:09
证券研究报告 AI系列专题报告(三) AIoT端侧:智能硬件百花齐放,国产SoC大有可为 半导体行业强于大市(维持) 徐碧云 投资咨询资格编号:S1060523070002 闫磊 投资咨询资格编号:S1060517070006 徐勇 投资咨询资格编号:S1060519090004 证券分析师 2025年6月19日 请务必阅读正文后免责条款 投资要点 处理:边缘智能推动了NPU的广泛应用。AI端侧应用正加速渗透,技术革新推动硬件升级。音频作为高频次、高强度信息交互的重要载体,正快 速成为AI落地端侧的首要信息维度。AI增强型SoC通过集成NPU与可重构计算单元,结合算法-芯片协同优化,突破传统处理器的能效瓶颈,可有 效释放边缘侧的实时推理与决策能力。NPU凭借低功耗特性成为边缘设备的理想选择,专为神经网络设计的架构使其在深度学习任务中表现优异, 主要应用于人脸识别、语音识别、自动驾驶、智能相机等领域,且技术架构随AI算法和应用场景不断演进。 连接:无线通信,物联网主要实现方式。物联网端侧连接需求持续增长,推动局域无线连接技术的应用扩展,涵盖WiFi、蓝牙、ZigBee、2.4G 私有协议、Thread等 。 各 ...
东吴证券晨会纪要-20250611
Soochow Securities· 2025-06-11 02:52
Macro Strategy - The report highlights that the merger and acquisition (M&A) market is entering a "fast lane," driven by favorable macroeconomic conditions and supportive policies, similar to the period from 2013 to 2015 [1][17][18] - The current macroeconomic environment is characterized by loose liquidity, which is conducive to M&A activities aimed at enhancing production efficiency and optimizing resource allocation [1][17] - The report notes that the focus of M&A activities is shifting towards emerging technology sectors, with significant advancements in AI, robotics, and smart driving technologies [1][17] Industry Insights - The report indicates that the current M&A wave is primarily led by state-owned enterprises, which accounted for 50% of completed projects in 2025, reflecting a strategic focus on key industries and sectors [1][17] - It emphasizes that the new M&A policies are designed to encourage high-value industries, particularly in technology, to foster innovation and industry upgrades [1][17] - The report suggests that the ongoing economic transformation necessitates M&A as a means to balance supply and demand, ultimately guiding the economy towards high-quality development [1][17] Company Recommendations - Lin Yang Energy is recommended for its stable expansion across three major business areas, benefiting from the tight electricity supply-demand balance in Hebei province [13][14] - Chipone Technology is highlighted for its leadership in ASIC chip customization, with a strong focus on AIGC and smart driving strategies, supported by a robust technology ecosystem [13][15] - Tai Ling Microelectronics is recognized for its innovative low-power wireless IoT chips, which are gaining traction in various high-value applications, positioning the company as a key player in the domestic market [13][15] - Huadong Medicine is noted for its innovative transformation, with new products expected to contribute to performance growth as the impact of previous generic drug policies diminishes [13][16]
博通集成连续三年亏损 产品销售规模尚在爬坡
Zheng Quan Shi Bao Wang· 2025-05-29 10:51
Group 1 - The core viewpoint is that Broadcom Integrated has faced three consecutive years of losses but is actively launching new chip products to enhance its market position [1][2] - In 2024, Broadcom Integrated reported a revenue of 828 million yuan, a year-on-year increase of 17.49%, while still incurring a net loss of 24.72 million yuan [1] - The company has been focusing on product iteration and market expansion, particularly in Wi-Fi, Bluetooth, and automotive chips, to address inventory issues and improve sales [1] Group 2 - The integrated circuit industry, where Broadcom Integrated operates, is characterized by rapid technological and product iteration, necessitating continuous innovation and market adaptation [2] - The company faces multiple risks in new product development, including potential misjudgment of market demand, extended R&D cycles, and challenges in market penetration due to immature product solutions [2] - Broadcom Integrated is also exposed to competitive risks from well-funded international firms like Qualcomm and MediaTek, as well as domestic competitors in the rapidly growing IC design sector [2]