| 车或者抖音手机业务开展合作。 | | --- | | 答：公司车规级功率器件、传感器等产品广泛应用于电动车 | | 窗、汽车照明、车载智能终端等场景。非常感谢您的建议，谢谢 | | 关注。 | | 四、定增啥情况了？ | | 答：截止目前尚在交易所审核阶段。公司、中介、监管各方 | | 持续推进项目进展，您可持续关注我司相关进展公告，谢谢。 | | 五、根据公司公告，2024 年度的定增方案决议有效期及相关 | | 授权已获延长，近期也已更新并提交了审核问询函的回复。请问 | | 管理层，目前该定增事项在深交所的审核阶段具体进展如何？ | | 答：截止目前尚在交易所审核阶段。公司、中介、监管各方 | | 持续推进项目进展，目前无法明确预估时间表，一旦有进展我们 | | 会根据要求及时披露，期待您的持续关注。 | | 六、未来能否考虑将机器人（尤其是人形机器人）作为明确 | | 的战略拓展方向之一？利用自身在 MEMS 传感器、半导体功率器 | | 件（如用于关节驱动的 MOSFET、IGBT）等方面的既有优势，进 | | 行针对性研发和资源整合，从而打造公司继半导体、光伏材料之 | | 后的"第三增长曲线 ...

Group 1 - The Dutch government has taken control of Nexperia, a subsidiary of China's Wingtech Technology, citing "national security" concerns, freezing assets worth up to 14.7 billion yuan [1] - This action has sparked discussions about "cross-border industrial plunder," indicating a shift in global tech competition from isolation to alliance-based containment against China [2][4] - Nexperia, a leading player in the automotive power device sector, has a complete vertical integration in chip design, manufacturing, and testing, serving major clients like Samsung, Apple, and Tesla [3] Group 2 - The U.S. has been identified as the driving force behind this multinational crackdown, viewing Wingtech Technology as a strategic threat since its acquisition of Nexperia in 2019 [4] - The U.S. government has previously placed Wingtech Technology on an "entity list," restricting its access to U.S. technology and equipment, which facilitated the Dutch government's subsequent actions [4][6] - The Dutch government acted swiftly, issuing a global ban and freezing Nexperia's operational autonomy, leading to a court ruling that stripped the Chinese management of their control [6][7] Group 3 - In response to the Dutch government's actions, Wingtech Technology announced plans to seek legal remedies and engage with Chinese government departments for support [8][11] - The broader context involves the U.S. systematically blocking and suppressing Chinese semiconductor companies to maintain its technological dominance, aiming to achieve a strategy of "chip containment" against China [12][14] - The U.S. has expanded its restrictions from advanced chips to a wider range of semiconductor products and manufacturing equipment, indicating a comprehensive approach to limiting China's semiconductor capabilities [15][17]

Core Viewpoint - The Chinese semiconductor industry has faced significant adjustments since 2025, with many companies nearing bankruptcy or restructuring due to multiple pressures, including market saturation, technological shortcomings, and financial vulnerabilities [2][29]. Company Summaries 1. LiKeXin Semiconductor - Background: Former subsidiary of Datang Telecom, focused on smart IoT and smartphone SoC chip development - Dilemma: Filed for bankruptcy in July 2025 with debts exceeding 100 million yuan, unable to secure large-scale orders, and faced severe inventory backlog due to market saturation [2]. 2. Jianwenlu (Zhejiang) Semiconductor - Background: IDM model RF chip company targeting the 5G filter market - Dilemma: Entered bankruptcy review in July 2025 due to a 30% drop in production line utilization caused by declining global smartphone shipments and high operational costs [3]. 3. Times Chip Storage Semiconductor - Background: Planned to invest 13 billion yuan in a 12-inch storage chip wafer factory - Dilemma: Failed restructuring in June 2025 due to equipment payment defaults and plummeting storage chip prices [5]. 4. Sichuan Shangda Electronics - Background: FPC supplier with a 35% order growth in 2024 - Dilemma: Filed for bankruptcy in June 2025 due to delayed customer payments and external financing interruptions [8]. 5. Jiangxi Chuangcheng Microelectronics - Background: DSP chip design company supported by local government - Dilemma: Entered bankruptcy in April 2025 due to technological lag and fierce market competition [11]. 6. Xiangxin Integrated Circuit - Background: Leading power management chip packaging company in East China - Dilemma: Filed for bankruptcy in August 2025 due to a 40% revenue decline from customer concentration and order fluctuations [14]. 7. Paixin Semiconductor - Background: Focused on automotive-grade power device packaging - Dilemma: Filed for bankruptcy in June 2025 due to delayed technology implementation and cash flow issues [15]. 8. Juleicheng Semiconductor - Background: GaN epitaxial wafer and chip manufacturer - Dilemma: Filed for bankruptcy in May 2025 due to poor technology choices and equipment payment defaults [16]. 9. Lixin Chuangyuan Semiconductor - Background: Packaging company focusing on power management and MCU chips - Dilemma: Filed for bankruptcy in July 2025 due to delayed customer payments and external financing interruptions [17]. 10. Zhenjiang New District Zhenxin Semiconductor - Background: Chip testing company established in 2018 - Dilemma: Filed for bankruptcy in April 2025 due to equipment payment defaults and declining customer demand [19]. Industry Lessons 1. Technical Research Shortcomings - 80% of companies have R&D investment below 15%, significantly lower than international giants like TSMC [29]. 2. Financial Vulnerability - 90% of companies rely on external financing, with industry financing down 40% in 2025 [30]. 3. Market Demand Fluctuations - Continuous decline in smartphone shipments and high certification barriers in automotive electronics have pressured many companies [31]. 4. Supply Chain Constraints - Heavy reliance on imported equipment and materials poses significant risks, with less than 20% domestic production for equipment below 28nm [32]. 5. Strategic Management Errors - Companies often pursue blind expansion and have a concentrated customer base, leading to vulnerabilities [33]. Future Outlook - By the end of 2024, it is expected that 90% of chip companies will face bankruptcy or restructuring, with a significant concentration of market share among leading firms [35].

Group 1: Business Performance - In 2024, the revenue from self-owned brands was CNY 348.40 million, a decrease of 20.06% year-on-year, while the revenue from testing services was CNY 353.02 million, an increase of 21.13% year-on-year [2] - The company’s annual production capacity exceeds 15 billion semiconductor units, with a stable capacity utilization rate compared to the previous year [3] - The company experienced a decline in both revenue and net profit in 2024 due to factors such as the global semiconductor market cycle, weak consumer electronics demand, and rising raw material and labor costs [6] Group 2: Strategic Focus and Future Plans - The company plans to deepen its core business and enhance IC product process R&D capabilities, actively expanding its customer base in industrial, automotive, and new energy markets [2] - Future capacity expansion will be based on market demand recovery and completed fundraising projects [3] - The company aims to enhance its competitiveness by increasing R&D investment in automotive-grade products and expanding its market share in the automotive electronics sector [4] Group 3: Technology and Innovation - The company has implemented smart manufacturing systems (MES, ERP, APS) to improve production efficiency and product quality [3] - Advanced packaging technologies such as ultra-thin chip packaging and system-in-package (SiP) are being developed, although their current application ratio is low [5] - The company is focusing on R&D in emerging fields such as wide-bandgap power semiconductor devices and plans to launch competitive new products [5] Group 4: Investor Relations and Market Confidence - The management emphasizes the importance of maintaining investor confidence through proactive communication and engagement strategies [3] - The company is committed to optimizing its capital structure and financing plans to maximize shareholder value [5] - The company recognizes the need to continuously improve product structure and operational efficiency to address competitive pressures [6]