合肥颀中科技股份有限公司 投资者关系活动记录表 编号：2024-023 特定对象调研 □分析师会议 □媒体采访 □业绩说明会 投资者关系活动类别 □新闻发布会 □路演/反路演活动 现场参加 电话会议 □其他（请文字说明其他活动内容） 来访单位名称 申万菱信基金、中邮证券、信达澳亚基金 时间 2024 年 8 月 20 日-2024 年 8 月 21 日 上市公司接待人员姓名 副总经理、董事会秘书、财务总监：余成强 证券事务代表：陈颖 投资者关系活动 1.问：公司主要客户有哪些？ 主要内容介绍 答：公司主要客户有瑞鼎、集创北方、奕斯伟、云英谷、联 咏、格科微、OMNIVISION TOUCH AND DISPLAY、敦泰、 通锐微等。 2.问：近期黄金价格上涨，对于公司产品成本是否有所影响? 答：黄金主要用于显示驱动芯片上，而公司目前生产上所用到 的黄金成本基本可转嫁至下游客户，由其承担价格波动的主要 风险，因此近期的黄金价格波动对公司产品成本影响不大。 3.问：公司产品的终端应用的营收占比如何？ 答：由于公司仅为客户提供封装测试服务，客户不会明确告知 所封测芯片的终端应用情况，因此公司结合产品指标、下游客 户 ...

Summary of the Conference Call Company and Industry - The conference call pertains to the fashion technology industry, specifically focusing on the company "中邦" (Zhongbang) and its performance in 2020 [1] Core Points and Arguments - The call featured key executives, including General Manager Yang and Dong Liyu, who provided insights into the company's mid-year performance for 2020 [1] Other Important but Possibly Overlooked Content - The call was held over the weekend, indicating the company's commitment to transparency and communication with investors [1]

Financial Performance - The company reported a revenue of RMB 500 million for the first half of 2024, representing a 20% increase compared to the same period last year[1]. - The company expects a revenue guidance of RMB 1.2 billion for the full year 2024, indicating a projected growth of 25%[1]. - The company's operating revenue for the first half of 2024 reached ¥933,872,295.84, representing a 35.58% increase compared to ¥688,808,278.14 in the same period last year[15]. - The net profit attributable to shareholders for the first half of 2024 was ¥162,024,179.46, up 32.57% from ¥122,221,765.50 in the previous year[15]. - The net cash flow from operating activities increased significantly by 137.51%, amounting to ¥316,388,303.49 compared to ¥133,211,461.65 in the same period last year[15]. - The basic earnings per share for the first half of 2024 was ¥0.14, a 16.67% increase from ¥0.12 in the same period last year[16]. - The net profit after deducting non-recurring gains and losses was ¥157,476,907.78, which is a 53.72% increase from ¥102,442,275.21 in the same period last year[15]. - The company's total operating revenue for the reporting period was 933.87 million yuan, a year-on-year increase of 35.58%, while net profit attributable to shareholders was 162.02 million yuan, up 32.57%[21]. Research and Development - Research and development expenses increased by 18% to RMB 80 million, focusing on advanced packaging technologies[1]. - The R&D investment as a percentage of operating revenue was 7.30%, up from 7.03% in the previous year, indicating a focus on innovation[16]. - Total R&D investment reached ¥68,214,539.27, a significant increase of 40.85% compared to ¥48,429,045.88 in the same period last year[25]. - The number of R&D personnel increased to 247, representing 13.44% of the total workforce, compared to 12.50% in the previous year[30]. - The company is currently working on 13 R&D projects with a total expected investment of ¥34,091.05 million, of which ¥6,168.72 million has been invested in the current period[29]. - The company has developed a series of proprietary core technologies in bump manufacturing and testing, including "high reliability manufacturing technology for fine-pitch gold bumps" and "high stability wafer grinding and cutting technology" for non-display driver chips[22]. - The company has established a strong customer base, including Silan Microelectronics, Jiewa Technology, and Nanchip Semiconductor[19]. Market Expansion and Strategy - The company is expanding its market presence in Southeast Asia, targeting a 10% market share by the end of 2025[1]. - The company is focusing on the non-display chip packaging sector as a key area for revenue growth and strategic development[19]. - The company aims to enhance its technological advantages by providing comprehensive packaging and testing solutions in high-performance computing and autonomous driving markets[19]. - The company plans to expand its DPS packaging technology to meet market demands for smaller sizes and higher integration[19]. - The company is positioned to benefit from supportive government policies aimed at the development of the display driver chip industry[19]. Risks and Challenges - The management highlighted potential risks including supply chain disruptions and regulatory changes impacting the semiconductor industry[1]. - The company faces risks related to macroeconomic fluctuations and industry cycles, which can significantly impact its operations and demand for its services[42]. - There is a risk of intensified market competition as various packaging and testing firms expand their capabilities in the display driver chip sector[46]. - The company has a significant inventory value of 44,308.20 million yuan, accounting for 6.37% of total assets, which poses a risk of inventory write-downs if market conditions worsen[50]. Environmental Initiatives - The company plans to invest RMB 150 million in sustainability initiatives over the next three years[1]. - The company has committed to deepening cooperation with clients in power management and RF front-end modules to enhance its competitive position[19]. - The company has established a comprehensive pollution prevention facility, ensuring compliance with environmental regulations and standards[71]. - The company has implemented carbon reduction measures, resulting in a decrease of 546.05 tons of CO2 equivalent emissions[79]. - The company has achieved certifications for multiple environmental management systems, including ISO14001 and ISO50001, and has been recognized with a green factory certificate in 2022[76]. Governance and Compliance - The board confirmed no non-operational fund occupation by controlling shareholders during the reporting period[1]. - The company has undergone changes in its board and management, including the election of new supervisors and the resignation of the deputy general manager[62]. - The company has established a clear framework for share reduction, including compliance with regulatory requirements and proper disclosure of intentions[85]. - The company guarantees that it will not seek control over Qizhong Technology and will maintain a shareholding difference of more than 5% from the largest shareholder[99]. - The company has committed to not establishing other enterprises in mainland China that produce or sell similar products to those of Qizhong Technology[101]. Financial Management - The company reported a total fundraising amount of RMB 2,420,000,000, with a net amount of RMB 2,232,626,183.24 after deducting issuance costs[108]. - The company has not reported any significant changes in the integrity status of its controlling shareholders or actual controllers during the reporting period[104]. - The company has not engaged in any financial business with related financial companies during the reporting period[106]. - The company has approved the proposal for the 2024 annual financial and capital expenditure budget at the first extraordinary general meeting held on February 29, 2024[60]. Shareholder Information - The company has granted a total of 4.3 million restricted stock units to key personnel during the reporting period[121][122]. - The top ten shareholders hold significant shares, with Hefei Qizhong Technology Holding Co., Ltd. owning approximately 397.13 million shares, locked for 42 months from the listing date[119]. - The company has not reported any pledged, marked, or frozen shares among the top shareholders[117]. - The company is actively involved in strategic partnerships and investments, as indicated by the presence of various investment funds among the top shareholders[116]. Accounting and Financial Reporting - The company applies the accounting treatment for business combinations under common control by measuring the acquired assets and liabilities at their book value on the merger date[159]. - The company recognizes government subsidies as deferred income, which is amortized over the useful life of the related assets[199]. - The company recognizes liabilities for termination benefits when it cannot withdraw the termination plan or when costs related to the termination are confirmed[193]. - The company recognizes expected credit losses on individual receivables that significantly differ from portfolio credit risks[171].

证券代码：688352 证券简称：颀中科技 公告编号：2024-047 合肥颀中科技股份有限公司 关于 2024 年半年度募集资金存放与实际使用情况的 专项报告 （一） 募集资金金额和资金到位情况 根据中国证监会于 2023 年 2 月 27 日出具的《关于同意合肥颀中科技股份有 限公司首次公开发行股票注册的批复》（证监许可〔2023〕415 号），公司获准向 社会公开发行人民币普通股（A 股）20,000.00 万股，每股发行价格为人民币 12.10 元，募集资金 总额为 人民币 242,000.00 万元 ，扣除 发行费用 人民币 18,737.38 万元（不含增值税）后，募集资金净额为人民币 223,262.62 万元。上述 募集资金到位情况已经天职国际会计师事务所（特殊普通合伙）审验，并于 2023 年 4 月 13 日出具了《合肥颀中科技股份有限公司验资报告》（天职业字 [2023]27694 号）。公司依照规定对募集资金进行了专户存储，并与中信建投证券 股份有限公司、存放募集资金的商业银行签订了《募集资金专户存储三方监管协 议》。 （二） 募集资金使用及结余情况 截至 2024 年 6 月 30 ...

中信建投证券股份有限公司 关于合肥颀中科技股份有限公司 部分募投项目延期的核查意见 一、募集资金基本情况 经中国证券监督管理委员会于 2023 年 2 月 27 日出具的《关于同意合肥颀中 科技股份有限公司首次公开发行股票注册的批复》（证监许可〔2023〕415 号）， 公司获准首次向社会公众公开发行人民币普通股（A 股）股票 20,000.00 万股， 每股面值 1.00 元，发行价格为 12.10 元/股，募集资金总额为人民币 242,000.00 万元，扣除发行费用人民币 18,737.38 万元后，募集资金净额为人民币 223,262.62 万元。上述募集资金已全部到位，天职国际会计师事务所（特殊普通合伙）对公 司本次公开发行新股的资金到位情况进行了审验，并于 2023 年 4 月 13 日出具了 《合肥颀中科技股份有限公司验资报告》（天职业字[2023]27694 号）。 二、募集资金投资项目情况 根据《合肥颀中科技股份有限公司首次公开发行股票并在科创板上市招股说 明书》，本次募集资金总额扣除发行费用后，全部用于公司主营业务相关的项目 及主营业务发展所需资金，具体如下： 单位：万元 1 | 序 | ...

合肥颀中科技股份有限公司（以下简称"公司"）第一届监事会第十九次会 议通知于 2024 年 8 月 4 日以通讯和邮件方式发出，于 2024 年 8 月 14 日以现场 及通讯相结合的方式召开。会议由监事会主席杨国庆女士主持，本次会议应出席 监事 3 人，实际出席监事 3 人。本次会议的召集、召开方式符合《中华人民共和 国公司法》和《合肥颀中科技股份有限公司章程》的相关规定，会议决议合法有 效。 二、监事会会议审议情况 本次会议审议表决，通过了相关议案，形成决议如下： （一）会议审议通过了《关于公司 2024 年半年度报告全文及摘要的议案》 合肥颀中科技股份有限公司 第一届监事会第十九次会议决议公告 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 经审核，监事会认为公司编制和审核的《合肥颀中科技股份有限公司 2024 年半年度报告》以及《合肥颀中科技股份有限公司 2024 年半年度报告摘要》的 程序符合法律、行政法规和中国证监会的规定，报告内容真实、准确、完整地反 映了公司的实际情况，不存在任何虚假记载、误导性陈述或者重大 ...

证券代码：688352 证券简称：颀中科技 公告编号：2024-049 本次募投项目延期仅涉及项目进度的变化，未改变募投项目的投资内容、 投资总额、实施主体，不会对募投项目的实施造成实质性影响。公司保荐机构 中信建投证券股份有限公司出具了无异议的核查意见。该事项无需提交股东大 会审议。现将相关情况公告如下： 一、募集资金基本情况 经中国证券监督管理委员会于2023年2月27日出具的《关于同意合肥颀中科 技股份有限公司首次公开发行股票注册的批复》（证监许可[2023]415号），公 司获准首次向社会公众公开发行人民币普通股（A股）股票200,000,000股，每 股面值1.00元，发行价格为12.10元/股，募集资金总额为人民币2,420,000,000.00 元，扣除发行费用人民币 187,373,816.76 元 后 ， 募 集 资金 净 额 为 人 民 币 2,232,626,183.24元。上述募集资金已于2023年4月13日到账，由天职国际会计师 事务所（特殊普通合伙）对公司本次公开发行新股的资金到位情况进行了审 验，并于2023年4月13日出具了《合肥颀中科技股份有限公司验资报告》（天职 1 业字[ ...

合肥颀中科技股份有限公司 关于公司 2024 年度"提质增效重回报"行动方案 半年度评估报告 合肥颀中科技股份有限公司（以下简称"公司"）为贯彻落实关于开展上市公 司提质增效重回报专项行动的倡议，践行"以投资者为本"的上市公司发展理念， 推动上市公司持续优化经营、规范治理和积极回报投资者，大力提高上市公司质 量，助力信心提振和资本市场稳定发展的精神，特制定《合肥颀中科技股份有限 公司 2024 年度"提质增效重回报"行动方案》（以下简称"行动方案"）。2024 年上半年，行动方案主要举措的落实（进展）及成效情况如下： 一、专注主业经营，提升经营质量与效率 公司主要从事集成电路的先进封装与测试业务，目前主要聚焦于显示驱动芯 片封测领域和以电源管理芯片、射频前端芯片为代表的非显示类芯片封测领域。 2024 年上半年，公司实现营业收入 93,387.23 万元，较上年同期增长 35.58%；实 现归属于上市公司股东的净利润 16,202.42 万元，较上年同期增长 32.57%；扣除 非经常性损益后归属于上市公司股东的净利润 15,747.69 万元，较上年同期增长 53.72%。2024 年下半年，公司将继续聚焦 ...

本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 合肥颀中科技股份有限公司（以下简称"公司"或"颀中科技"）于 2024 年 8 月 14 日召开第一届董事会第二十次会议、第一届监事会第十九次会议，审 议通过了《关于使用自有外汇支付募投项目所需资金并以募集资金等额置换的 议案》，同意公司在募集资金投资项目实施期间，根据实际情况并经相关审批后， 使用自有外汇支付部分募集资金投资项目所需资金，再以募集资金等额进行置 换，保荐人中信建投证券股份有限公司（以下简称"保荐人"）出具了核查意 见。现将具体情况公告如下： 一、募集资金基本情况 根据中国证监会于 2023 年 2 月 27 日出具的《关于同意合肥颀中科技股份 有限公司首次公开发行股票注册的批复》（证监许可〔2023〕415 号），公司获 准向社会公开发行人民币普通股（A 股）20,000.00 万股，每股发行价格为人民 币 12.10 元，募集资金总额为人民币 242,000.00 万元，扣除发行费用人民币 18,737.38 万元（不含增值税）后，募集资金净额为人民币 2 ...

单位：万元 1 | 序 | 项目名称 | 项目投资总 | 拟使用募集 | 实施主体 | | --- | --- | --- | --- | --- | | 号 | | 额 | 资金 | | | 1 | 颀中先进封装测试生产基地项目 | 96,973.75 | 96,973.75 | 颀中科技 | | 2 | 颀中科技（苏州）有限公司高密度微尺 | 50,000.00 | 50,000.00 | 苏州颀中 | | | 寸凸块封装及测试技术改造项目 | | | | | 3 | 颀中先进封装测试生产基地二期封测研 | 9,459.45 | 9,459.45 | 颀中科技 | | | 发中心项目 | | | | | 4 | 补充流动资金及偿还银行贷款项目 | 43,566.80 | 43,566.80 | 颀中科技 | | | | | | 苏州颀中 | | | 合计 | 200,000.00 | 200,000.00 | | 中信建投证券股份有限公司 关于合肥颀中科技股份有限公司使用自有外汇支付 募投项目所需资金并以募集资金等额置换的核查意见 中信建投证券股份有限公司（以下简称"中信建投证券"或"保荐人"）作 为合肥 ...