Darbond Technology (688035)
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德邦科技:芯片底部填充材料等几个品类的先进封装材料2025年已有小批量交付
Zheng Quan Ri Bao Wang· 2026-01-23 14:16
Core Viewpoint - The company, Debang Technology, indicates that advanced packaging materials such as chip underfill materials, chip frame AD glue, and chip bonding DAF/CDAF films are still in the early stages of development in China, with market share predominantly held by foreign manufacturers from Japan, South Korea, Europe, and the United States [1] Group 1 - The domestic market for advanced packaging materials is currently limited, with few manufacturers capable of validation or introduction [1] - The company is actively investing in research and development to keep pace with the domestic production process and has achieved mass production capabilities [1] - Small batch deliveries of advanced packaging materials are expected by 2025 for several categories, including chip underfill materials, chip frame AD glue, and chip bonding DAF/CDAF films [1] Group 2 - The company anticipates an acceleration in the domestic production process and is looking forward to customers actively adopting large-scale usage of these materials [1]
德邦科技:公司新能源应用材料出货量持续保持较高速度增长,市场份额较为稳定
Zheng Quan Ri Bao Wang· 2026-01-23 14:14
Core Viewpoint - The company is experiencing stable growth in the sales of new energy application materials, driven by the increasing demand from the downstream electric vehicle market and rapid penetration of energy storage business, despite facing pricing pressure due to cost-cutting demands from the industry [1] Group 1: Company Performance - The company reported a continuous high-speed growth in the shipment volume of new energy application materials [1] - The market share of the company remains relatively stable [1] Group 2: Cost Management Strategies - The company is implementing multiple cost-reduction measures in response to pricing pressures, including the commissioning of advanced fully automated production lines that significantly lower production and operational costs [1] - The company possesses leading capacity and output advantages domestically, along with significant bargaining power in raw material procurement [1] - Continuous optimization of formulations and technological cost reductions are part of the company's strategy to maintain reasonable gross margins while achieving sales growth in the new energy sector [1]
德邦科技:公司导热界面材料目前已经成为公司重要的支柱业务之一
Zheng Quan Ri Bao Wang· 2026-01-23 14:14
证券日报网1月23日讯,德邦科技在接受调研者提问时表示,公司导热界面材料目前已经成为公司重要 的支柱业务之一,在收入、利润方面均有较大的贡献。公司导热界面材料主要由深圳德邦界面、苏州泰 吉诺两个子公司负责,两个子公司在产品应用定位上略有区别。深圳德邦界面产品广泛应用于消费电 子、汽车电子、存储、通讯、新能源等领域,并在汽车电子、存储等高附加值领域持续突破;泰吉诺产 品主要应用于服务器领域,同时也应用于消费电子、汽车电子、通讯等领域。 ...
德邦科技:公司为集成电路提供高性能导热界面材料
Zheng Quan Ri Bao Zhi Sheng· 2026-01-23 14:13
Core Viewpoint - Debang Technology provides a range of high-performance packaging materials for integrated circuits, addressing thermal management issues to ensure stable and reliable operation of devices [1] Group 1: Product Offerings - The company’s integrated circuit packaging materials include thermal series products (thermal pads, thermal gels, phase change materials PCM, liquid metals), die attach materials (die attach glue DAP, die attach film DAF/CDAF), and thin film series for chip packaging (UV thinning film, UV cutting film) [1] - High-performance thermal interface materials (TIMs) such as TIM1, TIM1.5, TIM2, thermal grease, gels, phase change materials, and globally leading gel pads are offered to solve thermal management issues between chips and heat sinks [1] Group 2: Clientele and Market Presence - The company serves major domestic integrated circuit packaging and testing enterprises, including Tongfu Microelectronics, Huatian Technology, and Changdian Technology, with its die attach glue applicable to various packaging forms like MOS, QFN, QFP, BGA, and memory [1] - In the area of wafer UV films, the company is currently supplying in bulk to domestic integrated circuit packaging and testing companies such as Huatian Technology, Changdian Technology, and Risen Technology [1] Group 3: Market Potential - Breakthroughs and introductions of advanced packaging materials such as chip bottom filling materials, chip frame AD glue, and die attach films have achieved small batch shipments and have been validated by leading customers, indicating a broad market outlook [1]
德邦科技:集成电路和智能终端板块占比明显提升
Zheng Quan Ri Bao Wang· 2026-01-23 14:10
Core Viewpoint - Debang Technology focuses on integrated circuit packaging materials technology, targeting four main application areas: integrated circuit packaging, smart terminal packaging, new energy applications, and high-end equipment applications [1] Revenue Breakdown - As of the first half of 2025, the revenue distribution is as follows: integrated circuit segment accounts for 16.4% of total revenue, smart terminal segment for 24.2%, new energy segment for 52%, and high-end equipment segment for 7.2% [1] Growth Trends - In the past two years, the proportion of revenue from the integrated circuit and smart terminal segments has significantly increased, while the new energy segment is expected to show a declining trend in its revenue share [1]
电子化学品板块1月21日涨1.65%,江化微领涨,主力资金净流入8.78亿元
Zheng Xing Xing Ye Ri Bao· 2026-01-21 08:53
Group 1 - The electronic chemicals sector increased by 1.65% on January 21, with Jianghuai Micro leading the gains [1] - The Shanghai Composite Index closed at 4116.94, up 0.08%, while the Shenzhen Component Index closed at 14255.12, up 0.7% [1] - Jianghuai Micro's stock price rose by 10.02% to 25.92, with a trading volume of 16,900 lots and a transaction value of approximately 43.68 million yuan [1] Group 2 - The electronic chemicals sector saw a net inflow of 878 million yuan from institutional investors, while retail investors experienced a net outflow of 643 million yuan [2] - The trading data indicates that Zhongshi Technology and Jingrui Electric Materials had significant price increases of 8.64% and 7.07%, respectively [1][2] - The overall trading volume for the electronic chemicals sector was substantial, with notable transactions in stocks like Zhongshi Technology, which had a transaction value of 1.597 billion yuan [1][2] Group 3 - The main net inflow for Jingrui Electric Materials was 387 million yuan, while it faced a net outflow of 225 million yuan from retail investors [3] - Zhongshi Technology had a net inflow of 130 million yuan from institutional investors, with a net outflow of 81.98 million yuan from retail investors [3] - The data reflects a mixed sentiment in the electronic chemicals sector, with some stocks attracting institutional interest while others faced retail selling pressure [3]
烟台德邦科技股份有限公司关于召开2026年第一次临时股东会的通知
Shang Hai Zheng Quan Bao· 2026-01-19 19:27
Group 1 - The company will hold its first extraordinary general meeting of shareholders on February 4, 2026, at 14:30 in Yantai, Shandong Province [2][5] - The voting will be conducted through both on-site and online methods, utilizing the Shanghai Stock Exchange's voting system [3][5] - Shareholders must register for the meeting by January 30, 2026, and provide necessary identification documents [13][14] Group 2 - The company announced a change in its fundraising project from a semiconductor packaging materials project to a semiconductor materials R&D and production base in South China, with a total investment of 230.4954 million yuan [20][21] - The new project will utilize 62.3699 million yuan of the remaining funds from the original project, with the excess to be covered by the subsidiary's own funds [20][21] - The new project aims to enhance production efficiency and support the company's long-term growth strategy, with an expected production capacity of 450 tons annually after completion [25][32] Group 3 - The company has received approval from its board for the project change, which does not involve related transactions or constitute a major asset restructuring [21][41] - The project is expected to be completed within two years, with production commencing thereafter [20][25] - The company emphasizes that the change will not adversely affect its normal operations or shareholder interests [41][45]
德邦科技:2026年2月4日召开2026年第一次临时股东会
Zheng Quan Ri Bao Wang· 2026-01-19 14:11
Group 1 - The company, Debang Technology, announced that it will hold its first extraordinary shareholders' meeting of 2026 on February 4, 2026 [1]
德邦科技:公司对控股子公司提供的担保总额为2.25亿元
Mei Ri Jing Ji Xin Wen· 2026-01-19 11:33
Group 1 - The company, Debang Technology, announced that as of the date of the announcement, the total amount of external guarantees provided by the company and its controlling subsidiaries is 225 million yuan, which represents 9.81% of the company's most recent audited net assets and 7.58% of total assets [1] Group 2 - The short drama industry has experienced a significant boom, creating 690,000 jobs, with actors who previously worked as delivery personnel finding employment in this sector [1] - The income for these actors is reported to be relatively good, although the work is described as exhausting, with production teams keeping emergency medical supplies on hand due to the demanding nature of the job [1] - There are reports of actors being able to actually sleep during scenes that require them to appear asleep, indicating a level of comfort and familiarity with the filming process [1]
德邦科技(688035) - 东方证券股份有限公司关于烟台德邦科技股份有限公司变更部分募投项目的核查意见
2026-01-19 11:01
东方证券股份有限公司 关于烟台德邦科技股份有限公司 变更部分募投项目的核查意见 一、募集资金基本情况 根据中国证券监督管理委员会《关于同意烟台德邦科技股份有限公司首次公 开发行股票注册的批复》(证监许可[2022]1527 号),公司首次向社会公开发行人 民币普通股(A 股)股票 3,556 万股,每股面值 1.00 元,每股发行价格 46.12 元。 本次公开发行募集资金总额为人民币 164,002.72 万元,实际募集资金净额为 148,748.32 万元。截至 2022 年 9 月 14 日,上述募集资金已全部到位,永拓会计 师事务所(特殊普通合伙)对公司本次公开发行新股的募集资金到位情况进行了 审验,并出具了《验资报告》(永证验字[2022]210029 号)。公司对募集资金采取 了专户存储制度,设立了相关募集资金专项账户。募集资金到账后,已全部存放 于募集资金专项账户内,并与保荐机构、存放募集资金的银行签署了募集资金三 方监管协议。具体情况详见 2022 年 9 月 16 日披露于上海证券交易所网站 (www.sse.com.cn)的《烟台德邦科技股份有限公司首次公开发行股票科创板上 市公告书》。 ...