Investment Rating - The report maintains a "Buy" rating for ASMPT, indicating a positive outlook for the company's future performance [2]. Core Insights - The company's Q3 2025 revenue reached USD 468 million (HKD 3.661 billion), reflecting a year-over-year increase of 10% and a quarter-over-quarter increase of 8%, aligning with previous guidance [1]. - The semiconductor solutions business generated revenue of HKD 1.88 billion (USD 240 million), up 5% year-over-year but down 7% quarter-over-quarter, driven by AI infrastructure demand and strong electric vehicle demand in China [1]. - The SMT business saw revenue of HKD 1.78 billion (USD 228 million), a 15% year-over-year increase and a 28% quarter-over-quarter increase, benefiting from AI server demand and smartphone orders [1]. - The overall new orders in Q3 amounted to USD 463 million, a 14% year-over-year increase but a 4% quarter-over-quarter decrease [1]. - The company expects Q4 2025 revenue to be between USD 470 million and USD 530 million, with a midpoint indicating a 14% year-over-year increase and a 7% quarter-over-quarter increase, exceeding market expectations [1]. Summary by Sections Financial Performance - Q3 2025 adjusted net profit was HKD 1.02 billion, a 245% increase year-over-year but a 24% decrease quarter-over-quarter [1]. - The adjusted gross margin for Q3 was 37.7%, down 330 basis points year-over-year and 203 basis points quarter-over-quarter, primarily due to a decline in semiconductor business margins [1]. - The company has adjusted its net profit forecasts for 2025-2027 to HKD 2.03 billion, HKD 13.51 billion, and HKD 19.35 billion, reflecting significant changes in expectations [2]. Business Segments - The semiconductor solutions segment is expected to see a recovery in TCB shipments starting in Q4 2025 and into 2026, driven by demand from major clients [1]. - The SMT segment is showing a recovery trend, with new orders increasing significantly year-over-year [1]. - The company is focusing on enhancing its TCB and HBM capabilities, anticipating accelerated shipments in the upcoming quarters [1]. Market Outlook - The report highlights strong demand for AI infrastructure and electric vehicles as key growth drivers for the company's main business segments [1]. - The company is expected to benefit from cost savings following the voluntary liquidation of its Shenzhen subsidiary, which is projected to improve gross margins in the long term [1].

Summary of ASMPT (0522.HK) Conference Call Company Overview - **Company**: ASMPT (0522.HK) - **Industry**: Semiconductor Equipment Key Financial Results - **3Q25 Revenue**: HK$3.7 billion, representing an increase of +8% QoQ and +9% YoY, aligning with expectations [6][9] - **Gross Margin**: 35.7%, down from 39.7% in 2Q25 and 41.0% in 3Q24, lower than estimates of 40.9% and 40.1% [6][12] - **Operating Profit**: HK$50 million, a decrease of -72% YoY, impacted by restructuring costs [7][12] - **Net Loss**: -HK$270 million, significantly lower than expected net profits of HK$226 million and HK$201 million [12] - **Book-to-Bill Ratio**: 0.99 in 3Q25, down from 1.11 in 2Q25, indicating a decline in order intake [12] Revenue Guidance - **4Q25 Revenue Guidance**: Expected to be between US$470 million and US$530 million (HK$3.7 billion to HK$4.1 billion), implying a YoY growth of +8% to +21% [2] - **Management's Outlook**: Positive on TCB's market potential, driven by demand from the China market and AI-related sectors, though recovery in automotive and industrial segments remains uncertain [2] Segment Performance - **Semiconductor Solutions (Backend)**: Revenue decreased by -7% QoQ but increased by +5% YoY; bookings down -2% QoQ and -12% YoY due to an order cancellation [12] - **Surface Mount Technology (SMT)**: Revenue increased by +28% QoQ and +15% YoY; bookings decreased by -5% QoQ but increased by +52% YoY [12] Strategic Highlights - **Strength in TCB Tools**: Management noted success in securing orders for HBM4 12H TCB from multiple customers, indicating strong demand in advanced packaging tools [1] - **Mainstream Tools Demand**: Driven by AI, China EV, and China OSATs [1] Risks and Considerations - **Key Risks**: 1. Variability in customer adoption of Advanced Packaging tools [11] 2. Fluctuating demand from automotive customers [11] 3. Demand for traditional IC packaging and SMT equipment [11] Valuation and Price Target - **Current Price**: HK$87.25 - **12-Month Price Target**: HK$79.00, based on a P/E multiple of 19.5x for 2026E [10][13] - **Market Cap**: HK$36.0 billion [13] Conclusion - ASMPT's recent performance reflects challenges in gross margins and net profitability, while management remains optimistic about future growth driven by advanced packaging and AI-related demands. The company faces risks related to market demand fluctuations and customer adoption rates.

Financial Data and Key Metrics Changes - The company reported revenue of $468.0 million, an increase of 7.6% quarter-on-quarter and 9.5% year-on-year, primarily driven by growth in SMT [9][10] - Adjusted gross margin for the quarter was 37.7%, lower than typical levels due to a larger contribution from SMT and lower SEMI gross margin [10][11] - Adjusted operating profit was $124.4 million HKD, down 26.6% quarter-on-quarter and 30.3% year-on-year [11] - Adjusted net profit was $101.9 million HKD, down 24.4% quarter-on-quarter but up 245.2% year-on-year [11] Business Line Data and Key Metrics Changes - SEMI segment revenue was $240.5 million, down 6.5% quarter-on-quarter but up 5.0% year-on-year, with bookings of $207.8 million, down 1.7% quarter-on-quarter and 12.4% year-on-year [13][14] - SMT segment revenue was $227.5 million, up 28% quarter-on-quarter and 14.6% year-on-year, with bookings of $254.7 million, down 5% quarter-on-quarter but up 51.8% year-on-year [15][16] Market Data and Key Metrics Changes - The company noted strong demand in China driven by EVs and high factory utilization across all sectors [3] - The company expects Q4 2025 revenue to be between $470 million and $530 million, indicating growth supported by momentum in both SEMI and SMT [17] Company Strategy and Development Direction - The company aims to maintain its leadership in advanced packaging, particularly in TCB for HBM4 and advanced logic, driven by AI infrastructure demand [3][17] - The strategic restructuring, including the liquidation of the Sun Churn AEC plan, is expected to improve cost competitiveness and agility in global manufacturing operations [8] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in the outlook for TCB demand and noted that the AI ecosystem investments will drive future growth [17] - The company acknowledged uncertainties in the operating environment but emphasized its global presence to navigate potential impacts [17] Other Important Information - The company achieved a book-to-bill ratio of 1.04 for the quarter, maintaining a ratio above one since Q1 2025 [10] - The company experienced an isolated bookings cancellation in Q3 for panel deposition tools, which was a one-off occurrence [9][10] Q&A Session Summary Question: HBM4 transition and market share - Management confirmed they are leading the transition to HBM4 and have secured orders from two major HBM players, indicating a strong market position [20][23] Question: Impact of technology roadmaps on demand - Management noted that demand for TCB is driven by the timing of key customers' technology roadmaps, with expectations for growth in Q4 [25][26] Question: OpEx and future estimates - Management indicated that OpEx will remain similar to prior years with some marginal increases due to ongoing R&D investments [36][37] Question: TCB fluxless application timeline - Management expects significant ramp-up for fluxless TCB applications in 2026, with ongoing progress in logic applications [38][40] Question: Customer concentration for TCB equipment - Management confirmed a broadening of TCB customer base beyond leading foundries to include top AI customers [64] Question: Gross margin outlook for SEMI solutions - Management expects slight margin accretion for SEMI's margin in Q4, with long-term expectations for recovery to mid-40% levels [59][60]

Financial Data and Key Metrics Changes - The company reported revenue of $468.0 million for Q3 2025, an increase of 7.6% quarter-on-quarter and 9.5% year-on-year, primarily driven by growth in SMT [9][10] - Adjusted gross margin for Q3 was 37.7%, lower than typical levels due to a larger contribution from SMT and lower SEMI gross margin [10][11] - Adjusted net profit was HKD 101.9 million, down 24.4% quarter-on-quarter but up 245.2% year-on-year [11] - The group achieved a book-to-bill ratio of 1.04 for the quarter, maintaining a ratio above one since Q1 2025 [10] Business Line Data and Key Metrics Changes - SEMI segment revenue was $240.5 million, down 6.5% quarter-on-quarter but up 5.0% year-on-year, driven by demand for wire bonders and die bonders [13] - SMT segment revenue was $227.5 million, up 28% quarter-on-quarter and 14.6% year-on-year, supported by AI servers and EV demand in China [15] - SEMI's adjusted gross margin was 41.3%, lower than normal due to a higher contribution from wire bonders and lower TCB revenue [14] Market Data and Key Metrics Changes - The company noted strong demand in China driven by EVs and high factory utilization across all sectors [3] - The group expects Q4 2025 revenue to be between $470 million and $530 million, indicating growth supported by momentum in both SEMI and SMT [17] Company Strategy and Development Direction - The company aims to solidify its leadership in TCB technology, particularly in HBM4, and anticipates a total addressable market exceeding $1 billion by 2027 [17] - The strategic restructuring, including the voluntary liquidation of the Sun Churn AEC plan, is expected to enhance cost competitiveness and operational agility [8] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in the outlook for TCB demand, citing a strong AI tailwind and ongoing investments in AI infrastructure [31] - The company acknowledged uncertainties in the automotive and industrial markets but noted a stable demand from China [17] Other Important Information - The company experienced an isolated booking cancellation in Q3 for panel deposition tools, which was a one-off occurrence [9][10] - The group closed the quarter with a backlog of $867.7 million [10] Q&A Session Summary Question: HBM4 Transition and Market Share - Management confirmed they are a primary supplier for the HBM4 market, having secured orders from two major HBM players [20][23] Question: Advanced Packaging Demand Pause - Management indicated that the pause in demand was due to the timing of key customers' technology roadmaps, with confidence in future orders aligning with new architecture launches [25][26] Question: Operating Expenses and Future Projections - Management stated that operating expenses would remain similar to prior years, with ongoing investments in R&D and infrastructure [36][37] Question: TCB Fluxless Application Timeline - Management expects significant ramp-up for fluxless TCB applications in 2026, as the industry moves towards higher stacking [38][40] Question: Customer Concentration and Future Opportunities - Management noted a broadening of TCB customer base beyond leading foundries, engaging with top AI customers globally [64] Question: Gross Margin Outlook for SEMI Solutions - Management anticipates slight margin accretion for SEMI in Q4, with expectations for gross margins to return to mid-40% levels in the long run [59][60]

Financial Data and Key Metrics Changes - The company reported revenue of $468.0 million USD for Q3 2025, an increase of 7.6% quarter-on-quarter and 9.5% year-on-year, primarily driven by growth in SMT [9][10] - Adjusted gross margin for Q3 was 37.7%, lower than typical levels due to a larger contribution from SMT and lower SEMI gross margin [10][11] - Adjusted net profit was $101.9 million HKD, down 24.4% quarter-on-quarter but up 245.2% year-on-year [11] Business Line Data and Key Metrics Changes - SEMI segment revenue was $240.5 million USD, down 6.5% quarter-on-quarter but up 5.0% year-on-year, driven by stronger demand for wire bonders and die bonders [12] - SMT segment revenue was $227.5 million USD, up 28% quarter-on-quarter and 14.6% year-on-year, supported by AI servers and EV demand in China [14][15] - SEMI's adjusted gross margin was 41.3%, lower than normal due to a higher contribution from wire bonders and lower TCB revenue [13] Market Data and Key Metrics Changes - The company noted strong demand in China driven by EVs and high factory utilization across all sectors [3] - The group closed the quarter with a backlog of $867.7 million USD, indicating strong future demand [10] Company Strategy and Development Direction - The company aims to maintain its leadership in TCB technology and expects the total addressable market for TCB to exceed $1 billion by 2027, driven by AI infrastructure investments [17] - The strategic restructuring, including the liquidation of the Sun Churn AEC plan, is expected to enhance cost competitiveness and operational agility [8] Management Comments on Operating Environment and Future Outlook - Management expressed confidence in the outlook for TCB demand and noted that the timing of key customers' technology roadmaps will influence order volumes [25][30] - The company acknowledged uncertainties in the automotive and industrial markets but remains optimistic about mainstream demand, particularly from China [17][49] Other Important Information - The company experienced an isolated booking cancellation in Q3 for panel deposition tools, which was a one-off occurrence [9][10] - The group achieved a book-to-bill ratio of 1.04 for the quarter, maintaining a ratio above one since Q1 2025 [10] Q&A Session Summary Question: HBM4 Transition and Market Share - Management confirmed they are leading the transition to HBM4 and have secured orders from two major HBM players, indicating a strong market position [22][23] Question: Pause in Advanced Packaging and TCB - Management clarified that the observed pause in AP and TCB was driven by the timing of key customers' technology roadmaps, with expectations for growth in Q4 [24][25] Question: OpEx and AEC Liquidation Impact - Management indicated that the liquidation of AEC will primarily benefit COGS rather than OpEx, and OpEx is expected to remain similar to prior years due to ongoing R&D investments [35][36] Question: TCB Fluxless Application Timeline - Management anticipates a significant ramp-up in fluxless TCB applications for logic in 2026, with ongoing progress in the technology [37][39] Question: Customer Concentration and Future Opportunities - Management noted that TCB customer concentration has broadened beyond the top three memory makers, engaging with various AI customers globally [64][65] Question: Margin Outlook for SMT Solutions - Management explained that current SMT margins are influenced by market composition, with expectations for sustained low 30% margins unless market conditions change [69] Question: Total Addressable Market for TCB - Management projected that the total addressable market for TCB will be larger for HBM than for logic over time, with aspirations for a 35% to 40% market share [70][72]

Q3 2025 Financial Performance - Revenue reached US$468 million, showing a 7.6% QoQ increase and a 9.5% YoY increase[19] - Bookings amounted to US$462.5 million, a decrease of 3.5% QoQ but an increase of 14.2% YoY[19] - Backlog stood at US$867.7 million, down 1.4% QoQ but up 7.9% YoY[19] - Adjusted Gross Margin was 37.7%, a decrease of 203bps QoQ and 330bps YoY[19] - Adjusted Operating Profit was HK$124.4 million, down 26.6% QoQ and 30.3% YoY[19] - Adjusted Net Profit was HK$101.9 million, down 24.4% QoQ but up 245.2% YoY[19] - Adjusted Basic EPS was HK$0.24, down 25.0% QoQ but up 200.0% YoY[19] Segment Performance - Semiconductor Solutions Adjusted Gross Margin was 41.3%[24] and Adjusted Segment Profit was HK$83 million[24] - SMT Solutions Gross Margin was 33.9%[31] and Segment Profit was HK$163 million[31] Q4 2025 Guidance and Outlook - Q4 2025 Revenue Guidance is projected to be between US$470 million and US$530 million, representing a 6.8% QoQ increase and a 14.3% YoY increase at the mid-point of the guidance[35]

Core Insights - ASMPT reported a sales revenue of HKD 36.6 billion for the third quarter, representing a year-on-year growth of 9.5% [1] - The total new orders amounted to HKD 36.21 billion, reflecting a year-on-year increase of 14.2% [1] Group 1: Business Performance - The advanced packaging (AP) segment, particularly the thermal compression bonding (TCB) solutions, received repeat orders from clients in advanced memory and logic applications [1] - The mainstream business benefited from the ongoing adoption of artificial intelligence (AI), with increased demand for AI infrastructure in data centers, data transmission, and energy management [1] Group 2: Market Dynamics - In the Chinese market, the demand for semiconductor solutions (wire bonders, die bonders) and surface mount technology solutions, primarily for electric vehicles (EVs), continued to grow [1] - The high utilization rates of outsourced semiconductor assembly and testing facilities, along with China's leading position in the electric vehicle market, contributed to the increased demand in the mainstream business [1]

Core Insights - ASMPT reported a revenue of HKD 3.66 billion for Q3 2025, representing a year-on-year increase of 9.5% [1] - The total new orders amounted to HKD 3.621 billion, reflecting a year-on-year growth of 14.2% [1] - The company experienced a loss attributable to shareholders of HKD 270 million, marking a shift from profit to loss compared to the previous year [1] - Basic loss per share was HKD 0.65 [1] Business Performance - The advanced packaging (AP) and mainstream businesses benefited from the ongoing adoption of artificial intelligence (AI) [1] - The thermal compression bonding (TCB) solutions in advanced packaging received repeat orders from clients in advanced memory and logic applications [1] - Demand for mainstream business was driven by AI infrastructure, including data centers, data transmission, and energy management [1] Market Dynamics - In the Chinese market, the high utilization rates of electric vehicle (EV) and outsourced semiconductor assembly and testing (OSAT) companies boosted demand [1] - However, contributions from automotive and industrial markets outside of China remained weak [1] - The demand for mainstream business continued to benefit from AI, primarily driven by enhanced energy management capabilities in data centers and the demand for AI server motherboards in base stations [1] Segment Analysis - In the Chinese market, demand in the semiconductor solutions segment and surface mount technology (SMT) solutions segment continued to grow [1] - The new order total for wire bonding and die bonding applications in the semiconductor solutions segment was driven by the increasing utilization rates of outsourced semiconductor assembly and testing facilities [1] - Demand in the SMT solutions segment was mainly from electric vehicles, where the company maintains a leading position in China [1]

2025年第三季度的每股基本亏损为港币0.65元，而根据非香港财务报告会计准则计量经调整每股基本盈 利为港币0.24元。按此非香港财务报告会计准则计量，按季减少25.0%，按年则增加200.0%。 格隆汇10月28日丨ASMPT(00522.HK)公布截至2025年9月30日止三个月(2025年第三季度)录得销售收入 为港币 36.6亿元(4.68亿美元)，分别按季增加7.6%及按年增加9.5%。集团2025年第三季度的综合除税后 亏损为港币2.69亿元。然而，根据非香港财务报告会计准则计量1经调整除税后盈利为港币1.02亿元，按 季减少24.4%，按年则增加245.2%。 ...

ASMPT LIMITED 香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負 責，對其準確性或完整性亦不發表任何聲明，並明確表示，概不對因本公告全 部或任何部份內容而產生或因倚賴該等內容而引致的任何損失承擔任何責任。 （於開曼群島註冊成立之有限公司） （股份代號：0522） 二零二五年第三季度業績新聞稿 有關 ASMPT Limited 及其附屬公司截至二零二五年九月三十日止三個月業績的 新聞稿附載於本公告。 承董事會命 董事 黃梓达 香港，二零二五年十月二十八日 於本公告日期，本公司董事會成員包括獨立非執行董事：樂錦壯先生（主席）、 張仰學先生、蕭潔雲女士及許明明女士；非執行董事： Hichem M'Saad 博士及 Paulus Antonius Henricus Verhagen 先生；執行 董事： 黃梓 达先生及 Guenter Walter Lauber 先生。 （本公告之中英文版本如有任何歧義，概以英文版本為準。） [新聞稿] ASMPT 公布二零二五年第三季度業績 人工智能推動強勁勢頭 集團業績概覽 關鍵亮點 先進封裝及主流業務均受惠於人工智能 TCB 技術於第四代高頻寬記憶 ...