Core Insights - Intel announced significant leadership changes, including the departure of Michelle Johnston Holthaus, who has been with the company for over 30 years, transitioning to a strategic advisor role [1] - New leadership appointments include Kevork Kechichian as General Manager of the Data Center Group (DCG), responsible for cloud computing and enterprise data center business, and Jim Johnson, who has been with Intel for 40 years, officially leading the Client Computing Group (CCG) [1] - These changes are seen as a strategic move by Intel to address market competition and facilitate business transformation [1] Leadership Changes - Michelle Johnston Holthaus will leave her position as product chief and serve as a strategic advisor in the coming months [1] - Kevork Kechichian, former Executive Vice President of Engineering at Arm, appointed as General Manager of DCG [1] - Jim Johnson, who has been with Intel for 40 years, transitions from interim to permanent leadership of CCG [1] Strategic Implications - The leadership changes are likely aimed at enhancing Intel's competitive position in the market [1] - Focus areas for the new leaders include innovation in computing solutions and growth in the PC and edge computing ecosystems [1]

Group 1 - Intel's Vice President John Pitzer revealed detailed plans for next-generation desktop CPUs and advanced process technologies at the Goldman Sachs Communacopia + Technology Conference [1] - The Arrow Lake series is set to launch in early 2026, while the Nova Lake series is scheduled for late 2026, with key advancements in 18A and 14A process technologies [1][3] - Arrow Lake will share the 18A process technology with server products Clearwater Forest and Diamond Rapids, featuring Intel's first "PowerVia" backside power delivery technology aimed at significantly improving energy efficiency and transistor density [3] Group 2 - Intel reiterated that the Panther Lake "Core Ultra Series 3" CPU will be launched by the end of this year, with the first SKUs released through various OEM designs, and additional SKUs expected in the first half of 2026 [3] - The Nova Lake series is positioned as Intel's flagship product for late 2026, based on a "completely new microarchitecture" design, potentially integrating 14A process technology, marking the first mention of a commercialization timeline for the 14A node [3]

智通财经APP获悉，芯片制造商英特尔(INTC.US)近期正竭力扭转颓势，公司于周一宣布两项重要人事 调整：为两大核心产品部门任命新负责人，同时确认此前掌管这两个部门的资深高管米歇尔·约翰斯顿· 霍尔索斯(Michelle Johnston Holthaus)将离职。 根据英特尔周一发布的声明，ARM控股公司(Arm Holdings Plc)高管凯沃克·凯奇扬(Kevork Kechichian)将 加盟英特尔，担任数据中心部门负责人;在英特尔任职超40年的吉姆·约翰逊(Jim Johnson)将接管个人电 脑(PC)芯片业务。此外，英特尔还将成立一个中央工程部门，由今年6月加入公司的高级副总裁斯里尼 瓦桑·伊扬加尔(Srinivasan Iyengar)领导。上述三位新负责人均将直接向首席执行官(CEO)陈立武(Lip-Bu Tan)汇报。 陈立武于今年3月出任英特尔CEO，此次任命是其重塑公司战略的关键一步——他正通过组建核心管理 团队，试图扭转这家曾主导半导体行业的巨头的下滑局面。近年来，英特尔在竞争对手面前逐渐失势， 尤其在人工智能(AI)相关产品需求爆发的浪潮中，未能充分抓住机遇。 其中，凯奇扬的 ...

格隆汇9月9日｜英特尔公布一系列高级管理人员变动，其中包括公司产品主管Michelle Holthaus将离 职。 公司指，将成立一个新的中央工程团队，由高级副总裁Srinivasan Iyengar领导。公司表示，在扩大 后的职位上，Iyengar将打造一项新的客制化芯片业务，以服务外部客户。 ...

Core Insights - Intel announced several executive appointments on September 8, including Kevork Kechichian as head of the Data Center Group, Jim Johnson to lead the Client Computing Group, and Srini Iyengar to head the newly formed Central Engineering Group [1] - Naga Chandrasekaran's responsibilities have been expanded to include wafer fabrication services, while Michelle Johnston Holthaus, the Chief Product Officer, will be leaving the company [1] Group 1 - Kevork Kechichian appointed as head of Data Center Group, previously served as Executive Vice President of Engineering at Arm [1] - Jim Johnson, who was the interim head, is now officially leading the Client Computing Group [1] - Srini Iyengar, formerly Global Silicon Engineering Lead at Cadence, will lead the new Central Engineering Group [1] Group 2 - Naga Chandrasekaran's role as Executive Vice President and Chief Global Operations Officer has been expanded to include wafer fabrication services [1] - Michelle Johnston Holthaus, the Chief Product Officer, is set to leave Intel [1]

Group 1 - Intel announced a series of executive changes, including the departure of product chief Michelle Johnston Holthaus, as CEO Lip-Bu Tan seeks to turn around the struggling chipmaker [1] - Holthaus has worked at Intel for over 30 years and has held multiple senior leadership positions, including serving as interim co-CEO after the ousting of former CEO Pat Gelsinger [1] - The company aims to flatten its leadership structure, allowing key chip divisions to report directly to the CEO while cutting positions to streamline operations [1] Group 2 - Kevork Kechichian has joined Intel as Executive Vice President and General Manager of the Data Center Division, bringing extensive experience from ARM, NXP Semiconductors, and Qualcomm [1] - A new central engineering department has been established, led by Senior Vice President Srinivasan Iyengar, who will also oversee the creation of a new custom chip business for external clients [2] - Naga Chandrasekaran's role has been expanded to include foundry services, while Jim Johnson has been appointed General Manager of the Client Computing Division [2]

Group 1 - Qualcomm's CEO Cristiano Amon stated that Intel's chip manufacturing capabilities currently do not meet Qualcomm's requirements, but there is hope for future collaboration if Intel improves its process technology [1] - Qualcomm relies on existing partners TSMC and Samsung for chip production, as it is a fabless chip design company [3] - Qualcomm is diversifying its business to mitigate the slowdown in the global smartphone market, aiming to achieve $22 billion in revenue from automotive and connected device businesses by 2029 [3] Group 2 - Qualcomm has developed an autonomous driving system for BMW's latest iX3 SUV, showcasing a more cautious approach compared to competitors [3] - The new system's computing power is comparable to data center servers while maintaining low power consumption, designed with battery operation in mind [3]

Core Insights - Intel's CFO, Sinha, revealed that a decision regarding the future of the 1.4nm (14A) advanced process may be made next year, emphasizing TSMC as a key partner and stating that Intel will "always" collaborate with TSMC [1] - Sinha clarified that the previous statement by Intel's CEO about halting the 14A process without external customers was not a lack of confidence but a matter of financial discipline, indicating that capacity will only be created with external demand [1] - A decision on whether to continue the 14A development is expected by 2026, with potential product availability projected for 2028-2029, aiming to secure external customers during this timeframe [1] - Sinha confirmed that Intel will continue to place orders with TSMC, despite potential fluctuations in their relationship due to Intel's Integrated Device Manufacturing (IDM) strategy [1] Production Strategy - Intel considers TSMC a great partner and intends to continue utilizing TSMC's technology, with many chips, including Lunar Lake and most Arrow Lake, being outsourced [2] - The current ratio of internally produced chips to outsourced chips is 70% to 30%, with the outsourcing ratio potentially decreasing but still remaining higher than levels from a decade ago [2]

Core Viewpoint - Qualcomm's CEO Cristiano Amon stated that Intel's current manufacturing technology does not meet the supplier standards for mobile processor manufacturers [1] Group 1: Qualcomm's Position - Qualcomm is open to considering collaboration with Intel if the latter can improve its manufacturing processes to produce more energy-efficient chips [1] - Currently, Qualcomm does not view Intel as a viable option for partnership [1] - Qualcomm will continue to maintain its partnerships with existing foundries, TSMC and Samsung Electronics [1] Group 2: Intel's Strategy - Intel is attempting to reverse its decline by attracting external customers like Qualcomm while maintaining its own chip manufacturing business [1]

更名后，大连爱思开海力士存储由爱思开海力士半导体（大连）有限公司全资持股。据了解，此次更名 系韩国存储巨头SK海力士收购英特尔NAND闪存及SSD业务案的后续行动。 近日，英特尔半导体存储技术（大连）有限公司正式更名为爱思开海力士半导体存储技术（大连）有限 公司（以下简称"大连爱思开海力士存储"）。 原英特尔大连工厂成立于2021年7月，经营范围涵盖集成电路制造、芯片及产品制造、电子元器件制造 等。2025年3月，原股东Intel Asia Holding Limited退出，由SK海力士接手完成股权交接。 ...