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【太平洋科技-每日观点&资讯】(2025-05-29)
远峰电子· 2025-05-28 11:40
Market Performance - The main board led the gains with notable increases in stocks such as Yuyin Co. (+10.08%), Chaoxun Communication (+7.09%), and Yongding Co. (+7.03%) [1] - The ChiNext board saw significant growth with New Guodu (+16.30%) and Xiechuang Data (+11.81%) leading the charge [1] - The Sci-Tech Innovation board was also up, with Dekeli (+7.58%) and Qingyue Technology (+7.19%) showing strong performance [1] - Active sub-industries included SW Communication Network Equipment and Devices (+1.94%) and SW Communication Terminals and Accessories (+1.20%) [1] Domestic News - Aibang Semiconductor Network announced a total investment of 1.2 billion, with Hanjin Technology's silicon carbide packaging project reaching completion, capable of producing 300,000 silicon carbide power modules and 50 million silicon carbide power devices annually [1] - TSMC reported a surge in demand for CoWoS chip manufacturing materials, leading to shortages in the memory market, with Mitsubishi Gas Chemical announcing delays in shipments of materials for BT substrates [1] - Changfei Advanced's Wuhan base achieved mass production, with the first 6-inch silicon carbide wafer successfully produced, expected to reach an annual production capacity of 360,000 silicon carbide chips [1] - Anhui Huaxin Micro-Nano Integrated Circuit Co. announced the successful production of the first batch of products from its 8-inch wafer production line, which will have a monthly production capacity of 30,000 wafers [1] Company Announcements - Huajin Technology announced a 2024 annual equity distribution plan, distributing 9 yuan for every 10 shares [3] - Jingyan Technology also announced a 2024 annual equity distribution plan, distributing 1.10 yuan in cash dividends for every 10 shares [3] - Airong Software reported receiving a government subsidy of 7.201 million yuan, accounting for 10.85% of the company's audited net profit for the last fiscal year [3] - Yingfang Micro disclosed a pre-announcement of share reduction by a major shareholder, planning to reduce up to 1% of shares through centralized bidding [3] Overseas News - IBM and Deca Technologies formed a significant alliance in the semiconductor packaging sector, allowing IBM to enter the advanced fan-out wafer-level packaging market [2] - Rohm launched its first high-voltage GaN driver IC, which enhances the stability of GaN devices during high-frequency and high-speed switching [2] - In April, iPhone exports from India to the U.S. increased by 76% year-on-year, while exports from China decreased by 76%, reflecting Apple's accelerated manufacturing plans in India [2] - Samsung is reportedly exiting the MLC NAND flash memory market, notifying customers that orders will only be accepted until June, prompting a search for new suppliers [2]
台积电(TSM):1Q25业绩点评:Q2指引超预期,AI需求保持强劲
Xinda Securities· 2025-04-18 09:19
台积电 1Q25 业绩点评: Q2 指引超预期,AI 需求保持强劲 [Table_ReportDate] 2025 年 4 月 18 日 证券研究报告 行业研究 [行业事项点评 Table_ReportType] [Table_StockAndRank] 电子 投资评级 看好 信达证券股份有限公司 CINDA SECURITIES CO.,LTD 北京市西城区宣武门西大街甲127号金隅 大厦B座 邮编:100031 [台积电 Table_Title] 1Q25 业绩点评:Q2 指引超预期,AI 需求 保持强劲 [Table_ReportDate] 2025 年 4 月 18 日 请阅读最后一页免责声明及信息披露 http://www.cindasc.com 2 本期内容提要: [Table_S [➢Table_Summary 1Q2ummar 5 营收和毛利率均 y] ] 符合指引:1Q25,台积电实现营收 255.3 亿美元(8392.5 亿新台币),同比+35.3%,环比-5.1%,之前指引 为 250~258 亿美元;毛利率为 58.8%,同比+5.7ppt,环比- 0.2ppt,此前指引为 57.0% ...