以下文章来源于格隆汇交易学苑 ，作者格隆汇小编 格隆汇交易学苑 . 以基本面为基础，专注于趋势交易 AI算力 卷到白热化，芯片却快 " 热炸 " 了！ 英伟达 H100 峰值功耗超 700W ，下一代 Rubin 处理器直奔 1800W ， 2029 年甚至要冲到 6000W 。算力飙升的背后，是传统封装的 " 崩溃 "—— 硅中介层散热跟不上、容易开裂， CoWoS 封装的 " 功耗墙 " 成了 AI 算力的致命瓶颈。 而破局的关键，藏在 " 先进封装 +SiC" 的组合里。台积电广发英雄帖推进 SiC 中介层，英伟达计划 2027 年导入 12 英寸 SiC 衬底，产业 巨头集体押注。 A 股市场早已闻风而动：先进封装指数 年初至今涨幅超 1 4 % ，长电科技单日成交额破 50 亿，晶盛机电、天岳先进等 SiC 标的异动，一场 由 "AI 算力刚需 +SiC 技术突破 + 国产替代 " 驱动的盛宴，已经开席！ （ 来源：同花顺 ） 01 这时候先进封装站了出来。通过 2.5D/3D 堆叠、混合键合、 SiC 中介层替代等技术，不仅能解决散热难题，还能让芯片互连密度提升 10 倍 以上，成为超越摩尔定律的 ...

Core Viewpoint - The interposer has transitioned from a supporting role to a focal point in the semiconductor industry, with major companies like Resonac and NVIDIA leading initiatives to develop advanced interposer technologies [1][28]. Group 1: Definition and Importance of Interposer - Interposer serves as a critical layer between chips and packaging substrates, enabling high-density interconnections and efficient integration of various chiplets into a system-in-package (SiP) [3][5]. - The interposer is essential for achieving higher bandwidth, lower latency, and increased computational density in advanced packaging [3][5]. Group 2: Types of Interposers - Two main types of interposers are currently in production: Silicon Interposer (inorganic) and Organic Interposer (Redistribution Layer) [5][6]. - Silicon Interposer has been established since the late 2000s, with TSMC pioneering its use in high-performance computing [6]. - Organic Interposer is gaining traction due to its lower production costs and flexibility, despite challenges in wiring precision and reliability [6][23]. Group 3: JOINT3 Alliance - The JOINT3 alliance, led by Resonac, consists of 27 global companies aiming to develop next-generation semiconductor packaging, focusing on panel-level organic interposers [8][11]. - The alliance plans to establish a dedicated center in Japan for advanced organic interposer development, targeting a significant increase in production efficiency and cost reduction [11][12]. - The shift to organic interposers is driven by the limitations of silicon interposers, particularly in terms of geometric losses and production costs [11][12]. Group 4: SiC Interposer as a New Direction - NVIDIA is exploring the use of Silicon Carbide (SiC) interposers for its next-generation GPUs, indicating a potential shift in materials used for interposers [17][19]. - SiC offers superior thermal conductivity and electrical insulation, making it suitable for high-performance AI and HPC applications, although manufacturing challenges remain [19][25]. Group 5: Competitive Landscape of Interposer Materials - The competition among silicon, organic, and SiC interposers is characterized by their respective advantages and disadvantages, influencing performance, cost, and scalability [20][22][23]. - Silicon interposers are currently dominant but face challenges as chip sizes increase, while organic interposers are expected to gain market share due to cost advantages [22][26]. - SiC interposers, if successfully developed, could become the standard for cutting-edge AI and HPC packaging in the long term [26]. Group 6: Future Trends - In the short term, silicon interposers will remain the market leader, while organic interposers are anticipated to see widespread adoption in the mid-term due to their cost and scalability benefits [26]. - Long-term projections suggest that SiC interposers may emerge as the preferred choice for advanced packaging once manufacturing hurdles are overcome [26].