Workflow
灌胶机
icon
Search documents
2026年中国点胶机行业发展现状、竞争格局及趋势预测
Sou Hu Cai Jing· 2025-11-25 14:11
点胶机,又可称为涂胶机、滴胶机、打胶机、灌胶机等,是一种能够控制流体形态、流量和涂覆路径,将各类粘性材料精准施加到工件表面或内部的设备, 核心作用是实现粘结、密封、灌封等工艺。 产业链来看,上游为零部件供应环节,涉及液压缸、伺服电机、压电阀、点胶阀、计量泵等;中游为点胶机整机制造环节,主要通过集成控制算法与智能模 块,形成可用整机并提供运维服务;下游则是应用环节,主要包括医疗器械、电子、汽车等领域。 在消费电子产品生产中,众多环节都离不开点胶工艺;芯片封装、PCB板涂覆、摄像头模组粘接等关键环节均依赖高精度点胶,屏幕与边框的密封、电池固 定、防水防尘处理等均需自动化点胶,消费电子正是点胶机目前最大应用领域。2023年,中国消费电子行业市场规模约为19201亿元。 伴随着我国电子制造业的快速发展,点胶机在电子元件组装、半导体封装等领域的应用日益广泛,推动了市场需求的持续增长。过去,高端点胶机市场长期 被国际品牌垄断,但近年来,本土企业通过加大研发投入,提升产品性能和质量,凭借性价比优势快速渗透中端市场。2024年,中国点胶机市场规模约为 459.79亿元。 华经产业研究院研究团队使用桌面研究与定量调查、定性分析 ...
安达智能营收稳步攀升,加快挖掘AI服务器、氢能源等新蓝海市场
Core Viewpoint - The company faced challenges in the first half of 2025, including global trade tensions impacting overseas sales, but is actively working to enhance profitability through resource optimization and market expansion efforts [1][2]. Financial Performance - In the first half of 2025, the company achieved operating revenue of 342.59 million yuan, a year-on-year increase of 9.55% [1]. - Total assets at the end of the period reached 2.39 billion yuan, reflecting a growth of 4.93% from the beginning of the year [1]. - The overall gross margin declined due to lower initial gross margins on new products and changes in revenue structure [1]. Market Strategy - The company accelerated its overseas market expansion and strengthened its supply chain resilience [2]. - It reinforced its supply advantages with major global consumer electronics clients and increased efforts in emerging markets such as AI servers and hydrogen energy [2]. Research and Development - R&D investment totaled 62.04 million yuan, accounting for 18.11% of operating revenue [3]. - The company employed 411 R&D personnel, representing 25.31% of its total workforce [3]. - Significant progress was made in developing new intelligent valve bodies and optimizing existing models, enhancing product performance and stability [3]. Future Outlook - The company aims to drive smart manufacturing upgrades, focusing on R&D and product innovation while expanding into new fields such as automotive electronics and semiconductor packaging [4]. - It plans to implement Management By Plan (MBP) to optimize business structure and resource allocation, aiming to improve overall profitability and operational efficiency [4].