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沃格光电:与京东方在多个业务领域展开合作

Zheng Quan Shi Bao Wang· 2025-08-14 08:46
人民财讯8月14日电,沃格光电(603773)8月14日在互动平台表示,京东方是公司重要客户,双方在多 个业务领域展开合作。 ...
光学光电子板块8月14日跌1.67%,沃格光电领跌,主力资金净流出17.12亿元
Zheng Xing Xing Ye Ri Bao· 2025-08-14 08:27
证券之星消息,8月14日光学光电子板块较上一交易日下跌1.67%,沃格光电领跌。当日上证指数报收于 3666.44,下跌0.46%。深证成指报收于11451.43,下跌0.87%。光学光电子板块个股涨跌见下表: | 代码 | 名称 | 主力净流入(元) | 主力净占比 游资净流入 (元) | | 游资净占比 散户净流入 (元) | | 散户净占比 | | --- | --- | --- | --- | --- | --- | --- | --- | | 002456 | 欧菲光 | 8558.45万 | 3.70% | -2867.19万 | -1.24% | -5691.26万 | -2.46% | | 301421 波长光电 | | 8335.56万 | 10.24% | -2201.30万 | -2.71% | -6134.26万 | -7.54% | | 300232 洲明科技 | | 7778.74万 | 18.54% | -800.14万 | -1.91% | -6978.59万 | -16.63% | | 605588 冠石科技 | | 7094.02万 | 46.96% | -4416.15万 ...
沃格光电:通格微公司生产的GCP玻璃基线路板产品预计明年部分进入初步量产应用
Mei Ri Jing Ji Xin Wen· 2025-08-14 08:27
Core Viewpoint - The company, Wogao Optoelectronics (603773), is collaborating with major manufacturers in various fields to develop GCP glass-based circuit board products, with expectations for initial mass production in some products by next year [1] Group 1 - Wogao Optoelectronics is involved in the semiconductor packaging substrate business, communication RF, CPO optoelectronic co-packaging, and advanced Chiplet packaging applications [1] - The collaboration with major manufacturers is at different stages across various fields [1] - Initial mass production applications for some products are anticipated to begin next year [1]
沃格光电(603773.SH):湖北通格微公司生产的GCP玻璃基线路板产品在CPO光电共封、Chiplet先进封装等产品应用
Ge Long Hui· 2025-08-14 08:08
Core Viewpoint - Wogao Optoelectronics (603773.SH) is collaborating with major manufacturers in various fields for the development of GCP glass-based circuit board products, which are applicable in semiconductor packaging, communication RF, CPO optoelectronic integration, and advanced Chiplet packaging [1] Group 1 - The GCP glass-based circuit board products are involved in multiple applications including semiconductor packaging and communication RF [1] - The collaboration with major manufacturers is at different stages depending on the specific field [1] - Further details will be provided in official announcements [1]
沃格光电(603773.SH):与行业内多家客户合作开发的玻璃基大算力芯片先进封装在大型服务器的产业化应用
Ge Long Hui· 2025-08-14 08:00
Group 1 - The company, Woge Optoelectronics (603773.SH), is collaborating with multiple clients in the industry to develop advanced packaging for glass-based high-performance chips [1] - The project related to the industrial application of these chips in large servers is progressing smoothly [1] - The company indicates that while the project is on track, it will require some time before entering full industrial application [1]
沃格光电(603773.SH):与多家国家大基金有过接洽,也有部分相关基金到公司调研
Ge Long Hui· 2025-08-14 07:53
格隆汇8月14日丨沃格光电(603773.SH)在投资者互动平台表示,公司与多家国家大基金有过接洽,也有 部分相关基金到公司调研,公司会根据发展需求择机选择合作伙伴,目前不存在应披露未披露的重大事 项,具体情况请以公司公告为准。 ...
沃格光电(603773.SH):具有电致变色技术储备
Ge Long Hui· 2025-08-14 07:53
Group 1 - The company has electrochromic technology reserves but currently has no plans for mass production capacity [1]
沃格光电(603773.SH):玻璃基产品在光通讯行业与多家领军企业协同研发
Ge Long Hui· 2025-08-14 07:36
Group 1 - The core viewpoint of the article is that Woge Optoelectronics (603773.SH) is collaborating with several leading companies in the optical communication industry to develop glass-based products, and the project is progressing smoothly [1] Group 2 - The company has indicated that specific details regarding the project will be provided in future announcements [1]
沃格光电(603773.SH):全玻璃结构方案目前已获得著名客户认可
Ge Long Hui· 2025-08-14 07:36
Core Viewpoint - Wogao Optoelectronics (603773.SH) is leading the industry in glass-based circuit board technology for advanced semiconductor packaging, with significant recognition from major clients [1] Group 1: Technology and Innovation - The upgrade solutions for existing packaging substrate materials mainly include glass and ABF/PI, with glass-based packaging to PCB and all-glass multilayer stacking solutions being highlighted [1] - The all-glass multilayer stacking solution is technically challenging, requiring ultra-thin glass-based double-sided circuit boards and core equipment development [1] - Wogao Optoelectronics has established a strong technical reserve and equipment capability in this product area, positioning itself as a leader in the all-glass circuit board industry [1] Group 2: Market Applications - The company is successfully advancing various structures and solutions in collaboration with upstream and downstream industry chains for industrial application [1] - End application scenarios include optical modules/CPO, storage, logical reasoning, autonomous driving, robotics, and 6G communications, indicating a broad market potential [1] - Hubei Tongge Micro's multilayer GCP (glass circuit board) products are being developed and applied in Micro LED direct display and 6G communications, generating certain R&D revenue [1] Group 3: Market Potential - The new market increments are primarily driven by technological breakthroughs that replace existing technical pathways, suggesting a vast market space [1]
MiniLED板块领跌,下跌1.34%
Di Yi Cai Jing· 2025-08-14 03:25
Group 1 - The MiniLED sector experienced a decline of 1.34% [1] - Among the companies, Pengding Holdings saw a drop of 5.03% [1] - Dongshan Precision fell by 4.67% [1] - Wogang Optoelectronics decreased by 3.53% [1] - Other companies such as Kexiang Co., Longli Technology, and Aerospace Rainbow also reported declines exceeding 2% [1]