Workflow
Tianshui Huatian Technology (002185)
icon
Search documents
华天科技拟20亿元设立华天先进 开展2.5D/3D集成电路封装测试业务
Zhi Tong Cai Jing· 2025-08-01 09:37
Core Viewpoint - Huatian Technology (002185.SZ) plans to establish a wholly-owned subsidiary, Nanjing Huatian Advanced Packaging Co., Ltd., with a total registered capital of 2 billion yuan to enhance its investment in advanced packaging business, specifically in 2.5D/3D integrated circuit packaging and testing [1]. Group 1 - The new subsidiary will focus on 2.5D/3D integrated circuit packaging and testing [1]. - The establishment of Nanjing Huatian Advanced Packaging is part of the company's strategy to accelerate the development of advanced packaging business [1]. - The total registered capital for the new company is set at 2 billion yuan [1].
华天科技(002185.SZ):拟设立全资子公司华天先进
Ge Long Hui A P P· 2025-08-01 09:28
Group 1 - The core point of the article is that Huada Technology (002185.SZ) is establishing a new wholly-owned subsidiary, Nanjing Huada Advanced Packaging Co., Ltd., to enhance its competitiveness in the advanced packaging sector and meet future strategic development needs [1] - The total registered capital for the new subsidiary is set at 2 billion yuan, with Huada Jiangsu contributing 1 billion yuan (50%), Huada Kunshan contributing 665 million yuan (33.25%), and Advanced No. 1 contributing 335 million yuan (16.75%) [1]
华天科技(002185.SZ)拟20亿元设立华天先进 开展2.5D/3D集成电路封装测试业务
智通财经网· 2025-08-01 09:20
Core Viewpoint - Huatian Technology (002185.SZ) plans to establish a wholly-owned subsidiary, Nanjing Huatian Advanced Packaging Co., Ltd., with a total registered capital of 2 billion yuan to enhance its investment in advanced packaging business, specifically in 2.5D/3D integrated circuit packaging and testing [1]. Group 1 - The new subsidiary will focus on 2.5D/3D integrated circuit packaging and testing [1]. - The establishment of Nanjing Huatian Advanced Packaging is part of the company's strategy to accelerate the development of advanced packaging business [1]. - The total registered capital for the new company is set at 2 billion yuan [1].
华天科技:拟设立华天先进 加快推动先进封装业务发展
Core Viewpoint - Huatian Technology (002185) announced the establishment of Nanjing Huatian Advanced Packaging Co., Ltd. to enhance its competitiveness in the advanced packaging market for integrated circuits [1] Group 1: Company Strategy - The new company, Huatian Advanced, will focus on advanced packaging testing, specifically in 2.5D and 3D technologies [1] - The establishment of Huatian Advanced aims to increase investment in advanced packaging and testing, accelerating the development of this business segment [1] - The initiative is expected to expand the scale and market share of the advanced packaging industry, thereby strengthening the overall competitiveness of the company [1]
华天科技(002185) - 关于对外投资设立全资子公司的公告
2025-08-01 09:15
证券代码:002185 证券简称:华天科技 公告编号:2025-033 天水华天科技股份有限公司 关于对外投资设立全资子公司的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整, 没有虚假记载、误导性陈述或重大遗漏。 一、对外投资概述 为了进一步加强在先进封装领域的竞争能力,满足未来战略发展需要,天水 华天科技股份有限公司(以下简称"公司")拟由全资子公司华天科技(江苏) 有限公司(以下简称"华天江苏")、全资子公司华天科技(昆山)电子有限公 司(以下简称"华天昆山")及全资下属合伙企业华天先进壹号(南京)股权投 资合伙企业(有限合伙)(以下简称"先进壹号")共同出资,设立全资子公司 南京华天先进封装有限公司(暂定名,最终以登记机关核准的名称为准,以下简 称"华天先进")。拟新设公司注册资本总额 200,000 万元,其中华天江苏认缴 出资 100,000 万元,占比 50%,华天昆山认缴出资 66,500 万元,占比 33.25%, 先进壹号认缴出资 33,500 万元,占比 16.75%。 本次对外投资事项已经公司 2025 年 8 月 1 召开的第八届董事会第四次会议 审议通过。根据《公司章 ...
华天科技(002185) - 第八届董事会第四次会议决议公告
2025-08-01 09:15
证券代码:002185 证券简称:华天科技 公告编号:2025-032 天水华天科技股份有限公司 第八届董事会第四次会议决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整, 没有虚假记载、误导性陈述或重大遗漏。 同意全资子公司华天科技(江苏)有限公司、全资子公司华天科技(昆山) 电子有限公司及全资下属合伙企业华天先进壹号(南京)股权投资合伙企业(有 限合伙)共同出资设立南京华天先进封装有限公司(暂定名,最终以登记机关核 准的名称为准)。拟新设公司注册资本总额 200,000 万元,其中华天科技(江苏) 有限公司认缴出资 100,000 万元,占比 50%,华天科技(昆山)电子有限公司认 缴出资 66,500 万元,占比 33.25%,华天先进壹号(南京)股权投资合伙企业(有 限合伙)认缴出资 33,500 万元,占比 16.75%。 同意 9 票,反对 0 票,弃权 0 票。 《关于对外投资设立全资子公司的公告》具体内容详见巨潮资讯网 (http://www.cninfo.com.cn)和刊登于《证券时报》的 2025-033 号公告。 备查文件: 公司第八届董事会第四次会议决议 特此公告。 ...
华天科技:拟20亿元设立2.5D/3D集成电路封装测试公司 抢抓先进封装市场先机
news flash· 2025-08-01 09:09
Group 1 - The company plans to establish a wholly-owned subsidiary, Nanjing Huaten Advanced Packaging Co., Ltd., with a total registered capital of 2 billion yuan [1] - The investment will be contributed by Huaten Jiangsu (1 billion yuan, 50%), Huaten Kunshan (665 million yuan, 33.25%), and Advanced No. 1 (335 million yuan, 16.75%) [1] - The new company will focus on 2.5D/3D integrated circuit packaging and testing, aiming to seize opportunities in the advanced packaging market and enhance the company's competitive capabilities [1]
华天科技:拟设立全资子公司南京华天先进封装有限公司,注册资本总额20亿元
news flash· 2025-08-01 09:05
华天科技(002185)公告,公司拟由全资子公司华天科技(江苏)有限公司、华天科技(昆山)电子有限公 司及全资下属合伙企业华天先进壹号(南京)股权投资合伙企业共同出资,设立全资子公司南京华天先进 封装有限公司。拟新设公司注册资本总额20亿元,其中华天江苏认缴出资10亿元,占比50%,华天昆山 认缴出资6.65亿元,占比33.25%,先进壹号认缴出资3.35亿元,占比16.75%。该投资旨在加强在先进封 装领域的竞争能力,满足未来战略发展需要。 ...
华天科技(002185.SZ):没有CoWoP封装技术
Ge Long Hui· 2025-08-01 07:20
Group 1 - The company Huada Semiconductor (002185.SZ) has stated on its interactive platform that its eSinC 2.5D packaging technology platform includes SiCS, FoCS, and BiCS, which are comparable to CoWoS-related technologies [1] - The company does not possess CoWoP packaging technology [1]
华天科技:公司没有CoWoP封装技术
Mei Ri Jing Ji Xin Wen· 2025-08-01 05:29
Group 1 - The company has indicated that its eSinC 2.5D packaging technology platform includes SiCS, FoCS, and BiCS, which are comparable to CoWoS technology [2] - The company does not possess CoWoP packaging technology [2]