Core Viewpoint - The company has established a deep collaborative relationship with Google, expanding from a single remote control chip supplier to multiple fields including audio, smart home, and edge AI [1] Group 1: Partnership Development - The collaboration with Google now encompasses various projects in smart home and audio sectors [1] - The company has transitioned from supplying only remote control chips to a broader partnership involving advanced technologies [1] Group 2: Product Innovation - The company launched the TL-EdgeAI platform based on the TL721X series chips, which supports Google's LiteRT and TVM open-source models [1] - The TL-EdgeAI platform is noted as the world's lowest power consumption smart IoT connection protocol platform [1] Group 3: Market Application - The company's chips have been integrated into Google's Pixel Bud Pro2 smart earphone solution [1] - The company aims to further deepen its collaboration with Google in the future [1]

Core Insights - Matter has rapidly gained traction, with its version evolving to 1.5, receiving strong support from major terminal manufacturers like Amazon, Samsung, and Apple [1][6] - Despite the fragmented ecosystem in China, Matter remains a crucial standard for many overseas manufacturers [1] - The technology aims to eliminate fragmentation in the IoT space, enhancing interoperability among various smart devices [1][4] Development of Matter - Matter was initially proposed in December 2019 as CHIP and officially introduced as a new connectivity standard in May 2021 [6] - The first official version, Matter 1.0, was released in October 2022, followed by updates to versions 1.1 and 1.2 in May and October 2023, respectively [6] - The latest version, Matter 1.5, released in November 2023, includes native support for smart cameras and enhanced energy management capabilities [6][10] Features of Matter - Matter offers seamless interoperability, ease of use, strong security, and high acceptance within the ecosystem [7] - It effectively addresses the challenges of multi-protocol compatibility, allowing users to integrate new and existing devices without replacement [7] - The built-in security mechanisms of Matter reduce the burden on application layer security design, enabling developers to focus on user experience [7] Chip Technology and Manufacturers - Chip technology is crucial for the development of Matter, with two main configurations: System on Chip (SoC) and Co-processor [9] - STMicroelectronics launched the ST25DA-C, the first NFC chip compatible with Matter 1.5, allowing for easier device configuration [10][11] - Qorvo's multi-connection technology facilitates backward and forward compatibility for Matter, integrating various wireless standards [23][24] Product Offerings - Qorvo's QPG6200 series chips support multiple protocols with low power consumption, suitable for battery-operated applications [25][26] - Texas Instruments (TI) has been involved in Matter's development for over a decade, offering various compatible products [27][28][29] - NXP focuses on secure wireless connections and innovative solutions based on Matter, enhancing smart home and building automation applications [30][36][39] Industry Trends - Silicon Labs is among the first companies to support Matter compatibility certification, emphasizing the importance of flexible chip technology [40][41] - Nordic Semiconductor has expanded its product line to include high-memory wireless SoCs designed for low-power Bluetooth and Matter applications [44] - With increasing investments from chip manufacturers, the long-standing fragmentation issue in IoT is being addressed, making Matter a significant focus for companies looking to enter overseas markets [46]

Group 1 - The company announced that on November 28, 2025, it received a written resignation letter from director MINGJIANZHENG [2] - On the same day, the company held a staff representative meeting and made a resolution to elect MINGJIANZHENG as a representative director of the second board of directors [2]

本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 泰凌微电子(上海)股份有限公司（以下简称"公司"）于 2025 年 11 月 28 日召开了 2025 年第一次临时股东会，审议通过了《关于取消监事会、变更注册 资本并修订<公司章程>的议案》。根据修订后的《公司章程》，公司董事会由 9 名董事组成，其中设职工代表董事 1 名。因此，公司对董事会成员结构进行调整。 公司于 2025 年 11 月 28 日收到董事 MINGJIAN ZHENG 先生提交的书面辞职报 告。同日，公司召开职工代表大会并作出决议，选举 MINGJIAN ZHENG 先生 为公司第二届董事会职工代表董事。现将相关情况公告如下： 证券代码：688591 证券简称：泰凌微 公告编号：2025-055 泰凌微电子(上海)股份有限公司 关于董事辞职暨选举职工代表董事的公告 公司于 2025 年 11 月 28 日召开了 2025 年第一次临时股东会，审议通过了《关 于取消监事会、变更注册资本并修订<公司章程>的议案》。根据修订后的《公司 章程》，公 ...

北京市中伦（上海）律师事务所 关于泰凌微电子（上海）股份有限公司 2025 年第一次临时股东会的 法律意见书 二〇二五年十一月 法律意见书 北京市中伦（上海）律师事务所 关于泰凌微电子（上海）股份有限公司 2025 年第一次临时股东会的 法律意见书 致：泰凌微电子（上海）股份有限公司（以下简称"公司"） 北京市中伦（上海）律师事务所（以下简称"本所"）接受公司的委托，指 派律师出席并见证公司2025年第一次临时股东会（以下简称"本次会议"）。 本所律师根据《中华人民共和国公司法》（以下简称"《公司法》"）、《中 华人民共和国证券法》（以下简称"《证券法》"）、《上市公司股东会规则》 （以下简称"《股东会规则》"）、《律师事务所从事证券法律业务管理办法》 （以下简称"《证券法律业务管理办法》"）、《律师事务所证券法律业务执业 规则（试行）》（以下简称"《证券法律业务执业规则》"）等相关法律、行政 法规、规章、规范性文件及《泰凌微电子（上海）股份有限公司章程》（以下简 称"《公司章程》"）的规定，就本次会议的召集与召开程序、召集人资格、出 席会议人员资格、会议表决程序及表决结果等事宜，出具本法律意见书。 对本法律 ...

证券代码：688591 证券简称：泰凌微 公告编号：2025-056 泰凌微电子（上海）股份有限公司 2025年第一次临时股东会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次会议是否有被否决议案：无 一、 会议召开和出席情况 （一） 股东会召开的时间：2025 年 11 月 28 日 （二） 股东会召开的地点：中国（上海）自由贸易试验区盛夏路 61 弄 1 号 11 层 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 174 | | --- | --- | | 普通股股东人数 | 174 | | 2、出席会议的股东所持有的表决权数量 | 69,050,380 | | 普通股股东所持有表决权数量 | 69,050,380 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比 | 29.1967 | | 例（%） | | | 普通股股东所持有表决权数量占公司表决权数量的比例（%） | 29.1967 ...

Core Points - The company announced that non-independent director Zheng Mingjian submitted a written resignation due to adjustments in the corporate governance structure [1] - Zheng Mingjian will continue to serve as the Vice General Manager and Chief Technology Officer (CTO) after his resignation [1] - As of the announcement date, Zheng Mingjian directly holds 4,740,820 shares of the company and will continue to adhere to the commitments made during the initial public offering and stock incentive plans [1]

Core Viewpoint - TaiLing Microelectronics (688591.SH) has launched the TC321X series of wireless SoCs aimed at entry-level IoT terminals, balancing computing power, power consumption, and cost to lower the development threshold for various wireless connection products [1][4]. Product Features - The TC321X series integrates a 32-bit MCU, 64KB SRAM, and up to 1MB Flash, enabling protocol stack, application, and multiple peripheral coordination on a single chip [3]. - The chip supports full-stack Bluetooth Low Energy (BLE) functionality, including LE 2M PHY, -97 dBm receiving sensitivity, and up to 10 dBm transmitting power, with a one-click switch between BLE and 2.4GHz private protocols [3]. - It is optimized for battery-powered devices, compatible with small power sources like button batteries, aiming to extend terminal battery life [3]. Development Support - To reduce development complexity, the company has introduced a one-stop SDK and evaluation board support, with the SDK containing various example projects for quick customization and performance validation [3]. - The TC321X EVK board supports Type-C power supply, RF conduction testing, audio loop, and external Flash, with reserved programming and debugging interfaces [3]. Market Positioning - The TC321X series offers differentiated packaging options such as QFN and TSSOP, along with 512KB and 1MB Flash configurations to meet varying cost and functionality needs [4]. - Industry experts believe that as the application of Bluetooth and 2.4GHz private protocols expands in smart homes, consumer electronics, asset tracking, and wearable devices, competition in low power and cost control for wireless SoCs will intensify [4].

Core Insights - 泰凌微's stock increased by 1.63% on November 26, with a trading volume of 351 million yuan [1] - The company reported a financing buy-in of 38.64 million yuan and a net financing outflow of 13.09 million yuan on the same day [1] - As of November 26, the total financing and securities lending balance for 泰凌微 was 504 million yuan, representing 6.87% of its market capitalization [1] Financing and Securities Lending - On November 26, 泰凌微's financing buy-in was 38.64 million yuan, while the financing balance stood at 504 million yuan, exceeding the 70th percentile of the past year [1] - There were no securities lent or sold on that day, with a securities lending balance of 0 yuan, indicating a high level of inactivity in this area [1] Company Overview - 泰凌微电子 (Shanghai) Co., Ltd. was established on June 30, 2010, and went public on August 25, 2023 [1] - The company specializes in the research, design, and sales of wireless IoT system-level chips, with 87.62% of its revenue coming from IoT products [1] Financial Performance - For the period from January to September 2025, 泰凌微 achieved a revenue of 766 million yuan, marking a year-on-year growth of 30.49% [2] - The net profit attributable to shareholders for the same period was 140 million yuan, reflecting a significant year-on-year increase of 117.35% [2] Shareholder Information - As of September 30, 2025, 泰凌微 had 21,600 shareholders, an increase of 19.07% from the previous period [2] - The average number of circulating shares per shareholder decreased by 14.80% to 7,815 shares [2] - The company has distributed a total of 65.87 million yuan in dividends since its A-share listing [3]

Core Viewpoint - The company is progressing with its listing on the Hong Kong Stock Exchange and is actively developing edge AI chips that enhance local computing and self-learning capabilities, aiming to integrate AI from cloud to edge devices [1][4]. Group 1: Company Developments - The company confirmed that its listing on the Hong Kong Stock Exchange is still in progress and will provide updates as required by regulatory standards [1][4]. - The edge AI chips developed by the company enable low-power wireless IoT chips to perform local computations and self-learning, moving beyond traditional transmission roles [3]. Group 2: Technology and Applications - The edge AI chips can interface with cloud-based large models and execute inference tasks locally, transforming communication chips into intelligent nodes [3]. - The company has established partnerships with leading domestic and international clients and is integrating its chips with major AI model platforms, facilitating easier deployment in smart homes, wearables, and industrial IoT applications [3]. Group 3: Strategic Focus - The core strategy of the company is to bring AI capabilities from the cloud to edge devices, which can reduce latency, enhance privacy, and save bandwidth, particularly for IoT applications requiring high reliability [3]. - The company aims to create a unified AI service system through the collaboration of edge AI capabilities and cloud-based large models, promoting product implementation across diverse application scenarios [3].