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德邦科技(688035) - 2024 Q2 - 季度财报
2024-08-23 09:05
Financial Performance - The company reported a total revenue of RMB 500 million for the first half of 2024, representing a 15% increase compared to the same period last year[1]. - The company achieved operating revenue of CNY 462,975,364.20 in the first half of 2024, representing a year-on-year increase of 17.31%[12]. - Net profit attributable to shareholders decreased by 33.18% to CNY 33,710,727.09 compared to the same period last year[12]. - The basic earnings per share fell by 31.43% to CNY 0.24, while diluted earnings per share also decreased by the same percentage[13]. - The company reported a net cash flow from operating activities of CNY 184,143,829.32, a significant improvement from a negative cash flow in the same period last year[12]. - The company reported a total of 142,240,000 shares outstanding, with a decrease of 6,377,800 shares in restricted shares, resulting in a new total of 54,723,332 restricted shares[145]. - The total equity at the end of the reporting period is CNY 2,191,728,468.27, with a capital reserve of CNY 1,832,447,014.60[182]. Market Expansion and Strategy - The company is expanding its market presence in Southeast Asia, targeting a 30% market share by the end of 2025[1]. - A strategic acquisition of a local competitor is in progress, expected to enhance the company's product portfolio and increase market penetration[1]. - The company plans to enhance its digital marketing strategies, aiming for a 40% increase in online sales channels by the end of 2024[1]. - The company has established long-term partnerships with leading clients in the semiconductor packaging materials sector, achieving mass production and delivery of DAF films to key customers[60]. - The company has expanded its product applications in the smart terminal packaging materials sector, focusing on smartphones, tablets, and TWS headphones, capturing significant market share[60]. Research and Development - The company has invested RMB 50 million in R&D for advanced packaging technologies, aiming to reduce production costs by 20%[1]. - The company’s R&D investment totaled approximately ¥26.37 million in the first half of 2024, representing a 20.64% increase compared to ¥21.86 million in the same period last year[45]. - Research and development expenses accounted for 5.70% of operating revenue, an increase of 0.16 percentage points compared to the previous year[13]. - The company has established a comprehensive R&D system in high-end electronic packaging materials, focusing on integrated circuits, smart terminals, and new energy applications[53]. - The company is focusing on developing a diverse product line and rapid iteration capabilities to meet the evolving needs of smart terminal clients, enhancing its market competitiveness[26]. Product Development - New product development includes the launch of a next-generation semiconductor material, projected to increase production efficiency by 25%[1]. - New products such as DAF films and Lid frame adhesive materials have achieved small batch shipments, contributing to overall sales growth[14]. - The company has achieved significant progress in high-end electronic packaging materials, breaking the overseas monopoly in semiconductor, smart terminal, and new energy sectors, positioning itself as a leader in domestic high-end electronic packaging materials[23]. - The company has developed automotive body structural adhesive technology, which effectively provides sealing functions and can replace traditional welding methods, reducing vehicle weight by approximately 80%[34]. Financial Management - The board has approved a share buyback program of up to RMB 100 million to enhance shareholder value[1]. - The company maintained a cash dividend payout ratio of over 30% of net profit since its listing, distributing CNY 35,339,737.00 in cash dividends during the reporting period[62]. - The company has committed to a share lock-up period of 36 months for major shareholders and actual controllers since the stock listing date[102]. - The company has a plan to extend the lock-up period for shares if the stock price falls below the issue price within six months post-listing[104]. Risk Management - The management highlighted potential risks including supply chain disruptions and regulatory changes, which could impact future performance[1]. - The company faces risks related to the slow progress of domestic integrated circuit localization, which could impact performance[74]. - The gross profit margin is at risk of fluctuation due to varying market competition and raw material price changes[70]. Environmental Responsibility - The company has invested 942,300 RMB in environmental protection during the reporting period[96]. - The company has established an environmental protection mechanism and conducts regular evaluations of its facilities[97]. - The company implemented carbon reduction measures, successfully reducing carbon dioxide equivalent emissions by 391 tons through the operation of solar photovoltaic power generation[101]. - The company is focused on maintaining environmental responsibility and has not faced any administrative penalties related to environmental issues during the reporting period[101]. Industry Trends - In the first half of 2024, the global semiconductor market is expected to reach $611.2 billion, representing a 16% year-on-year growth[18]. - The semiconductor materials market is expected to grow at a compound annual growth rate of over 5% from 2023 to 2027, reaching a market size of over $87 billion by 2027[18]. - The power battery industry continues to face challenges such as price competition and inventory clearance, with a focus on semi-solid and solid-state battery technologies as key development directions[27].
德邦科技:东方证券承销保荐有限公司关于烟台德邦科技股份有限公司2024年半年度持续督导跟踪报告
2024-08-23 09:05
东方证券承销保荐有限公司 关于烟台德邦科技股份有限公司 2024 年半年度持续督导跟踪报告 根据《证券发行上市保荐业务管理办法》(以下简称"《保荐办法》")、《上海证券 交易所科创板股票上市规则》(以下简称"《上市规则》")等有关法律、法规的规定,东 方证券承销保荐有限公司(以下简称"保荐机构"或"东方投行")作为烟台德邦科技股 份有限公司(以下简称"德邦科技"或"公司")首次公开发行并在科创板上市的保荐机构, 负责德邦科技持续督导工作,并出具本持续督导跟踪报告。 | 序号 | 工作内容 | 持续督导情况 | | --- | --- | --- | | 1 | 建立健全并有效执行持续督导工作制度,并针对具体的持 | 保荐机构已建立健全并有效执行了持续督导 | | | 续督导工作制定相应的工作计划。 | 制度,并制定了相应的工作计划。 | | 2 | 根据中国证监会相关规定,在持续督导工作开始前,与上 | 保荐机构已与德邦科技签订保荐协议,该协 议明确了双方在持续督导期间的权利和义 | | | 市公司或相关当事人签署持续督导协议,明确双方在持续 | | | | 督导期间的权利义务,并报上海证券交易所备案。 | ...
德邦科技:北京植徳律师事务所关于烟台德邦科技股份有限公司2023年限制性股票激励计划作废部分已授予尚未归属的限制性股票暨调整首次授予价格的法律意见书
2024-08-23 09:05
北京植德律师事务所 关 于 烟台德邦科技股份有限公司 2023 年限制性股票激励计划作废部分已授予 尚未归属的限制性股票暨调整首次授予价格的 法律意见书 植德(证)字[2023]032-4 号 二〇二四年八月 北京植德律师事务所 Merits & Tree Law Offices 北京市东城区东直门南大街 1 号来福士中心办公楼 12 层 邮编: 100007 12th Floor, Raffles City Beijing Office Tower, No.1 Dongzhimen South Street, Dongcheng District, Beijing 100007 P.R.C 电话(Tel) : 010-56500900 传真(Fax) : 010-56500999 www.meritsandtree.com 磨 义 本法律意见书中,除非文义另有所指,下列词语或简称具有如下含义: | 德邦科技/公司 | 指 | 烟台德邦科技股份有限公司 | | --- | --- | --- | | 本次激励计划 | 指 | 烟台德邦科技股份有限公司实施的2023年限制性股票激 | | | | 励计划 | | ...
德邦科技:烟台德邦科技股份有限公司关于以集中竞价交易方式回购公司股份的进展公告
2024-07-31 10:16
证券代码:688035 证券简称:德邦科技 公告编号:2024-047 烟台德邦科技股份有限公司 关于以集中竞价交易方式回购公司股份的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏,并对其内容的真实性、准确性和完整性承担法律责任。 二、 回购股份的进展情况 根据《上市公司股份回购规则》《上海证券交易所上市公司自律监管指引第 7 号——回购股份》等相关法律法规规定,公司在回购期间应当在每个月的前 3 个 交易日内公告截至上月末的回购进展情况,现将公司回购股份进展情况公告如下: 2024 年 7 月,公司通过上海证券交易所交易系统集中竞价交易方式回购公司 股份 62,804 股,占公司总股本 142,240,000 股的比例为 0.0442%,回购成交的最高 价为 29.63 元/股,最低价为 28.43 元/股,支付的资金总额为人民币 1,825,304.4 元 (不含印花税、交易佣金等交易费用)。 截至 2024 年 7 月 31 日,公司通过上海证券交易所交易系统以集中竞价交易 方式已累计回购公司股份 981,756 股,占公司总股本 142,240,000 股的 ...
德邦科技:烟台德邦科技股份有限公司关于以集中竞价交易方式回购公司股份的进展公告
2024-07-01 08:38
证券代码:688035 证券简称:德邦科技 公告编号:2024-046 烟台德邦科技股份有限公司 关于以集中竞价交易方式回购公司股份的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏,并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示: 2023 年 12 月 14 日,公司召开了第二届董事会第二次会议,审议通过了《关 于以集中竞价方式回购公司股份方案的议案》,独立董事对本事项发表了明确同意 的独立意见。审议同意公司使用自有资金以集中竞价交易方式回购公司股份,用于 员工持股计划或股权激励。回购资金总额不低于人民币 3,000 万元(含),不超过 人民币 6,000 万元(含)。回购价格不超过人民币 89.01 元/股(含),回购期限为自 公司董事会审议通过回购方案之日起 12 个月内。具体内容详见公司分别于 2023 年 12 月 15 日及 2023 年 12 月 20 日在上海证券交易所网站(www.sse.com.cn)披 露的《烟台德邦科技股份有限公司关于以集中竞价交易方式回购公司股份方案的 公告》(公告编号:2023-063)、《烟台德邦科技股份 ...
德邦科技:烟台德邦科技股份有限公司2024年度“提质增效重回报”专项行动方案
2024-06-25 12:56
烟台德邦科技股份有限公司 2024 年度"提质增效重回报"专项行动方案 为践行"以投资者为本"的上市公司发展理念,持续推动公司 高质量发展和投资价值提升,切实履行上市公司责任,维护全体股 东利益,共同促进资本市场平稳健康发展,烟台德邦科技股份有限 公司(以下简称"德邦科技"或"公司")制定了 2024 年度"提质 增效重回报"专项行动方案,主要措施如下: 一、聚焦公司主业,深耕下游市场 德邦科技是一家专业从事高端电子封装材料研发及产业化的平 台型高新技术企业,公司以集成电路封装材料技术为引领,并延伸 至智能终端封装材料、新能源应用材料、高端装备应用材料,产品 广泛应用于半导体、消费电子、动力电池、光伏等新兴行业领域。 2023 年,公司所处的行业和市场环境兼具机遇与挑战,一方面 随着物联网、新一代移动通信、AI 等新技术的不断发展与成熟,国 产替代加快推进,带来了新的增长机会;另一方面,部分领域需求 复苏乏力、市场竞争日益激烈,也带来了严峻的挑战。 2024 年,公司将通过以下措施提升经营质量及核心竞争力: 1、坚持自主可控、高效布局的业务策略,聚焦集成电路封装、 智能终端封装、新能源应用、高端装备应用四大应 ...
德邦科技:烟台德邦科技股份有限公司关于以集中竞价交易方式回购公司股份的进展公告
2024-06-03 09:34
证券代码:688035 证券简称:德邦科技 公告编号:2024-043 烟台德邦科技股份有限公司 关于以集中竞价交易方式回购公司股份的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏,并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示: | 回购方案首次披露日 | 2023/12/15 | | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 回购方案实施期限 | 年 2023 12 | 月 | 15 | 日~2024 | 年 12 | 月 | 14 | 日 | | 预计回购金额 | 3,000 | 万元~6,000 | | 万元 | | | | | | 回购用途 | | | 用于员工持股计划或股权激励 | | | | | | | 累计已回购股数 | 股 881,052 | | | | | | | | | 累计已回购股数占总股本比 | 0.6194% | | | | | | | | | 例 | | | | | | | | | | 累计已回购金额 | 4,164.24 ...
德邦科技(688035) - 德邦科技投资者关系活动记录表(2024.5.21)
2024-05-23 08:26
Group 1: Company Overview - In 2023, the company achieved total revenue of 932 million yuan, a year-on-year increase of 0.37% [1] - The net profit attributable to the parent company was 103 million yuan, showing a decline compared to the previous year [1] - The first quarter of 2024 saw revenue of approximately 203 million yuan, an increase of 16.53% year-on-year [2] Group 2: Revenue Structure Changes - The revenue share of the integrated circuit and smart terminal sectors increased, while the share of the new energy sector decreased [2] - The smart terminal sector experienced significant growth, while the new energy sector remained flat year-on-year [2] Group 3: Profit Margin and Cost Management - The decline in gross margin in the first quarter was primarily due to price reductions in the new energy supply chain, particularly in lithium battery materials [2] - The company is implementing cost reduction measures to mitigate the impact of price declines on profits, including optimizing production efficiency and enhancing procurement strategies [6] Group 4: Product Applications and Market Position - DAF film is mainly used in multi-layer chip stacking and has been validated by over 10 companies, with small batch shipments currently in progress [3] - The company’s products in the TWS earphone market have a unit value of approximately 1-2 yuan, with similar values for both Apple and domestic brands [5] - The smartphone unit value demand ranges from tens to over a hundred yuan, with the company having a low market share but potential for growth with new technology iterations [5]
德邦科技:北京植德律师事务所关于烟台德邦科技股份有限公司2024年限制性股票激励计划首次授予事项的法律意见书
2024-05-17 09:42
北京植德律师事务所 关 于 烟台德邦科技股份有限公司 2024 年限制性股票激励计划首次授予事项的 法律意见书 植德(证)字[2024]009-5 号 二〇二四年五月 北京植德律师事务所 Merits & Tree Law Offices 北京市东城区东直门南大街 1 号来福士中心办公楼 5 层 邮编: 100007 5th Floor, Raffles City Beijing Office Tower, No.1 Dongzhimen South Street, Dongcheng District, Beijing 100007 P.R.C 电话(Tel) : 010-56500900 传真(Fax) : 010-56500999 www.meritsandtree.com 释 义 本法律意见书中,除非文义另有所指,下列词语或简称具有如下含义: | 德邦科技/公司 | 指 | 烟台德邦科技股份有限公司 | | --- | --- | --- | | 本激励计划 | 指 | 烟台德邦科技股份有限公司实施的2024年限制性股票激 | | | | 励计划 | | 《激励计划(草案修订 | 指 | 《烟台德邦科 ...
德邦科技:烟台德邦科技股份有限公司第二届董事会第八次会议决议公告
2024-05-17 09:42
证券代码:688035 证券简称:德邦科技 公告编号:2024-039 烟台德邦科技股份有限公司 第二届董事会第八次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏,并对其内容的真实性、准确性和完整性承担法律责任。 烟台德邦科技股份有限公司(以下简称"公司")第二届董事会第八次会议 于 2024 年 5 月 17 日以现场结合通讯表决的方式召开。本次会议通知及相关资料 已于 2024 年 5 月 10 日以电子邮件的方式送达全体董事。本次董事会由解海华先 生主持,会议应出席董事人数为 9 人,实际到会人数为 9 人。本次董事会的召集 与召开程序、出席会议人员资格及表决程序、决议内容符合《公司法》及《公司 章程》的有关规定,会议做出的决议合法、有效。 经公司董事会以记名方式表决,本次董事会逐项审议并通过了以下议案: 一、审议通过《关于向 2024 年限制性股票激励计划激励对象首次授予限制 性股票的议案》 根据《上市公司股权激励管理办法》(以下简称《管理办法》)《2024 年限制 性股票激励计划(草案修订稿)》(以下简称《激励计划》或"本激励计划")的 相关规定和公司 ...