内容概要：受益于新能源汽车市场的爆发式增长，近年来我国碳化硅功率模块的市场需求进入高速扩容 阶段，800V高压平台车型的快速渗透，直接带动主驱逆变器、车载充电机等核心部件对碳化硅模块的 大规模采用，成为需求增长的核心引擎，与此同时，光伏储能、新型电网、轨道交通等工业领域，也因 对"高效率、高功率密度、高可靠性"的技术升级诉求，持续扩大碳化硅功率模块的应用比例，多场景需 求共振推动我国碳化硅功率模块市场规模持续扩大，据统计，2024年我国碳化硅功率模块行业市场规模 统计达50亿元，同比增长31.6%，占全球碳化硅功率模块行业整体规模的28.4%。 相关上市企业：华润微（688396）、三安光电（600703）、时代电气（688187）、士兰微（600460）、 斯达半导（603290）、扬杰科技（300373） 相关企业：意法半导体（中国）投资有限公司、安森美半导体（深圳）有限公司、英飞凌科技（中国） 有限公司、派恩杰半导体（浙江）有限公司、深圳基本半导体股份有限公司、泰科天润半导体科技（北 京）有限公司、比亚迪半导体股份有限公司、广东芯聚能半导体有限公司 关键词：碳化硅功率模块行业发展历程、碳化硅功率模块市场 ...

2025年12月4日，深圳基本半导体股份有限公司（下称"基本半导体"）在一周前其首份招股书失效后，迅速向港交所递交了更新至2025年6月30日的招股 书，为冲刺"港股碳化硅芯片第一股"奋力一搏。 这家由清华、剑桥博士团队创立，集结了博世创投、闻泰科技、广汽资本等明星股东的碳化硅IDM企业，深耕新能源汽车、储能等高增长赛道，深度契合 国产替代的产业趋势，营收持续保持增长态势，看似踩准了时代风口。 然而，光鲜的增长叙事背后，是持续扩大的亏损、紧绷至极限的现金流以及战略上难以突围的竞争困境。 营收高增难掩亏损 基本面造血能力缺失 翻开基本半导体的招股书，表面呈现出的是一张高速增长的业绩表。招股书显示，2022年至2024年，基本半导体营收分别为1.17亿元、2.21亿元、2.99亿 元，2025年上半年营收进一步增至1.04亿元，同比增长52.74%，营收规模持续扩张。 | | | | 截至12月31日止牛皮 | | | | | 截至6月30日止六個月 | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | | 2022 ...

由于长期亏损，基本半导体的财务状况堪忧，报告期内资产负债率从38.41%攀升至86.61%，自2023年起流动资产就已经远低于流动负债，即营运 资金常年为负。核心业务本身无法产生正向现金流来支持运营和偿还债务，导致公司持续依赖外部融资"输血"维持生命。 控股股东多次减持套现 董事长三年半领薪5000万元 出品：新浪财经上市公司研究院 作者：君 12月4日，深圳基本半导体股份有限公司（下称"基本半导体"或"公司"）再次向联交所提交上市申请，拟根据《上市规则》第18C章在主板上市， 中信证券、国金证券、中银国际为联席保荐人。 报告期内，基本半导体核心产品碳化硅功率模块及分立器件的毛利率持续为负，陷入"越卖越亏"的困局，三年半净亏损近10亿元。这固然有行业 价格战的外部因素，但更深层次的原因，似乎应归结于其自身的战略选择——即IDM全产业链模式带来的高昂折旧、研发和运营成本，叠加了其 为抢占市场份额而采取的激进低价策略。 或许是因为创始团队的背景，在2016年成立之初，基本半导体得到了深圳清华大学研究院的支持，双方共建第三代半导体材料与器件研发中心； 由清华大学研究院控股的力合科创成为基本半导体的天使投资人，并在之 ...

招此前股书显示，基本半导体是中国第三代半导体功率器件行业的领先企业，专注于碳化硅功率器件的研发、制造及销售。作为该领域的先驱者，该公司是 中国唯一一家整合了碳化硅芯片设计、晶圆制造、模块封装及栅极驱动设计与测试能力的企业。基本半导体的碳化硅功率模块的销量由2022年的超过500件 增至2023年的超过30,000件，并进一步增至2024年的超过61,000件。 深圳基本半导体股份有限公司(简称：基本半导体)于5月27日所递交的港股招股书满6个月，于11月27日失效，递表时中信证券、国金证券(香港)有限公司、 中银国际为其联席保荐人。 ...

Group 1 - The photovoltaic industry in China saw a new installed capacity of 231 GW from January to August 2025, representing a year-on-year growth of 65%, indicating sustained high demand in the sector [1] - In the power equipment sector, breakthroughs in silicon carbide (SiC) power module technology have been achieved, with new ultra-low inductance intelligent (ULIS) modules showing significant optimizations in switching speed, efficiency, and cost, being 3-5 times faster than commercial modules, achieving 99.5% efficiency, and reducing costs by over 30% [1] - Gree Electronics and the University of Electronic Science and Technology of China have jointly established a silicon carbide device research center to promote technological breakthroughs and industrialization, which is expected to accelerate the process of domestic substitution [1] Group 2 - The photovoltaic 50 ETF (159864) tracks the photovoltaic industry index (931151), which selects listed company securities involved in silicon materials, wafers, battery cells, modules, and photovoltaic equipment from the Shanghai and Shenzhen markets to reflect the overall performance of upstream and downstream enterprises in the photovoltaic industry chain [1] - This index focuses on the renewable energy sector, characterized by high growth potential and policy orientation [1]

Core Viewpoint - Hebei Zhongci Electronic Technology Co., Ltd. has experienced significant growth in net profit in the first half of 2025, driven by the increase in high-end product output and effective cost reduction measures [1] Group 1: Financial Performance - The company's net profit for the first half of 2025 increased due to the ramp-up of high-end products and significant improvements in profitability [1] - The company maintains a high capacity utilization rate, seizing opportunities in the optical module market to accelerate the construction of electronic ceramic shell production lines [1] Group 2: Industry Opportunities - The growth in AI computing power demand is driving the development of the digital economy, leading to sustained growth in the semiconductor and communication industries [1] - The market for optical modules and semiconductor equipment is expanding, with the company aiming to increase its market share in the third-generation semiconductor gallium nitride (GaN) RF chips and devices [1] Group 3: Product Development - The company is actively involved in the research and development of 3.2Tbps products in collaboration with clients, with current optical communication device shell transmission rates covering 2.5Gbps to 10Gbps [1] - The company has upgraded its silicon carbide (SiC) chip wafer process line from 6 inches to 8 inches, which is currently in the product upgrade and customer introduction phase [1] Group 4: Project Progress - The construction of the "GaN microwave product precision manufacturing production line" and "communication power amplifier and microwave integrated circuit R&D center" is underway, with the main structure already completed [1] - The timeline for the "third-generation semiconductor process and testing platform construction project" has been extended to October 2027 due to various objective factors [1] Group 5: Technological Advancements - The subsidiary, Bowei Company, is advancing key technology breakthroughs and R&D for RF chips and devices for next-generation communication systems, including 5G-A, 6G, and Starlink communication [1] - The company has developed core materials and supporting metallization systems for precision ceramic components, achieving international standards and user validation for its ceramic heating plate products [1]

Group 1: Company Overview and Market Position - Hebei Zhongci Electronic Technology Co., Ltd. is a leading competitor in the domestic electronic ceramics industry, recognized for its significant influence and market share in electronic ceramic shells [2][3] - The company has established strong partnerships with several world-renowned optical communication manufacturers, enhancing its market presence [2] - In the field of third-generation semiconductors, the company holds the top domestic market share for GaN RF chips and devices, achieving both domestic leadership and international advanced levels in product technology and reliability [3] Group 2: Future Development and Strategic Opportunities - The company aims to leverage the surge in AI technology and the resulting demand for computing power to expand its optical communication product advantages and increase market share in consumer electronics [3][4] - Plans include the construction of production lines for electronic ceramic shells to enhance production capacity and the development of ceramic components for semiconductor equipment [3][4] - The company is focusing on the low-altitude economy, targeting markets for UAV packaging and GaN power amplifier technology breakthroughs [5] Group 3: Value Management and Corporate Strategy - Value management is defined as maximizing company value and shareholder interests through effective management of intrinsic value, emphasizing "internal strength and external image" [6] - The company is committed to enhancing its core competitiveness through technological innovation and strategic acquisitions, particularly in AI computing, commercial aerospace, low-altitude economy, and new energy vehicles [6] - Efforts to improve information disclosure quality and investor relations management are underway to ensure transparent communication and stable market expectations [6]

Core Insights - The adoption of silicon carbide (SiC) power modules is transitioning from a high-performance option to a core hardware driving the energy revolution, evidenced by Tesla's Model 3 and BYD's cost reductions [2][4] - SiC's superior physical properties enable its application across various sectors, including electric vehicles, photovoltaic energy storage, and industrial motors, leading to a more efficient and reliable electronic power system [2][4] - The industry is on the brink of explosive growth, shifting focus from usability to cost-effectiveness and stability, with China leveraging its large renewable energy market and strong policy support [2][4] Group 1: Efficiency Revolution - SiC is redefining power electronics through its wide bandgap and superior thermal and electrical properties, allowing for higher efficiency and performance in applications like photovoltaic inverters [4][5] - SiC devices can operate at temperatures above 200°C and have a breakdown field strength ten times that of silicon, significantly enhancing system performance [4][5] Group 2: Multi-Scene Empowerment - SiC's influence extends beyond electric vehicles to include photovoltaic systems, energy storage, and AI data centers, showcasing its versatility and efficiency improvements [6][7] - In the electric vehicle sector, SiC MOSFETs can enhance driving range by approximately 5% and enable rapid charging capabilities [6][7] Group 3: Flywheel Model - The development of the SiC industry follows a flywheel model where technological advancements lead to cost reductions, which in turn promote application penetration and scale demand [9][10] - The transition from 6-inch to 12-inch wafers is a key driver for reducing manufacturing costs by 30-40%, facilitating broader market adoption [9][10] Group 4: Multi-Polar Application Demand - The growth of the SiC market is driven by diverse applications, including electric vehicles, photovoltaic energy systems, and industrial energy upgrades, creating a synergistic effect that accelerates technology iteration and cost reduction [21][22] - The penetration of SiC in electric vehicles is expected to reach 20% by 2025, with significant adoption across various vehicle models [22][24] Group 5: Global Landscape and Competitive Dynamics - The global SiC market is dominated by US, European, and Japanese companies, with significant market shares and competitive strategies focused on technology patents and price competition [34][35] - Chinese companies are rapidly advancing in the SiC industry, achieving notable progress in substrate materials and module packaging, although challenges remain in high-end chip design and manufacturing [37][38] Group 6: Future Outlook and Investment Strategies - The SiC industry is expected to continue its rapid growth, with a focus on technological breakthroughs, cost control, and ecosystem collaboration as key competitive factors [54][55] - Investment strategies should prioritize companies with established competitive advantages, strong customer relationships, and the ability to scale production effectively [51][52]

Group 1 - The company is developing a solution based on NVIDIA Orin, aiming for mass production by the end of this year, which includes urban NOA functionality along with 11 cameras and radar [2] - The competitive landscape for intelligent driving in the Chinese market is intense, with increasing regulatory scrutiny and stricter controls on advertising by car manufacturers [2] - The company's high R&D investment over the past few years has started to yield positive results, particularly in domain controllers, chassis, and new energy sectors [2] - The company is enhancing its overseas presence with investments in a factory in Malaysia and a research center in Germany, which are expected to translate into actual output [2] Group 2 - In the major assembly business, the company has early layouts for battery packs, electric drive bridges, and integrated thermal management, with some battery pack models already in mass production for special vehicle platforms [3] - Integrated thermal management and electric drive bridges are still in the R&D phase, with plans for initial applications in special vehicle platforms and autonomous transport tools [3] - The company has also developed products like silicon carbide power modules during the R&D of large assemblies, which have gained recognition from supply chain partners and customers [3]

Core Viewpoint - Hebei Zhongci Electronic Technology Co., Ltd. has shown significant growth in its performance in the first half of 2025, with expectations for continued development in the second half, driven by advancements in high-end products and cost reduction efforts [2][4]. Financial Performance - The company reported a revenue of 1.398 billion yuan, representing a year-on-year increase of 14.37% - The net profit attributable to shareholders reached 278 million yuan, marking a year-on-year growth of 30.92% [2]. R&D Progress - In the electronic ceramics sector, the company is enhancing its advantages in communication devices and automotive electronics while developing consumer electronic ceramic shells and substrates [3]. - The production line for electronic ceramic shells is being accelerated to capture opportunities in the optical module market, with significant growth in aluminum nitride ceramic substrate products [3]. - The company is focusing on the third-generation semiconductor gallium nitride RF chips and devices, implementing a market-driven expansion strategy [3]. Business Outlook - The company maintains the top market share in the domestic gallium nitride communication base station RF device sector and is gaining recognition in the high-voltage field of silicon carbide power semiconductors [4]. - The company has four fundraising projects, with some projects experiencing delays in reaching the predetermined usable status until October 2027 [4]. Market Strategy - The company aims to enhance its investment value through quality development, industry chain layout, and governance system improvements [5].