证券代码：688352 证券简称：颀中科技 公告编号：2025-014 合肥颀中科技股份有限公司 第二届董事会第三次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、董事会会议召开情况 合肥颀中科技股份有限公司（以下简称"公司"）第二届董事会第三次会议 通知于 2025 年 3 月 21 日以通讯和邮件方式发出，于 2025 年 3 月 31 日以现场及 通讯相结合的方式召开。会议由董事长陈小蓓女士主持，本次会议应出席董事 9 人，实际出席董事 9 人。本次会议的召集、召开方式符合《中华人民共和国公司 法》《合肥颀中科技股份有限公司章程》及《合肥颀中科技股份有限公司董事会 议事规则》的相关规定，会议决议合法有效。 二、董事会会议审议情况 本次会议审议表决，通过了相关议案，形成决议如下： （一）会议审议通过了《关于<合肥颀中科技股份有限公司 2024 年年度报 告>及摘要的议案》 本议案已经公司第二届董事会审计委员会第二次会议审议通过，并同意提交 董事会审议。 表决结果：同意 9 票，反对 0 票，弃权 0 ...

Dividend Distribution - The company plans to distribute a cash dividend of 0.5 yuan per 10 shares, totaling approximately 59.45 million yuan (including tax) based on a total share capital of 1,189.037288 million shares as of December 31, 2024[5]. - The company has completed the cash dividend distribution of 59.45 million yuan (including tax) for the first three quarters of 2024 on November 22, 2024[5]. - The company plans to distribute a cash dividend of RMB 0.5 per 10 shares (including tax), totaling RMB 59,451,864.40 for the year 2024[179]. - The net profit attributable to shareholders for the year 2024 is RMB 313,276,970.57, with a cash dividend payout ratio of 37.95%[180][184]. - The cumulative cash dividend amount for the last three accounting years is RMB 118,903,728.80, with an average net profit of RMB 313,276,970.57 during the same period[185]. Financial Performance - The company's operating revenue for 2024 reached ¥1,959,375,628.33, representing a year-on-year increase of 20.26% compared to ¥1,629,340,035.50 in 2023[23]. - The net profit attributable to shareholders for 2024 was ¥313,276,970.57, a decrease of 15.71% from ¥371,662,508.64 in 2023[23]. - The net profit attributable to shareholders after deducting non-recurring gains and losses was ¥276,676,779.67, down 18.55% from ¥339,685,424.03 in 2023[23]. - The net cash flow from operating activities for 2024 was ¥690,346,690.70, an increase of 27.54% compared to ¥541,275,168.61 in 2023[23]. - As of the end of 2024, the total assets amounted to ¥6,991,013,658.68, a decrease of 2.27% from ¥7,153,333,609.63 at the end of 2023[23]. - The net assets attributable to shareholders at the end of 2024 were ¥6,003,292,022.20, an increase of 2.97% from ¥5,830,126,768.94 at the end of 2023[23]. - Basic earnings per share (EPS) decreased by 21.21% to CNY 0.26 compared to CNY 0.33 in the previous period[25]. - Diluted EPS also decreased by 21.21% to CNY 0.26 from CNY 0.33[25]. - The gross profit margin for the reporting period was 31.16%, showing a slight decline compared to the same period last year[93]. - The company's operating revenue reached CNY 1,959,375,628.33, representing a year-on-year increase of 20.26%[107]. - Operating costs amounted to CNY 1,346,577,141.81, reflecting a year-on-year increase of 28.56%[107]. Research and Development - The company's R&D investment as a percentage of operating revenue increased by 1.37 percentage points to 7.89%[25]. - Research and development investment reached 154.69 million yuan, an increase of 45.53% year-on-year, with R&D personnel growing to 284, up 26.22%[38]. - The cumulative R&D investment over the last three accounting years is RMB 154,686,627.28, representing 7.89% of cumulative operating revenue[185]. - The company has developed advanced packaging technologies, including high-reliability gold bump manufacturing and efficient heat dissipation techniques, which are critical for high-end chip performance[80]. - The company has established a robust R&D foundation with proprietary technologies covering all processes from bump manufacturing to wafer testing and packaging[80]. Market Position and Strategy - The company is positioned as a high-end service provider in the integrated circuit packaging and testing sector, maintaining a leading position in the domestic market[55]. - The company is actively expanding its business into non-display chip packaging, focusing on power management and RF front-end chips, to diversify its product offerings[62]. - The company is focusing on advanced packaging technology as a key factor for chip upgrades, aiming to strengthen its core competitiveness in the advanced packaging and testing field[134]. - The company is committed to optimizing its customer structure and expanding its business coverage to overseas clients, responding to the trend of the display and integrated circuit industries moving to mainland China[135]. - The company is dedicated to achieving the localization goal in the advanced packaging and testing industry, improving the overall technical level of the sector[135]. Governance and Compliance - The company has received a standard unqualified audit report from Tianzhi International Accounting Firm[4]. - The company has not reported any non-operating fund occupation by controlling shareholders or related parties[7]. - The company has not violated any decision-making procedures for providing guarantees[7]. - The company has not disclosed any special arrangements for corporate governance[8]. - The company has not faced any situations where more than half of the directors cannot guarantee the authenticity, accuracy, and completeness of the annual report[8]. - The company has not reported any significant changes in its business, products, or services during the reporting period[117]. - The company adheres to all relevant laws and regulations in corporate governance, ensuring the protection of shareholder interests[200]. Risks and Challenges - The company has outlined various risks it may face in its production and operation processes in the report[3]. - The company faces risks related to the loss of core technical talent, which could adversely affect R&D and production[92]. - The company is exposed to foreign exchange risks due to overseas sales and purchases primarily settled in USD or JPY[95]. - The company is at risk of intensified market competition, particularly in the advanced packaging sector, which could impact business performance[101]. - The company has a significant inventory value of 468.47 million yuan, accounting for 6.70% of total assets, exposing it to inventory impairment risks[96]. Management and Personnel - The company has a total of 1,000 core technical personnel, with no changes in the number during the reporting period[149]. - The management team has over 15 years of experience in the advanced packaging industry, contributing to the company's growth and industry position[89]. - The company has a strong management team with extensive experience in the technology sector[154]. - The company is led by a diverse management team, including several vice presidents and a secretary, with varying years of experience[150]. - The company has a well-structured training program to enhance employee skills and support talent development[176]. Future Outlook - The company provided a future outlook, projecting a revenue growth of 10% for the next quarter, aiming for 1.32 billion RMB[151]. - The company plans to enhance its product structure and increase R&D investment, targeting new applications such as electric vehicles and 5G technology[136]. - The company aims to establish a full-process turnkey service by 2025, covering bumping, wafer testing, flip chip packaging, and finished chip testing[136]. - The company has set ambitious performance guidance for the upcoming fiscal year, aiming for a revenue growth of over 20%[154].

| | | 占总股 | 增减情 | | --- | --- | --- | --- | | 名称 | 持有数量(万股) | 本比例 | 况(万 | | | | (%) | 股) | | CTC Investment Company Limited | 3439.79 | 9.56 | -0.02 | | 南京盈志创业投资合伙企业(有限合伙) | 1862.80 | 5.18 | -895.77 | | 张鸿飞 | 1103.70 | 3.07 | 11.00 | | 中信证券股份有限公司-嘉实上证科创板芯片交易型开放式指数证 券投资基金 | 1024.40 | 2.85 | 新进 | | 国华人寿保险股份有限公司-自有四号 | 826.45 | 2.30 | 不变 | | 陈永正 | 744.00 | 2.07 | 不变 | | 国寿安保基金-中国人寿（601628）保险股份有限公司-分红险-国 寿安保基金国寿股份均衡股票型组合单一资产管理计划(可供出售) | 637.21 | 1.77 | 新进 | | 宁波梅山保税港区鑫芯私募基金管理合伙企业(有限合伙)-中青芯 鑫鼎橡(上海)企业管理合伙企业(有限合伙) ...

Investment Rating - The report maintains a "Buy" rating for Qizhong Technology (688352) [6][7]. Core Views - The company is expected to achieve revenue of 1.96 billion yuan in 2024, representing a year-on-year growth of 20.29%, while the net profit attributable to shareholders is projected to decline by 15.71% to 313 million yuan [2][5]. - Demand for non-display chips, including driver chips and power management chips, is recovering, leading to an expansion in packaging and testing capacity, which supports revenue growth [3][4]. - The company is focusing on non-display packaging and testing as a key area for future growth, leveraging advancements in technology to enhance its product offerings and market position [4]. Summary by Sections Financial Performance - In 2024, the company expects to generate revenue of 1.96 billion yuan, with a growth rate of 20.29% compared to the previous year [9]. - The projected net profit for 2024 is 313 million yuan, reflecting a decrease of 15.71% year-on-year [2][9]. - The company’s EBITDA is forecasted to be 810.14 million yuan in 2024, with a growth rate of 15.32% in subsequent years [9]. Business Strategy - The company is actively expanding its packaging and testing capabilities for non-display chips, which is seen as a critical growth area [3][4]. - It aims to enhance its technology and product lines in response to the growing demands of sectors such as big data, IoT, cloud computing, and AI [4]. - The company plans to deepen collaborations with clients in high-performance computing and data centers, aiming to capture a favorable position in international markets [4]. Valuation Metrics - The current stock price corresponds to a PE ratio of 49 times for 2024, 38 times for 2025, and 29 times for 2026 [7][9]. - The company’s market capitalization is approximately 15.3 billion yuan, with a total share capital of 1.189 billion shares [5].

证券研究报告：电子 | 公司点评报告 股票投资评级 颀中科技(688352) 需求回暖 l 事件 2 月 26 日，公司披露 2024 年度业绩快报公告，2024 年度， 公司预计实现营收 19.60 亿元，同比+20.29%；实现归母净利润 3.13 亿元，同比-15.71%；实现扣非归母净利润 2.77 亿元，同比- 18.55%。 l 投资要点 需求回暖，营收增长。2024 年度显示驱动芯片及电源管理芯 片、射频前端芯片等非显示类芯片封装测试需求回暖，公司持续扩 大封装与测试产能，不断提升产品品质及服务质量，加大对新客户 开发的同时，持续增加新产品的开发力度，使得公司封装与测试收 入保持较快增长。2024 年度，公司扣非前后归母净利润较上年度 有所下降，主要是由于：（1）为了吸引和留住优秀人才及核心骨 干，公司实施限制性股票激励计划，当期相应摊销的股份支付费用 较上年同期有所增长；（2）合肥生产基地项目投产，当期相应的折 旧及人工费用等固定成本及费用较上年同期有所增长；（3）在高效 散热、高结合力等高性能芯片、车规及高可靠性消费规芯片等先进 集成电路封测领域，公司在继续扩充产能的同时持续加大研发投 入， ...

颀中科技(688352) 需求回暖 l 事件 2 月 26 日，公司披露 2024 年度业绩快报公告，2024 年度， 公司预计实现营收 19.60 亿元，同比+20.29%；实现归母净利润 3.13 亿元，同比-15.71%；实现扣非归母净利润 2.77 亿元，同比- 18.55%。 l 投资要点 需求回暖，营收增长。2024 年度显示驱动芯片及电源管理芯 片、射频前端芯片等非显示类芯片封装测试需求回暖，公司持续扩 大封装与测试产能，不断提升产品品质及服务质量，加大对新客户 开发的同时，持续增加新产品的开发力度，使得公司封装与测试收 入保持较快增长。2024 年度，公司扣非前后归母净利润较上年度 有所下降，主要是由于：（1）为了吸引和留住优秀人才及核心骨 干，公司实施限制性股票激励计划，当期相应摊销的股份支付费用 较上年同期有所增长；（2）合肥生产基地项目投产，当期相应的折 旧及人工费用等固定成本及费用较上年同期有所增长；（3）在高效 散热、高结合力等高性能芯片、车规及高可靠性消费规芯片等先进 集成电路封测领域，公司在继续扩充产能的同时持续加大研发投 入，当期研发费用较上年同期有所增长。 证券研究报告：电子 ...

Financial Performance - The company achieved total operating revenue of RMB 195,990.13 million, an increase of 20.29% compared to the previous year[6] - The net profit attributable to the parent company was RMB 31,327.70 million, a decrease of 15.71% year-on-year[6] - The net profit attributable to the parent company after deducting non-recurring gains and losses was RMB 27,667.68 million, down 18.55% from the previous year[6] - The basic earnings per share decreased by 21.21% to RMB 0.26[4] Assets and Equity - Total assets at the end of 2024 were RMB 698,925.12 million, a decrease of 2.29% from the beginning of the year[7] - The equity attributable to the parent company increased by 2.97% to RMB 600,329.20 million compared to the beginning of the year[7] Operational Developments - The company expanded its packaging and testing capacity, leading to a steady growth in revenue from these services[8] - Increased costs due to the implementation of a restricted stock incentive plan and the launch of the Hefei production base impacted net profit[8] - R&D expenses increased as the company continued to invest in advanced integrated circuit packaging and testing[9] Talent Management - The company emphasizes the importance of attracting and retaining talent through incentive plans[8]

证券代码：688352 证券简称：颀中科技 公告编号：2025-001 合肥颀中科技股份有限公司 关于变更签字注册会计师暨项目质量控制复核人的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 合肥颀中科技股份有限公司（以下简称"公司"）于2024年4月18日召开第一 届董事会第十六次会议、第一届监事会第十五次会议，于2024年5月23日召开2023 年年度股东大会审议并通过了《关于续聘公司2024年度会计师事务所的议案》，同 意续聘天职国际会计师事务所（特殊普通合伙）（以下简称"天职国际"）为公司 2024年度财务审计机构，具体内容详见公司于2024年4月19日在上海证券交易所网 站（www.sse.com.cn）披露的《合肥颀中科技股份有限公司关于续聘公司2024年 度会计师事务所的公告》（公告编号：2024-022）。 近日，公司收到天职国际出具的《关于变更项目合伙人、签字注册会计师及 项目质量控制复核人的函》，现将有关情况公告如下： 一、 本次变更签字注册会计师和质量控制复核人的基本情况 天职国际作为公司2024 ...

主力资金 超级复盘、主力资金 大宗交易、大宗成交、折溢价、折价、溢价 注：本文系新闻报道，不构成投资建议，股市有风险，投资需谨慎。 颀中科技2月17日大宗交易平台出现一笔成交，成交量32.00万股，成交金额298.88万元，大宗交易成交 价为9.34元，相对当日收盘价折价20.58%。该笔交易的买方营业部为华泰证券股份有限公司苏州人民路 证券营业部，卖方营业部为中信建投证券股份有限公司淮南朝阳西路证券营业部。（数据宝） 2月17日颀中科技大宗交易一览 ...

证券代码：688352 证券简称：颀中科技 公告编号：2024-066 二、董事会会议审议情况 合肥颀中科技股份有限公司 本次会议审议表决，通过了相关议案，形成决议如下： 第二届董事会第二次会议决议公告 （一）会议审议通过了《关于制定<合肥颀中科技股份有限公司市值管理制 度>的议案》 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 表决结果：同意 9 票，反对 0 票，弃权 0 票。 一、董事会会议召开情况 合肥颀中科技股份有限公司（以下简称"公司"）第二届董事会第二次会议 通知于 2024 年 12 月 20 日以通讯和邮件方式发出，于 2024 年 12 月 26 日以现场 及通讯相结合的方式召开。会议由董事长陈小蓓女士主持，本次会议应出席董事 9 人，实际出席董事 9 人。本次会议的召集、召开方式符合《中华人民共和国公 司法》《合肥颀中科技股份有限公司章程》及《合肥颀中科技股份有限公司董事 会议事规则》的相关规定，会议决议合法有效。 表决结果：同意 9 票，反对 0 票，弃权 0 票。 （二）会议审议通过了《关于向银 ...