香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負 責，對其準確性或完整性亦不發表任何聲明，並明確表示，概不對因本公告全 部或任何部份內容而產生或因倚賴該等內容而引致的任何損失承擔任何責任。 ASMPT LIMITED 由二零二五年二月二十五日起, 本公司之股份過戶登記申請須向卓佳證券登記有限公司 提交。 於二零二五年二月二十四日下午四時三十分後仍未領取之股票, 可於二零二五 年二月二十五日起從卓佳證券登記有限公司領取。 承董事會命 ASMPT Limited 公司秘書 江俊 香港，二零二五年二月十九日 於本公告日期，本公司董事會成員包括獨立非執行董事： Orasa Livasiri 小姐 （主席）、樂錦壯先生、黃漢儀先生、鄧冠雄先生、張仰學先生及蕭潔雲女士； 非執行董事： Hichem M'Saad 博士及 Paulus Antonius Henricus Verhagen 先生；執 行董事：黃梓达先生及 Guenter Walter Lauber 先生。 （本公告之中英文版本如有任何歧義，概以英文版本為準。） 更改香港股份過戶登記處 ASMPT Limited (「本公司」) 謹此宣布， ...

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負 責，對其準確性或完整性亦不發表任何聲明，並明確表示，概不對因本公告全 部或任何部份內容而產生或因倚賴該等內容而引致的任何損失承擔任何責任。 ASMPT LIMITED 於本公告日期，本公司董事會成員包括獨立非執行董事： Orasa Livasiri 小姐 （主席）、樂錦壯先生、黃漢儀先生、鄧冠雄先生、張仰學先生及蕭潔雲女士； 非執行董事： Hichem M'Saad 博士及 Paulus Antonius Henricus Verhagen 先生；執 行董事：黃梓达先生及 Guenter Walter Lauber 先生。 （於開曼群島註冊成立之有限公司） （股份代號：0522） （本公告之中英文版本如有任何歧義，概以英文版本為準。） 承董事會命 ASMPT Limited 公司秘書 江俊 香港，二零二五年二月十一日 董事會召開日期 ASMPT Limited（「本公司」）謹此宣布，本公司董事會會議將於二零二五年二 月二十五日（星期二）舉行，藉以（其中包括）考慮及批准刊發本公司及其附 屬公司截至二零二四年十二月三十一日止年度的全年業績公告， ...

Group 1 - Goldman Sachs lowered the target price for ASMPT from HKD 108 to HKD 100 while maintaining a "Buy" rating, primarily benefiting from the growth in demand for artificial intelligence, high-performance computing, and high-bandwidth memory [1] - ASMPT's revenue for the fourth quarter is expected to be HKD 3.6 billion, representing a year-on-year increase of 5% and a quarter-on-quarter increase of 7%. Despite the continued growth in packaging, thermal compression bonding, and hybrid bonding tools, the company faces headwinds in the semi-finished products and SMT sectors due to moderate capital expenditure from downstream customers [2] - Goldman Sachs also revised down its earnings per share forecasts for 2025-2026 by 7% and 6% respectively [3]

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對 其準確性或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部份 內容而產生或因倚賴該等內容而引致的任何損失承擔任何責任。 （於開曼群島註冊成立之有限公司） （股份代號：0522） 根據公司僱員股份獎勵計劃授予股份 本公告乃由公司根據上市規則第17.06A、17.06B及17.06C條作出。 茲參照於二零二零年三月二十四日獲公司採納該計劃的相關規則。根據該計劃的條款， 信託人會為獲選僱員之利益，以面值認購新股份或在聯交所購買股份。 授予每名獲選僱員的股份數量乃根據該名獲選僱員於集團的職位、工作經驗、服務年 期及工作表現等因素而釐定。 於二零二四年十二月十九日，董事會決議根據於上市規則的新第17章生效日期前獲採 納的該計劃向八名獲選僱員授予合共169,300股股份。公司將根據適用於該計劃的過渡 安排遵守上市規則的新第17章。 獎勵股份之詳情載列如下： 獎勵股份的購買價 ： 無 ASMPT LIMITED 獎勵日期的股份收市價 ： 港幣76.40元 按獎勵日期的收市價每股股份港幣76.40元計算，獎勵 股份的市值為港幣12,93 ...

FF305 翌日披露報表 (股份發行人 ── 已發行股份或庫存股份變動、股份購回及/或在場内出售庫存股份) 表格類別： 股票 狀態： 新提交 公司名稱： ASMPT Limited 呈交日期： 2024年12月16日 如上市發行人的已發行股份或庫存股份出現變動而須根據《香港聯合交易所有限公司（「香港聯交所」）證券上市規則》(「《主板上市規則》」)第13.25A條 / 《香港聯合交易所有限公司GEM證券 上市規則》(「《GEM上市規則》」)第17.27A條作出披露，必須填妥第一章節 。 | 第一章節 | | | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | | 於香港聯交所上市 | 是 | | | | 證券代號 (如上市) | 00522 | 說明 | | | | | | | | A. 已發行股份或庫存股份變動 | | | | | | | | | | | | 已發行股份（不包括庫存股份）變動 | | | 庫存股份變動 | | | | | 事件 | | 已發行股份 ...

FF305 翌日披露報表 (股份發行人 ── 已發行股份或庫存股份變動、股份購回及/或在場内出售庫存股份) 表格類別： 股票 狀態： 新提交 公司名稱： ASMPT Limited 呈交日期： 2024年12月12日 如上市發行人的已發行股份或庫存股份出現變動而須根據《香港聯合交易所有限公司（「香港聯交所」）證券上市規則》(「《主板上市規則》」)第13.25A條 / 《香港聯合交易所有限公司GEM證券 上市規則》(「《GEM上市規則》」)第17.27A條作出披露，必須填妥第一章節 。 | 第一章節 | | | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | | 於香港聯交所上市 | 是 | | | | 證券代號 (如上市) | 00522 | 說明 | | | | | | | | A. 已發行股份或庫存股份變動 | | | | | | | | | | | | | 已發行股份（不包括庫存股份）變動 | | 庫存股份變動 | | | | | 事件 | | 已發行股份 ...

Group 1 - Morgan Stanley has initiated coverage on ASMPT with a "Market Perform" rating and a target price of HKD 82 [1] - Despite a slow recovery in the semiconductor and electronics manufacturing industry, ASMPT has made breakthroughs in the high bandwidth memory (HBM) market [1] - Management forecasts a 3.5% year-over-year decline in sales revenue for Q4, estimating it to be between USD 420 million and USD 424 million, with new orders expected to remain flat [1] Group 2 - Surface mount technology continues to face challenges from market weakness and inventory digestion [2] - Morgan Stanley is optimistic about ASMPT's hot-press welding applications in the HBM market, projecting a 65% compound annual growth rate in related revenue from 2023 to 2026 [2]

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負 責，對其準確性或完整性亦不發表任何聲明，並明確表示，概不對因本公告全 部或任何部份內容而產生或因倚賴該等內容而引致的任何損失承擔任何責任。 就收購守則而言，有關可能私有化的要約期於本公告刊發時結束。 - 1 - 本公司股東及潛在投資者於買賣本公司證券時務請審慎行事。任何人士如對應 採取的行動或彼等的情況有任何疑問，應諮詢其股票經紀、銀行經理、律師或 其他專業顧問。 承董事會命 ASMPT Limited 董事 黃梓达 ASMPT LIMITED （於開曼群島註冊成立之有限公司） （股份代號：0522） 根據收購守則規則 3.7 作出的公告 要約期結束 本公告由 ASMPT Limited（「本公司」）根據香港公司收購及合併守則（「收購 守則」）規則 3.7 而作出。 茲提述本公司日期為二零二四年十月十四日有關可能私有化的公告（「規則 3.7 公告」）。除非另有界定，本公告所用之詞彙與規則 3.7 公告所界定者具有相同 涵義。 要約期結束 本公司謹此通知本公司股東及潛在投資者，本公司與潛在要約人已停止就可能 私有化進行討論。 香港，二零二四年 ...

Investment Rating - The investment rating for ASMPT is "Buy" (maintained) [1] Core Views - The traditional business is recovering slowly, with profit improvement expected to be driven by TCB volume growth [3][4] - The SMT business is dragging down the company's performance, with the recovery in 2024 not meeting expectations [3][4] - The company has adjusted its net profit forecasts for 2024-2026 downwards due to weak SMT demand, with expected profits of 4 billion, 12 billion, and 22 billion HKD respectively [4][6] Financial Summary - Q3 2024 revenue was 429 million USD, a slight increase of 0.1% quarter-on-quarter, within the guidance range of 370-430 million USD [3] - New orders increased by 1.5% quarter-on-quarter, with the semiconductor segment growing by 7%, while SMT orders declined by 5% [3] - The company expects Q4 2024 revenue to be between 380-460 million USD, with a median estimate indicating a 2% decline quarter-on-quarter [3] - Revenue projections for 2024-2026 show a decline in 2024 followed by growth in subsequent years, with year-on-year growth rates of -41%, 177%, and 88% respectively [4][6] Market Position and Outlook - The company is positioned to benefit from advancements in TCB technology, particularly in HBM applications, which are expected to drive future growth [5] - The current stock price of 83.75 HKD corresponds to P/E ratios of 81.7, 29.5, and 15.7 for 2024-2026 [4][6] - The traditional packaging business is still at the recovery starting point, with AI advanced packaging expected to remain a long-term focus [4]

Investment Rating - The report maintains an "Overweight" rating for ASMPT (0522 HK) [4] Core Views - Q3 2024 revenue exceeded expectations at $429 million (HK$3 34 billion), up 0 1% QoQ but down 3 7% YoY, beating market expectations by 4% [1] - Semiconductor Solutions revenue grew 14% YoY and 8% QoQ to $229 million, driven by strong demand for advanced packaging [1] - SMT revenue declined 18% YoY and 8% QoQ to $199 million due to slow recovery in the traditional semiconductor cycle [1] - Q3 2024 gross margin improved by 0 94 ppts to 41%, with Semiconductor Solutions margin up 4 ppts to 48 6%, offsetting a 3 4 ppt decline in SMT margin [1] - Net profit was HK$23 8 million, down 83% QoQ due to HK$108 million in FX losses, but would have been flat QoQ excluding FX impact [1] - New orders in Q3 2024 totaled $406 million, up 1 5% QoQ, driven by semiconductor business growth [1] - TCB equipment is expected to accelerate shipments in Q4 2024 and 2025, supported by AI-related capital expenditure and HBM customer orders [1] Financial Performance - 2024E revenue is projected at HK$13 248 million, with net profit of HK$492 million [2] - 2025E revenue is forecasted at HK$15 766 million, with net profit of HK$1 073 million [2] - 2026E revenue is expected to reach HK$17 345 million, with net profit of HK$1 632 million [2] - EPS for 2024E, 2025E, and 2026E is projected at HK$1 19, HK$2 59, and HK$3 94, respectively [2] Business Segments - Semiconductor Solutions revenue is expected to grow from HK$6 766 million in 2024E to HK$10 478 million in 2026E [6] - SMT revenue is projected to remain relatively flat, from HK$6 482 million in 2024E to HK$6 868 million in 2026E [6] - Gross margin for Semiconductor Solutions is expected to remain strong, while SMT margin continues to face pressure [6] Key Developments - TCB equipment secured a bulk order from a leading HBM manufacturer in October 2024, with deliveries expected in Q4 2024 and Q1 2025 [1] - The company continues to win orders from leading IDM and foundry customers for C2W and C2S applications [1] - AI-related advanced packaging demand is driving growth in TCB equipment orders and improving long-term gross margin prospects [1] Market Data - Current share price: HK$87 0 [4] - Market capitalization: HK$36 062 billion [4] - 52-week range: HK$65 05 - HK$119 [4] - 3-month turnover rate: 79 6% [4]