Core Viewpoint - The announcement indicates that Henan Tailong Pharmaceutical Co., Ltd. has canceled the issuance of its first phase of technology innovation bonds for 2025 due to recent market volatility [1] Group 1: Bond Issuance Details - The initial issuance amount for the bonds was set at 0 billion, with a maximum issuance limit of 4 billion [1] - The planned issuance dates were September 18 and September 19, 2025 [1] Group 2: Future Plans - Henan Tailong Pharmaceutical intends to reissue the bonds at a later date after consulting with the lead underwriter [1] - The company will comply with the relevant regulations for the subsequent issuance, repayment, and information disclosure of the technology innovation bonds [1] Group 3: Market Performance - As of the market close, Henan Tailong Pharmaceutical's stock price was reported at 6.43 yuan per share [1]

Core Points - The company successfully issued its first phase of technology innovation bonds for the year 2025, with the funds raised on August 29, 2025 [2] - The total amount registered for the short-term financing bond is capped at 500 million RMB, with a two-year validity period for issuance [1] - The bond has a maturity of 182 days, with an interest rate of 2.8% and a face value issuance price of 100.00 [2] Summary by Sections - **Bond Issuance Details** - The company completed the issuance of its first phase of technology innovation bonds on August 29, 2025, with the funds successfully received on the same day [2] - The bond is identified as SCP001, with a maturity date set for February 27, 2026 [2] - **Financial Information** - The planned issuance amount was 50 million RMB, and the actual issuance amount was also 50 million RMB [2] - The bond's interest rate is set at 2.8% [2] - **Use of Proceeds** - The funds raised from this bond issuance will be used to repay existing borrowings [2] - **Regulatory Compliance** - The company is not listed as a subject of credit default as verified through the "Credit China" website [2]

Core Points - Shentong Express announced the issuance of its first phase of technology innovation bonds for 2025, with a total scale of 700 million yuan and a low interest rate of 2.08% [1] - The bond issuance attracted participation from 13 investment institutions, achieving a subscription multiple of 2.4 times and a marginal multiple of 2.48 times [1] - The raised funds will be used to supplement the working capital of Shentong Express and its subsidiaries, with 50% allocated to Shanghai Shinxue Supply Chain Management Co., Ltd. for operational expenses and technology research and development [1] - The issuance of these bonds is expected to strengthen the company's internal R&D capabilities and support its digital transformation strategy, while also reducing financing costs and improving short-term debt repayment pressure [1]

Group 1 - The core viewpoint of the article is that Zhejiang Yiwu Rural Commercial Bank successfully issued its "2025 Annual First Phase of Technology Innovation Bonds" on August 26, with a total issuance scale of 300 million RMB and a maturity period of 5 years at a coupon rate of 1.90% [1] - The bond issuance was underwritten by Guotai Junan Securities Co., Ltd. and CITIC Construction Investment Securities Co., Ltd. as the lead underwriters [1]

（编辑 楚丽君） 证券日报网讯 8月11日晚间，璞泰来发布公告称，公司根据自身经营状况、资金使用计划和银行间市场 情况，于2025年8月6日至8月7日在全国银行间市场发行了2025年度第一期科技创新债券。 ...

上海璞泰来新能源科技股份有限公司 证券代码：603659 证券简称：璞泰来 公告编号：2025-059 招商银行股份有限公司、宁波银行股份有限公司、大连银行股份有限 联席主承销商 公司、上海银行股份有限公司 本次中期票据发行的有关文件详见中国货币网（www.chinamoney.com.cn） 和上海清算所网站（www.shclearing.com.cn）。 特此公告。 上海璞泰来新能源科技股份有限公司 董 事 会 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 上海璞泰来新能源科技股份有限公司（以下简称"公司"）于2024年7月1 日召开第三届董事会第二十六次会议、2024年7月17日召开2024年第一次临时股 东大会审议通过了《关于拟注册发行债务融资工具的议案》，同意公司向中国 银行间市场交易商协会申请注册发行不超过人民币20亿元（含20亿元）的债务 融 资 工 具 。 具 体 内 容 详 见 公 司 于 2024 年 7 月 2 日 在 上 海 证 券 交 易 所 网 站 （www.sse.com.cn）及指定媒体披露的 ...

Core Viewpoint - Hengli Petrochemical Co., Ltd. has successfully issued its first phase of technology innovation bonds for 2025, raising a total of 1 billion yuan at an interest rate of 1.85% [2][3]. Group 1: Bond Issuance Details - The company held a board meeting on April 9, 2024, to approve the registration for issuing short-term financing bonds, with a maximum amount of 3 billion yuan [2]. - The registration for the short-term financing bonds was accepted by the trading association, with a validity period of 2 years from the date of the notice [2]. - The technology innovation bonds were issued on June 25, 2025, with a total planned issuance of 1 billion yuan, which was fully realized [2]. Group 2: Bond Characteristics - The bond has a maturity of 365 days, with an interest start date of June 26, 2025, and a repayment date of June 26, 2026 [2]. - The bond code for the issued technology innovation bond is 042580325, and it was issued at a price of 100 yuan per 100 yuan face value [2]. - The main underwriter for this bond issuance is Industrial Bank Co., Ltd., with joint underwriters including China Merchants Bank Co., Ltd. and China Postal Savings Bank Co., Ltd. [2].