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摩根士丹利:全球背景下中国人工智能半导体发展;台积电前瞻
摩根· 2025-07-09 02:40
July 7, 2025 07:58 PM GMT Investor Presentation | Asia Pacific Tuesday TMT Webcast: China's AI Semi Development in a Global Context; TSMC Preview | M | | | | --- | --- | --- | | | | Update | | July 7, 2025 07:58 PM GMT | | | | Investor Presentation Asia Pacific | Morgan Stanley Taiwan Limited+ | | | | Charlie Chan | | | | Equity Analyst Charlie.Chan@morganstanley.com | +886 2 2730-1725 | | Tuesday TMT Webcast: China's | Daniel Yen, CFA | | | | Equity Analyst | | | AI Semi Development in a | Daniel.Yen@morga ...
摩根士丹利:全球背景下的中国人工智能半导体发展
摩根· 2025-06-19 09:47
Investment Rating - Industry View: In-Line [5] Core Insights - The semiconductor industry is experiencing unprecedented demand driven by AI advancements and geopolitical tensions [3][5] - China's AI semiconductor market is expected to see significant growth, with local GPU revenue projected to reach Rmb287 billion by 2027 [21][19] - The overall AI semiconductor market is anticipated to deliver over 30% CAGR from 2023 to 2030, with inference AI semiconductors growing at 55% CAGR [78][77] Summary by Sections China AI Semi Demand and Supply - The top six companies' capital expenditures are forecasted to grow 62% YoY to Rmb373 billion [10] - China's GPU self-sufficiency ratio was 34% in 2024 and is expected to reach 82% by 2027 [16] - The total addressable market (TAM) for China's cloud AI is projected to be US$48 billion by 2027 [18] Semiconductor Solutions and Technology Trends - Moore's Law is expected to continue with chip scaling to 3nm/2nm for better power efficiency [78] - Advanced packaging technologies like CoWoS and SoIC are being utilized to increase data speed and memory bandwidth [78] - The EDA market in China is projected to grow at a 12% CAGR from 2023 to 2030, reaching US$3.3 billion [29] Investment Opportunities - AI semiconductors are expected to account for approximately 34% of TSMC's revenue by 2027 [148] - The demand for custom AI semiconductors is increasing, driven by major cloud service providers and tech companies [120][121] - The global semiconductor market size may reach US$1 trillion by 2030, with AI semiconductors being a major growth driver [59]
China's racing to build its AI ecosystem as U.S. tech curbs bite. Here's how its supply chain stacks up
CNBC· 2025-06-12 03:55
In this articleNVDA"Compared to Nvidia's export-restricted chips, the performance gap between Huawei and the H20 is less than a full generation," said Dylan Patel, founder, CEO and chief analyst of SemiAnalysis. Sinology | Moment | Getty ImagesWith the U.S. restricting China from buying advanced semiconductors used in artificial intelligence development, Beijing is placing hopes on domestic alternatives such as Huawei. The task has been made more challenging by the fact that U.S. curbs not only inhibit Chin ...
摩根士丹利:Investor Presentation-全球人工智能半导体需求与供应链
摩根· 2025-06-11 02:16
Investor Presentation | Asia Pacific Asia Summer School: Tech Diffusion: Global AI Semi Demand and Supply Chain June 9, 2025 09:33 AM GMT As AI reshapes our daily life, the semiconductor industry faces unprecedented demand and even geopolitical tensions. In this session, we will provide an overview of the evolving global AI semi market, including the critical dynamics of the supply chain and China's accelerated AI localization push. | M | Charlie Chan | Foundation | | --- | --- | --- | | June 9, 2025 09:33 ...
五大原因,英伟达:无法替代
半导体芯闻· 2025-06-06 10:20
日益白热化的全球人工智能(AI) 芯片市场,尽管华为(Huawei) 推出Ascend 910C GPU 寄望协助 中国摆脱依赖英伟达(NVIDIA),但遇到明显阻力。 Wccftech 报导,字节跳动、阿里巴巴和腾讯等中国科技大厂,至今仍未大量订购华为AI 芯片。因 英伟达根深蒂固的生态系统(如CUDA 软体) 与华为产品不足。华为910C GPU 缺乏科技企业订 单,转向中国大型国企(SOEs) 和地方政府采购。市场策略转变,突显华为AI 芯片抢占主流市场的 严峻挑战。 来源:内容来自 wcctech 。 华为AI 芯片推广面临五大障碍,是多重因素交织,共同造成华为Ascend 910C GPU 市场推广巨 大阻力。这些障碍不仅限制了华为市场渗透率,也让中国科技大厂对产品望而却步。 首先,英伟达的CUDA 生态系统的根深蒂固。中国许多科技大逞在英伟达的CUDA 生态系统中投 入了大量资金与时间。 CUDA 是英伟达专为其GPU 开发的平行计算平台和程式设计模型,广泛应 用于AI 训练和高性能计算领域,其成熟的工具、函式库和庞大的开发者社群,已形成了一个难以 打破的「护城河」。 对于这些科技公司而言,一旦脱 ...
2025半导体战国风云(附13页PPT)
材料汇· 2025-05-17 15:07
点击 最 下方 " 推荐"、"赞 "及" 分享 ","关注"材料汇 添加 小编微信 ,遇见 志同道合 的你 正文 | | | 2000 00 1 02 103 00 100 10 1 0 5 06 100 1 11 1 2 1 13 1 4 1 15 [ 16 [ 17 [ 18 [ 19 [ 20 ] 21 [ 22 [ 23 [ 24 [ 25 [ 26 ] 20 ] 30 ] 31 ] 32 ] | | | | | | --- | --- | --- | --- | --- | --- | --- | | 元件架構 | 不用式 | FINFET | | GAABE | | | | DUV(248/193nm) 光學系統 | STEREDIV | | | | | Hi-NA EUV | | 台槽電 C018/C013 IN90 | N28 IND NO NO IN | | INS | N4 N3 N2 I | 116Al | 14A | | Intel IC013 | N77/20 | | | Intel-7 Intel-4/3 Intel-20A/18Al Intel-14A | | | | Samsu ...
疯传的芯片BIS-1最新原文
2025-05-14 02:38
Guidance on Application of General Prohibition 10 (GP10) to People's Republic of China (PRC) Advanced-Computing Integrated Circuits (ICs) APPLICABLE REGULATIONS May 13, 2025 SUMMARY This guidance alerts industry to the risks of using PRC advanced-computing ICs, including specific Huawei Ascend chips. These chips were likely developed or produced in violation of U.S. export controls. BIS is warning that, pursuant to GP10, the use of such PRC advanced- computing ICs risks violating U.S. export controls and ma ...
摩根士丹利:没有美国芯片中国能行吗?
摩根· 2025-05-07 02:10
May 6, 2025 08:32 AM GMT 亚洲科技 | Asia Pacific 科技脉动⸺没有美国芯片中 国能行吗? 华为推出了一种新的AI计算机架系统CloudMatrix 384超节点, 可以与世界上最好的AI基础设施技术相媲美。这也许可以让中 国解决其计算能力瓶颈,在不依赖西方的情况下训练自己的 模型,并为下一波AI创新提供动力。 中国AI硬件的突破⸺新的AI加速器和机架级架构:华为的CloudMatrix 384超节点 是基于384颗华为Ascend 910C AI芯片构建的机架级系统。虽然在单芯片性能方面 落后,但在系统性能方面与GB200 NVL72相当,计算能力为300 PFLOPS(千万亿 次),超过英伟达NVL72系统的180 PFLOPS。创新更多是在系统层面,包括网 络、光学和软件层,但与英伟达Blackwell芯片相比是需要五倍数量的Ascend芯片 来抵消性能差距。华为已经与硅基流动等中国AI基础设施公司合作实施 了CloudMatrix 384超节点,以支持DeepSeek-R1。 为何重要:这解决了中国独特的制约因素⸺出口管制和晶圆供应⸺但也发挥了 其规模和强大实力的可 ...