芯联集成电路制造股份有限公司 关于为控股子公司申请贷款提供担保的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示: 一、担保情况概述 证券代码：688469 证券简称：芯联集成 公告编号：2025- 039 （一）基本情况 现芯联先锋为保证日常经营所需，计划向国家开发银行浙江省分行申 请人民币 4 亿元一年期流动资金贷款。根据国家开发银行浙江省分行审批 要求，公司拟为芯联先锋本次贷款提供不超过人民币 4 亿元担保额度，本 次担保期限匹配贷款期限，贷款结清之日起担保履行完毕。上述担保方式 为第三方全额全程连带责任保证担保，担保范围包括主合同项下债务人应 承担的全部债务本金、利息、违约金、赔偿金和为实现债权而发生的所有 合理费用等，具体担保金额、期限、方式、范围根据届时签订的担保合同 为准。 （二）内部决策程序 被担保人名称：芯联先锋集成电路制造（绍兴）有限公司（以下简称 "芯联先锋"），为芯联集成电路制造股份有限公司（以下简称"公 司"）的控股子公司。 本次担保金额及已实际为其提供的担保余额： 公司拟为控股 ...

芯联集成电路制造股份有限公司 2025 年第一次临时股东大会会议资料 证券代码：688469 证券简称：芯联集成 芯联集成电路制造股份有限公司 2025 年第一次临时股东大会 会议资料 2025 年 7 月 芯联集成电路制造股份有限公司 2025 年第一次临时股东大会会议资料 | | | | 2025 | 年第一次临时股东大会会议须知 | 1 | | --- | --- | --- | | 2025 | 年第一次临时股东大会会议议程 | 3 | | 2025 | 年第一次临时股东大会会议议案 | 5 | | | 议案一：关于申请注册发行银行间债券市场非金融企业债务 | | | | 融资工具的议案 | 5 | 芯联集成电路制造股份有限公司 2025 年第一次临时股东大会会议资料 芯联集成电路制造股份有限公司 2025 年第一次临时股东大会会议须知 为维护广大投资者的合法权益，保障股东在本次股东大会期间依法行使权利， 根据《公司法》、中国证监会《上市公司股东大会规则》和公司《股东大会议事 规则》等有关规定，特制定本会议须知： 一、公司负责本次股东大会的议程安排和会务工作,为确认出席大会的股东 或其代理人或其他出席 ...

证券代码：688469 证券简称：芯联集成 公告编号：2025-038 芯联集成电路制造股份有限公司 关于召开2025年第一次临时股东大会的通知 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 一、 召开会议的基本情况 （一） 股东大会类型和届次 2025年第一次临时股东大会 （二） 股东大会召集人：董事会 （三） 投票方式：本次股东大会所采用的表决方式是现场投票和网络投票相结 合的方式 （四） 现场会议召开的日期、时间和地点 召开日期时间：2025 年 7 月 18 日 14 点 00 分 召开地点：浙江省绍兴市越城区皋埠街道临江路 518 号芯联集成电路制造 股份有限公司会议室 （五） 网络投票的系统、起止日期和投票时间。 至2025 年 7 月 18 日 股东大会召开日期：2025年7月18日 本次股东大会采用的网络投票系统：上海证券交易所股东大会网络投票 系统 采用上海证券交易所网络投票系统，通过交易系统投票平台的投票时间为股 东大会召开当日的交易时间段，即 9:15-9:25,9:30-11:30， ...

证券代码：688469 证券简称：芯联集成 公告编号：2025-037 芯联集成电路制造股份有限公司 第二届监事会第六次会议决议公告 本公司监事会及全体监事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、 监事会会议召开情况 芯联集成电路制造股份有限公司第二届监事会第六次会议于 2025 年 7 月 1 日以现场结合通讯的方式召开。会议通知于 2025 年 6 月 26 日向全体监事发出。 会议应出席监事 5 人，实际出席监事 5 人，会议由监事会主席王永先生主持。会 议的召集和召开符合《中华人民共和国公司法》等法律法规和《公司章程》的有 关规定。 二、监事会会议审议情况 1、审议通过《关于申请注册发行银行间债券市场非金融企业债务融资工具 的议案》 监事会认为：公司本次拟向中国银行间市场交易商协会注册申请在全国银行 间债券市场发行非金融企业债务融资工具符合公司经营发展的实际需要，有利于 优化公司融资结构，提高资金运用的灵活性，不存在损害公司及股东利益的情况。 综上，监事会一致同意本议案。 表决结果：5 票赞成，0 票反对，0 票弃权。 具体 ...

Group 1 - The company plans to issue corporate debt financing tools not exceeding 4 billion yuan to meet operational funding needs and optimize debt structure [1] - The issuance will include medium-term notes up to 2.5 billion yuan and ultra-short-term financing bonds up to 1.5 billion yuan [1]

Core Viewpoint - The announcement details the completion of the first vesting period for the 2024 restricted stock incentive plan of ChipLink Integrated Circuit Manufacturing Co., Ltd, involving the transfer of 34.293961 million shares to 731 incentive recipients [2][5][9]. Group 1: Stock Grant Details - The number of shares granted in this vesting period is 34.293961 million shares [2]. - The shares were sourced from the company's repurchase of its A-share common stock in the secondary market [5][9]. - The decision-making process for the incentive plan was approved by the board on April 13, 2024, and subsequently by the supervisory board [3][4]. Group 2: Vesting Process - The incentive plan's recipient list was publicly disclosed internally from April 15 to April 24, 2024, with no objections raised [3]. - The annual shareholders' meeting on April 29, 2024, approved the incentive plan and its management measures [4]. - The supervisory board verified the recipient list and provided opinions on the vesting conditions [5]. Group 3: Stock Transfer and Restrictions - There are no lock-up periods for the vested shares, but there are transfer restrictions for directors and senior management [6]. - Directors and senior management can only transfer up to 25% of their total shares held annually during their tenure, and cannot transfer shares within six months after leaving the company [6][7]. - The company's total share capital remains unchanged as the shares were repurchased from the market [7][9]. Group 4: Financial Verification - Tianzhi International Accounting Firm issued a verification report confirming that the total cash contributions from the incentive recipients amounted to RMB 87,792,540.16 as of June 17, 2025 [9]. - The transfer of shares was completed on June 30, 2025, with the registration confirmation issued by the China Securities Depository and Clearing Corporation [9].

Investment Rating - The report maintains a "Buy" rating for the company, indicating a strong expectation of performance relative to the market [6]. Core Views - The company achieved a significant milestone with its 1500V SiC MOS module series, winning the "2025 Innovative Technology" award at the 17th International Automotive Power System Technology Conference. This product line is expected to provide high-performance solutions across various power segments [6]. - The company reported a revenue of 1.016 billion yuan from its silicon carbide (SiC) business in 2024, marking a year-on-year growth of over 100%. The production capacity for SiC has reached 8,000 wafers per month, with full utilization [6]. - The company has a comprehensive platform for MEMS, power chips (IGBT, MOSFET, SiC), and high-power BCD, enabling it to offer one-stop system foundry solutions. Revenue from wafer foundry services increased by 25.11% year-on-year, while module packaging revenue grew by 54.54% [6]. - The company ranks third in the domestic new energy passenger vehicle terminal sales rankings, with a significant increase in revenue from automotive power modules, which grew by 106% year-on-year [6]. - The report projects an increase in revenue forecasts for 2025 and 2026, with expected revenues of 8.24 billion yuan and 10.84 billion yuan, respectively. The net profit forecast for 2025 is adjusted to -483 million yuan, with a positive net profit of 24 million yuan expected in 2026 [6]. Financial Summary - The total revenue for 2024 is projected at 6.509 billion yuan, with a year-on-year growth rate of 22.3%. The company is expected to achieve a gross margin of 1.0% in 2024, improving to 8.8% in 2025 [2][8]. - The company’s net profit attributable to shareholders is forecasted to improve from -962 million yuan in 2024 to a positive 205 million yuan by 2027, reflecting a significant turnaround [2][8]. - The report indicates a stable growth in R&D expenses, with rates projected at 24%, 20%, and 18% for 2025, 2026, and 2027, respectively [6].

证券代码：688469 证券简称：芯联集成 公告编号：2025-035 芯联集成电路制造股份有限公司 关于 2024 年限制性股票激励计划 首次授予部分第一个归属期（第一批次）归属结果公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次归属股票数量：3,429.3961 万股 （一）2024 年 4 月 13 日，公司召开第一届董事会第二十一次会议，会议审议通 过了《关于公司<2024 年限制性股票激励计划（草案）>及其摘要的议案》《关于公 司<2024 年限制性股票激励计划实施考核管理办法>的议案》以及《关于提请公司股 东大会授权董事会办理 2024 年限制性股票激励计划相关事宜的议案》等议案。 同日，公司召开第一届监事会第十三次会议，审议通过了《关于公司<2024 年限 制性股票激励计划（草案）>及其摘要的议案》等议案，公司监事会对本激励计划的 相关事项进行核实并出具了相关核查意见。 （二）2024 年 4 月 15 日至 2024 年 4 月 24 日，公司对本激励计划拟授予激励对 象名单在公司 ...

Core Viewpoint - The MOSFET industry in China is experiencing significant growth driven by the demand from sectors such as consumer electronics, communication, industrial control, and automotive electronics, with a projected market size of 42.944 billion yuan in 2024, reflecting a year-on-year growth of 7.67% [1][11]. Industry Overview - MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) is a semiconductor device that controls current using electric fields, consisting of a metal gate, an insulating oxide layer, and a semiconductor substrate [2]. - The industry has evolved through four main stages, from initial development before 2010 to the current phase of domestic substitution, where local manufacturers are increasingly producing high-end products [4][5]. Industry Development History - The industry has transitioned from a pioneering phase before 2010 to a period of local alliances from 2011 to 2013, followed by structural reforms from 2014 to 2016, and now to a phase of domestic substitution since 2017 [4][5]. Industry Supply Chain - The upstream of the MOSFET industry includes raw materials and production equipment, while the midstream focuses on manufacturing, and the downstream applications span automotive electronics, consumer electronics, industrial control, and communication devices [7]. Market Size - The demand for MOSFETs is rising due to the proliferation of 5G technology, the boom in the electric vehicle market, and increasing industrial automation [11]. - The performance of silicon-based MOSFETs is improving, and third-generation semiconductor devices like SiC MOSFETs are being commercialized, enhancing charging efficiency and range for electric vehicles [11]. Key Companies' Performance - The competitive landscape of the MOSFET industry is characterized by dominance from overseas giants like Infineon and ON Semiconductor, while domestic firms such as Huazhu Microelectronics, Silan Microelectronics, and New Clean Energy are emerging as leaders [13]. - Huazhu Microelectronics reported a revenue of 2.355 billion yuan in Q1 2025, a year-on-year increase of 11.29%, with a net profit of 83 million yuan, up 150.68% [14]. - Silan Microelectronics achieved a revenue of 11.221 billion yuan in 2024, reflecting a growth of 20.14%, with R&D investment reaching 1.084 billion yuan, up 22.93% [16]. Industry Development Trends - The market size of the MOSFET industry is expected to continue expanding, particularly in the electric vehicle sector, where demand for high-performance MOSFETs is increasing [18]. - Technological innovation is accelerating, with third-generation semiconductor materials like SiC and GaN gaining traction, promising higher efficiency and performance [19][20]. - The trend of domestic substitution is strengthening, with local companies improving their competitiveness and reducing reliance on foreign products, while also integrating the supply chain [21].

Group 1 - The company plans to issue shares and pay cash to acquire a 72.33% stake in ChipLink Integrated Circuit Manufacturing (Shaoxing) Co., Ltd. from 15 transaction parties, including Shaoxing Binhai New Area ChipXing Equity Investment Fund Partnership and Shenzhen Yuan Zhi No.1 Private Equity Investment Fund Partnership [1][2] - The Shanghai Stock Exchange's M&A Review Committee approved the transaction on June 23, 2025, confirming that it meets restructuring conditions and information disclosure requirements [1][2] - The company has revised the restructuring report to reflect updates on decision-making processes and approval status, as well as to address risks related to high customer concentration and the feasibility of performance forecasts for the target company [2] Group 2 - The revised restructuring report includes updates on the decision-making process and approval status of the transaction, as well as supplementary financial information and operational status following the audit cutoff date [2] - The company conducted a thorough review and self-check of the draft report, making minor adjustments to expressions without affecting the restructuring plan [2]