FF305 翌日披露報表 (股份發行人 ── 已發行股份或庫存股份變動、股份購回及/或在場内出售庫存股份) 表格類別： 股票 狀態： 新提交 公司名稱： 中芯國際集成電路製造有限公司 呈交日期： 2025年12月24日 如上市發行人的已發行股份或庫存股份出現變動而須根據《香港聯合交易所有限公司（「香港聯交所」）證券上市規則》(「《主板上市規則》」)第13.25A條 / 《香港聯合交易所有限公司GEM證券 上市規則》(「《GEM上市規則》」)第17.27A條作出披露，必須填妥第一章節 。 | 第一章節 | | | | | | | | --- | --- | --- | --- | --- | --- | --- | | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | 於香港聯交所上市 | 是 | | | 證券代號 (如上市) | 00981 | 說明 港股 | | | | | | A. 已發行股份或庫存股份變動 | | | | | | | | | | 已發行股份（不包括庫存股份）變動 | | 庫存股份變動 | 每股發行/出售價 (註4) | 已發行股份總數 | | 事件 | | 已發行股份（不包括庫存 ...

智通财经APP获悉，12月24日港股市场，北水成交净卖出11.75亿港元，其中港股通(沪)成交净卖出5.52亿港元，港股通(深) 成交净卖出6.24港元。 北水净买入最多的个股是中芯国际(00981)、农业银行(01288)、华虹半导体(01347)。北水净卖出最多的个股是中国移动 (00941)、腾讯(00700)、阿里巴巴-W(09988)。 | 股票名称 | 买入额 | 卖出额 | 买卖总额 | | --- | --- | --- | --- | | | | | 净流入 | | 中芯国际 HK 00981 | 15.02亿 | 14.37亿 +6543.08万 | 29.39亿 | | 阿里巴巴-W | 8.94 Z | 10.51 乙 | 19.46亿 | | HK 09988 | | | -1.57 乙 | | 中国移动 | 2.64亿 | 7.77亿 | 10.41 乙 | | HK 00941 | | | -5.13 Z | | 长飞光纤 ... | | 4.71亿 | 8.92亿 | | HK 08869 | 4.20亿 | | -5087.05万 | | 华虹米营体 | 3.32亿 | 5. ...

南向资金今日净卖出11.75亿港元，中国移动、腾讯控股、阿里巴巴-W分别遭净卖出7.11亿港元、6.11亿 港元、2.88亿港元。净买入方面，中芯国际、农业银行、华虹半导体净买入额位列前三，分别获净买入 4.91亿港元、1.75亿港元、1.06亿港元。 (本文来自第一财经) ...

Core Viewpoint - SMIC has implemented a price increase of approximately 10% on certain production capacities due to rising demand from mobile applications and AI, alongside raw material cost increases [1] Semiconductor Industry Analysis - The semiconductor industry is experiencing growth driven by the AI wave, domestic substitution, and technological innovation, supporting the long-term development logic of the semiconductor sector [1] - The global semiconductor equipment market is entering a new expansion cycle, with equipment demand and domestic production rates expected to rise simultaneously [2] Market Segment Analysis - **Semiconductor Equipment and Materials**: This sector is a core area for domestic substitution, benefiting from the anticipated investments from the National Integrated Circuit Industry Investment Fund [2] - **Memory Chip Sector**: The industry is seeing an upward trend due to the reversal of the global memory cycle and massive demand from AI applications [3] - **Advanced Packaging and Chiplet Sector**: As chip manufacturing approaches physical limits, advanced packaging becomes crucial for enhancing system performance, presenting growth opportunities for industry chain companies [3] - **Automotive Electronics and Power Semiconductor Sector**: The demand for automotive-grade chips is experiencing rigid growth due to the long-term trends of electrification and intelligence in new energy vehicles [3] Company Overview - **SMIC (688981.SH)**: The largest and most advanced integrated circuit foundry in mainland China, benefiting significantly from the increase in domestic foundry demand [4] - **North Huachuang (002371.SZ)**: A leading domestic semiconductor equipment manufacturer with a strong platform advantage, playing a key role in domestic equipment substitution [4] - **Changdian Technology (600584.SH)**: The third-largest chip packaging and testing company globally, with a strong competitive edge in advanced packaging technologies [4] - **Haiguang Information (688041.SH)**: A key provider of high-end CPUs and DCUs in China, with products widely used in servers and workstations [4] - **Lanke Technology (688008.SH)**: An international leader in data processing and interconnect chip design, maintaining a leading position in DDR5 memory interface chips and actively developing AI chips [4]

Market Overview - The A-share market experienced a strong upward trend, with the Shanghai Composite Index rising by 0.53%, the Shenzhen Component Index by 0.88%, and the ChiNext Index by 0.77% on December 24 [2] - Over 4,100 stocks in the market increased in value, with a total trading volume of approximately 1.9 trillion yuan, a decrease of 24.1 billion yuan compared to the previous trading day [2] Technical Analysis - The A-share market has broken through an important trading range, indicating a shift from a typical box-shaped fluctuation pattern observed since November 20 [2][4] - The average stock price across the A-share market has also shown a breakout, recovering losses incurred since November 18 [4] Sector Performance - The commercial aerospace sector has shown significant growth, with over 30 stocks closing at their daily limit or with gains of 10% or more [11] - Other strong sectors include power supply equipment and liquid cooling servers, with predictions indicating that the global liquid cooling market could reach $21.8 billion by 2027 [13] - The semiconductor industry is also performing well, with companies like SMIC implementing price increases of around 10% due to rising demand from mobile applications and AI [14] Investment Sentiment - Analysts from Dongguan Securities suggest that the current market conditions are favorable for optimistic positioning ahead of the spring market rally, driven by institutional reallocation and improved liquidity [8] - The focus for the short term will be on the selection of the new Federal Reserve chair and the implementation of domestic monetary and fiscal policies [8]

且目前摩尔线程与沐曦刚上市，未被计入排名之中。如果按照最新公布的市值对比，两家GPU龙头同样具备进入全球前列的体量。 12月24日，三大指数拉升，设备产业链延续强势。热门半导体设备ETF（561980）午后翻红、日K冲击3连阳，成份股华海诚科拉升超12%，天岳先进涨超 7%，芯源微、晶升股份涨超4%，中芯国际、长川科技、沪硅产业等多股跟涨。 数据显示，半导体设备ETF（561980）跟踪中证半导，标的指数年内上涨64.76%，在国证芯片、中华半导体芯片、芯片产业等主流半导体指数中位列第一， 弹性较为突出。 消息面上，根据半导体产业观察，Companies Market Cap实时市值统计，截至2025年12月中旬，在全球市值排名前100的半导体公司中，中国大陆有17家、中 国台湾16家、中国香港2家，合计占据35席，占比约35%。 分析指出，半导体公司市值本身随市场波动而变化，这一数字只反映特定时间节点的结果。但在一个高度成熟、资本密集、长期博弈的产业中，市值往往并 非短期情绪的简单映射，而是多重产业变量——技术路径、供需结构、资本开支与竞争格局——长期作用后的结果。因此，TOP100 并不只是"排名"，而更 ...

12月24日，三大指数拉升，设备产业链延续强势。热门半导体设备ETF（561980）午后翻红、日K冲击3 连阳，成份股华海诚科拉升超12%，天岳先进涨超7%，芯源微、晶升股份涨超4%，中芯国际、长川科 技、沪硅产业等多股跟涨。 分析指出，半导体公司市值本身随市场波动而变化，这一数字只反映特定时间节点的结果。但在一个高 度成熟、资本密集、长期博弈的产业中，市值往往并非短期情绪的简单映射，而是多重产业变量——技 术路径、供需结构、资本开支与竞争格局——长期作用后的结果。因此，TOP100 并不只是"排名"，而 更像是一张产业权力结构的切片。 且目前摩尔线程与沐曦刚上市，未被计入排名之中。如果按照最新公布的市值对比，两家GPU龙头同样 具备进入全球前列的体量。 中研网分析认为，随着AI、汽车电子等下游市场爆发，半导体企业估值体系发生深刻变化。存储芯片 领域，HBM需求激增；GPU赛道，摩尔线程、沐曦等大陆企业通过A+H股上市加速资本运作，估值模 型从PE转向PS(市销率)，反映市场对技术壁垒与成长潜力的重新认知。 银河证券也认为，沐曦股份、摩尔线程等陆续登陆资本市场，国产GPU发展有望加速，或将带动集成电 路制造以 ...

炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！ 来源：智通财经 半导体晶圆代工即将开启新一轮涨价。 《科创板日报》记者从多个独立信源了解到，中芯国际已向下游客户发布涨价通知，且此次涨价主要集 中于8英寸BCD工艺平台，涨价幅度在10%左右。 "我们已经接到了涨价通知，每家客户涨价情况不尽相同。"一家芯片上市公司人士向《科创板日报》记 者表示，"我们认为这样的涨价不可持续，后续我们公司还会与中芯国际方面进行进一步协商，看能否 争取到优惠空间。" 对此，中芯国际方面向《科创板日报》记者回应称："公司对媒体新闻不做回复和评价。" 《科创板日报》记者了解到，此次并非只有中芯国际一家公司上涨其代工价格。另一家平台型的芯片设 计企业从业者向《科创板日报》记者表示，他们近期已经接到中芯国际、世界先进（VIS）等供应商的 涨价通知，其中后者涨幅同样在10%左右，且主要是BCD平台。 BCD是一种单片集成工艺技术，这种技术能够在同一芯片上集成功率、模拟和数字信号处理电路，能 够大幅降低功率耗损，提高系统性能，节省电路的封装费用，并具有更好的可靠性。 其次，台积电（TSMC）收缩8英寸产能转移到高端制程 ...

半导体晶圆代工即将开启新一轮涨价。 《科创板日报》记者从多个独立信源了解到， 中芯国际已向下游客户发布涨价通知，且此次涨价主要集中于8英寸BCD工艺平台，涨价幅度 在10%左右。 "我们已经接到了涨价通知，每家客户涨价情况不尽相同。"一家芯片上市公司人士向《科创板日报》记者表示，"我们认为这样的涨价不可 持续，后续我们公司还会与中芯国际方面进行进一步协商，看能否争取到优惠空间。" 对此，中芯国际方面向《科创板日报》记者回应称："公司对媒体新闻不做回复和评价。" 《科创板日报》记者了解到，此次并非只有中芯国际一家公司上涨其代工价格。另一家平台型的芯片设计企业从业者向《科创板日报》记者 表示，他们近期已经接到中芯国际、世界先进（VIS）等供应商的涨价通知，其中后者涨幅同样在10%左右，且主要是BCD平台。 上述芯片设计公司人士表示，这一轮晶圆代工价格上涨有其背后的行业因素助推，因此"未来免不了其他几家主流的晶圆厂跟风涨价"。 就具体原因，据介绍，首先是AI基础设施投资处于热潮期，而AI服务器等产品需要大量电源芯片，导致占用了许多BCD产能。 BCD是一种单片集成工艺技术，这种技术能够在同一芯片上集成功率、模拟和数 ...

Core Viewpoint - Semiconductor industry is experiencing increased demand driven by mobile applications and AI, leading to price hikes in wafer foundry services, with SMIC implementing a 10% price increase on some capacities [1] Group 1: Price Increases and Demand - SMIC has raised prices on certain capacities by approximately 10%, with expectations for quick implementation [1] - The increase in demand for chips is attributed to the growth in mobile applications and AI, alongside rising raw material costs [1] - TSMC is consolidating its 8-inch capacity and plans to shut down some production lines by the end of 2027, which may lead to further price increases in wafer foundry services [1] Group 2: TSMC's Challenges - TSMC's mature process capacity utilization is impacted by the rise of China's mature processes, with its Kumamoto factory facing losses due to declining demand from major Japanese automakers [1] - TSMC's Kumamoto factory, which focuses on 28nm processes for automotive chips, has seen low capacity utilization and increasing losses [1] - TSMC plans to shift its future Kumamoto factory construction from 6nm to 2nm processes to cater to clients like NVIDIA and AMD for AI chips [1] Group 3: Capacity Utilization and Revenue Growth - SMIC's capacity utilization rose from 92.5% in Q2 to 95.8% in Q3, equating to a monthly capacity of one million 8-inch wafers [3] - Huahong Semiconductor also reported high utilization at 109.5% in Q3, shipping approximately 1.4 million 8-inch wafers [3] - Both companies experienced significant revenue growth in Q3, with SMIC reporting revenue of 17.162 billion yuan (up 6.9% quarter-on-quarter) and a net profit of 1.517 billion yuan (up 43.1% year-on-year) [3] - Huahong Semiconductor achieved a record high revenue of $635.2 million in Q3, reflecting a year-on-year growth of 20.7% [3] Group 4: Market Position and Future Outlook - By Q3 2025, SMIC is projected to hold a 5.1% market share, ranking third globally in wafer foundry sales, while Huahong Semiconductor is expected to rank sixth with a 2.6% market share [3] - SMIC's CEO noted that the industry is undergoing rapid changes, with ongoing inventory replenishment and increased output, despite a seasonal slowdown in Q4 [4] - The average selling price for SMIC's products increased by 3.8% quarter-on-quarter due to the complexity of products being shipped [4]