本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2025/6/19 | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | | 回购方案实施期限 | 2025 年 6 月 6 | 18 | 日~2026 | 年 | 月 | 17 | 日 | | 预计回购金额 | 7,500万元~15,000万元 | | | | | | | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 | | | | | | | | | □用于转换公司可转债 □为维护公司价值及股东权益 | | | | | | | | 累计已回购股数 | 8,714,483股 | | | | | | | | 累计已回购股数占总股本比例 | 0.73% | | | | | | | | 累计已回购金额 | 100,398,688.97元 | | | | | | | | 实际回购价格区间 | 11.10元/股~11.86元/股 | | | | | | ...

Core Viewpoint - The storage market is experiencing a significant price increase, with Samsung Electronics raising NAND flash contract prices by over 100% starting January 2026, driven by strong demand for AI-related hardware and supply-demand imbalances across the semiconductor industry [1] Group 1: Price Increases in the Semiconductor Industry - The price increase in storage chips is spreading to the foundry and packaging/testing sectors, with some foundries planning to raise prices by 5-20% due to rising demand for AI-related power ICs and reduced production from major manufacturers [3][4] - The demand for AI servers is driving a rapid price increase across the semiconductor supply chain, with foundries and packaging companies responding to the increased demand and rising raw material costs [3][4] Group 2: Expansion in Packaging and Testing - Companies in the packaging and testing sector are actively expanding capacity, with investments announced for new facilities in Malaysia and increased funding for advanced packaging companies in China [5] - The leading packaging company, ASE Technology, has raised its price increase forecast for 2026 due to strong AI semiconductor demand and capacity constraints [4] Group 3: Passive Component Price Surge - There is a significant price increase in passive components, with major manufacturers like Huaxin Technology and Yageo announcing price hikes of 10-20% due to rising costs of raw materials and increased demand from AI servers [6][8] - The demand for passive components, particularly MLCCs, has surged, with usage in AI server motherboards increasing by over 100% compared to traditional servers [9][10] Group 4: Raw Material Cost Pressures - The prices of key raw materials such as copper, silver, and gold have reached record highs, contributing to the rising costs of passive components [10] - The expectation of price increases leads to stockpiling by distributors, further exacerbating supply constraints and driving prices higher [11]

Core Viewpoint - The storage market is experiencing a price increase trend that is expected to continue into 2026, affecting not only storage chips but also the foundry and packaging sectors, as well as passive components [1][4]. Group 1: Price Increases in the Semiconductor Industry - Micron Technology and other manufacturers are raising prices due to supply chain pressures and increased costs, with price adjustments for products like MCU and Norflash ranging from 15% to 50% [2]. - Samsung Electronics has negotiated a price increase of over 100% for NAND flash contracts with major customers, effective from January 2026 [2]. - The demand for AI-related hardware is driving a supply-demand imbalance, leading to price hikes in both foundry and packaging sectors [2][4]. Group 2: Foundry and Packaging Sector Dynamics - Foundries are increasing prices by 5% to 20% due to rising raw material costs and strong demand for AI-related power ICs [5][6]. - The packaging sector is also seeing price increases, with companies like ASE Technology raising their forecasts for price hikes to 5% to 20% due to AI semiconductor demand and capacity constraints [6]. - Companies are expanding their production capabilities in response to the increased demand, such as Yongxi Electronics planning to invest in a new packaging and testing facility in Malaysia with a total investment of up to 2.1 billion yuan [7]. Group 3: Passive Component Price Trends - Passive components, including resistors and capacitors, are experiencing significant price increases, with major manufacturers like Huaxin Technology announcing price hikes effective February 1 [17][18]. - The price increases are attributed to rising costs of raw materials, including metals like silver and copper, which have seen substantial price increases [19][21]. - The demand for high-end capacitors in AI servers has surged, leading to a shift in production capacity and a reduction in supply for mid-range components, further driving up prices [20][22].

Group 1 - The storage sector in the US stock market showed strength, with Micron Technology rising by 5%, SanDisk by over 3%, Western Digital by nearly 3%, and Seagate Technology by over 2% as of January 27 [1] - The semiconductor industry is experiencing widespread price increases due to tight supply and rising costs, with companies like Zhongwei Semiconductor announcing price hikes of 15% to 50% for products like MCU and Norflash [2][3] - AI-related demand is driving the need for increased computing power, leading to a supply-demand imbalance in the semiconductor industry, prompting wafer foundries and packaging/testing companies to raise prices by 5% to 20% [3][4] Group 2 - Morgan Stanley has revised its price increase expectations for leading packaging company ASE, anticipating a 5% to 20% increase in wafer packaging prices due to strong AI semiconductor demand and capacity constraints [4] - Companies like Yongxi Electronics are expanding production capacity in response to rising demand and material costs, with plans to invest up to 2.1 billion yuan in a new integrated circuit packaging and testing facility in Malaysia [4] - Recent reports indicate a significant price increase in passive components, with major players like Huaxin Technology announcing price hikes for resistors effective February 1, driven by rising costs of raw materials and increased demand from AI servers [13][15] Group 3 - The demand for passive components, particularly MLCCs, has surged due to AI server requirements, with usage increasing by over 100% compared to traditional servers [14] - The prices of key metals used in passive components, such as copper and silver, have risen significantly, contributing to the overall increase in component prices [15] - Companies are facing challenges from rising labor, electricity, and raw material costs, leading to further price adjustments across the industry [15]

证券代码：688352 证券简称：颀中科技 公告编号：2026-010 转债代码：118059 转债简称：颀中转债 合肥颀中科技股份有限公司 部分高级管理人员减持股份结果公告 本公司董事会、全体董事及相关股东保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏， 并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： ● 高级管理人员持股的基本情况 公司于近日收到周小青先生出具的《关于股份减持结果的告知函》，截至2026年1月23日，周小青先生 已通过集中竞价方式减持公司股份合计115,885股，占公司总股份的比例为0.01%。截至本公告披露日， 上述高级管理人员减持计划已实施完毕。 一、减持主体减持前基本情况 ■ 上述减持主体无一致行动人。 二、减持计划的实施结果 （一）高级管理人员因以下事项披露减持计划实施结果： 截至本公告披露之日，合肥颀中科技股份有限公司（以下简称"公司"）高 级管理人员周小青先生直接持有公司463,541股股份，占公司总股本的比例为0.04%。以上股份来源于公 司首次公开发行前取得的股份，且已于2024年11月15日解除限售并上市流通。 ● 减持计划的实施结果情况 ...

（记者 曾健辉） 每经头条（nbdtoutiao）——国际金价冲破5000美元！7年涨了280%，什么时候才见顶？专家：关键还 看美元，重点关注国际货币体系、降息和科技革命 每经AI快讯，颀中科技1月26日晚间发布公告称，公司于近日收到周小青先生出具的《关于股份减持结 果的告知函》，截至2026年1月23日，周小青先生已通过集中竞价方式减持公司股份合计约12万股，占 公司总股份的比例为0.01%。减持计划已实施完毕。 ...

| 证券代码：688352 | 证券简称：颀中科技 | 公告编号：2026-010 | | --- | --- | --- | | 转债代码：118059 | 转债简称：颀中转债 | | 合肥颀中科技股份有限公司 部分高级管理人员减持股份结果公告 本公司董事会、全体董事及相关股东保证本公告内容不存在任何虚假记载、 误导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律 责任。 重要内容提示： 高级管理人员持股的基本情况 截至本公告披露之日，合肥颀中科技股份有限公司（以下简称"公司"）高 级管理人员周小青先生直接持有公司 463,541 股股份，占公司总股本的比例为 0.04%。以上股份来源于公司首次公开发行前取得的股份，且已于 2024 年 11 月 15 日解除限售并上市流通。 减持计划的实施结果情况 根据公司 2025 年 12 月 31 日披露的《合肥颀中科技股份有限公司部分高级 管理人员减持股份计划公告》（公告编号：2025-071），周小青先生因个人资金需 求，于本次减持计划公告披露日起 15 个交易日后的 3 个月内，在符合法律法规 的前提下，拟通过集中竞价、大宗交易的方式减持所持 ...

证券代码：688352 证券简称：颀中科技 公告编号：2026-009 转债代码：118059 转债简称：颀中转债 合肥颀中科技股份有限公司 登录新浪财经APP 搜索【信披】查看更多考评等级 二、对公司的影响及应对措施 本次事故未造成人员伤亡，事故导致凸块制程段部分无尘室环境及生产设备受到影响，具体损失情况正 在核实评估，初步预计或将对2026年全年业绩产生一定影响。公司已对受损资产投保财产险，相关保险 核损理赔工作有序推进。苏州颀中因本次事故部分需后续处理的产品的生产进度，公司正统筹安排合肥 厂区产能提供支应，并加速凸块产能扩充，尽最大努力保障客户订单交付，同时全力加快多元化芯片封 测事业的布局与扩展。 截至本公告日，公司生产经营情况正常。公司将全力配合相关部门对事故进行调查，认真查明事故原 因，敦促下属子公司加强自身的安全管理，防止类似事故再次发生。 三、风险提示 公司指定信息披露媒体为《上海证券报》《中国证券报》《证券时报》《证券日报》《经济参考报》等 及上海证券交易所网站（www.sse.com.cn），公司发布的信息均以在上述指定媒体披露的信息为准。公 司将密切关注本次事故的具体影响，并及时按规定履 ...

2025年前三季度，颀中科技实现收入16.05亿元，归母净利润1.85亿元。 商报君送福利 1月25日，颀中科技（688352）发布公告，通报关于全资子公司颀中科技（苏州）有限公司发生火灾事故的情况。 据公告，2026年1月24日清晨，公司的全资子公司苏州颀中厂区凸块制程段发生火灾，事故后公司迅速启动应急预案，成立现场应急小组，并配合当地消 防部门进行灭火救援，目前火情已扑灭，具体事故原因仍在调查中。 此次火灾未造成人员伤亡，但对凸块制程段的部分无尘室环境及生产设备造成影响，具体损失正在核实评估，初步预计将对2026年全年业绩产生一定影 响。公司已对受损资产投保财产险，相关保险理赔工作正在推进。同时，为保障客户订单交付，公司将统筹安排合肥厂区的产能，并加速凸块产能扩充， 以应对生产进度的影响。 颀中科技是集成电路高端先进封装测试服务商，可提供全方位的集成电路封测综合服务，覆盖显示驱动芯片、电源管理芯片、射频前端芯片等多类产品。 朋友们千万别错过！ ↓↓↓ 来源 读创财经 看推文多多留言 有机会获商报君送出的礼品 ...

本次事故未造成人员伤亡，事故导致凸块制程段部分无尘室环境及生产设备受到影响，具体损失情况正 在核实评估，初步预计或将对2026年全年业绩产生一定影响。公司已对受损资产投保财产险，相关保险 核损理赔工作有序推进。苏州颀中因本次事故部分需后续处理的产品的生产进度，公司正统筹安排合肥 厂区产能提供支应，并加速凸块产能扩充，尽最大努力保障客户订单交付，同时全力加快多元化芯片封 测事业的布局与扩展。截至本公告日，公司生产经营情况正常。 格隆汇1月25日丨颀中科技(688352.SH)公布，2026年1月24日清晨，公司全资子公司颀中科技（苏州） 有限公司（称"苏州颀中"）厂区凸块制程段发生火灾事故。事故发生后，公司立即启动应急预案，成立 现场应急小组，全力配合当地消防部门开展现场灭火救援，火情已经扑灭。目前，火灾事故的具体原因 正在调查、核实中。 ...