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兴森科技:公司FCBGA封装基板项目样品持续交付认证中
Zheng Quan Ri Bao· 2025-12-03 11:13
Group 1 - The core viewpoint of the article is that the company, Xingsen Technology, is actively progressing in the certification of its FCBGA packaging substrate project, with a steady increase in sample deliveries [2] - As of now, the feedback from the testing results of the FCBGA packaging substrates indicates that no abnormalities have been found in the substrates [2]
兴森科技:截至目前,FCBGA封装基板已反馈封测结果均为未发现基板异常
Mei Ri Jing Ji Xin Wen· 2025-12-03 10:48
Group 1 - The company, Xingsen Technology, is currently delivering samples for its FCBGA packaging substrate project, with a steady increase in quantity and no abnormalities reported in the feedback from testing results [1] - Specific customer information related to the project cannot be disclosed due to confidentiality agreements [1] Group 2 - An investor inquired about the growth in sample order quantities by December 1, 2028, compared to the first half of the year, and whether any delivered samples have been certified by specific companies [3]
兴森科技:截至11月28日公司股东总户数为十一万一千余户
Zheng Quan Ri Bao Wang· 2025-12-01 13:40
证券日报网讯12月1日,兴森科技(002436)在互动平台回答投资者提问时表示,截至2025年11月28 日,公司股东总户数为十一万一千余户。 ...
元件板块11月28日涨0.36%,兴森科技领涨,主力资金净流出4982.16万元
Market Overview - The component sector increased by 0.36% on November 28, with Xingsen Technology leading the gains [1] - The Shanghai Composite Index closed at 3888.6, up 0.34%, while the Shenzhen Component Index closed at 12984.08, up 0.85% [1] Top Gainers in the Component Sector - Xingsen Technology (002436) closed at 21.52, up 6.59% with a trading volume of 1.1887 million shares [1] - Gaohua Technology (688539) closed at 37.95, up 5.12% with a trading volume of 82,900 shares [1] - Fenghua Advanced Technology (000636) closed at 16.44, up 5.05% with a trading volume of 467,600 shares [1] - Shunluo Electronics (002138) closed at 36.33, up 4.34% with a trading volume of 125,120 shares [1] - Tianjin Yinlin (002134) closed at 22.52, up 4.11% with a trading volume of 76,500 shares [1] Top Losers in the Component Sector - Jin'an Guoji (002636) closed at 15.67, down 3.87% with a trading volume of 581,300 shares [2] - Zhongfu Circuit (300814) closed at 82.41, down 3.35% with a trading volume of 195,200 shares [2] - Zeceng Electronics (920821) closed at 26.57, down 2.71% with a trading volume of 46,300 shares [2] - Shenghong Technology (300476) closed at 270.70, down 2.33% with a trading volume of 275,800 shares [2] Capital Flow Analysis - The component sector experienced a net outflow of 49.82 million yuan from institutional investors, while retail investors saw a net inflow of 420 million yuan [2][3] - The main stocks with significant net inflows from retail investors include Xingsen Technology and Fenghua Advanced Technology [3] Individual Stock Capital Flow - Fangzheng Technology (600601) had a net inflow of 337.82 million yuan from institutional investors, while it faced a net outflow of 197 million yuan from speculative funds [3] - Xingsen Technology (002436) saw a net inflow of 12.8 million yuan from institutional investors, with a net outflow of 138 million yuan from speculative funds [3] - Jingwang Electronics (603228) had a net inflow of 111.1 million yuan from institutional investors, with a net inflow of 36.74 million yuan from speculative funds [3]
兴森科技股价涨5%,南方基金旗下1只基金位居十大流通股东,持有2461.12万股浮盈赚取2485.73万元
Xin Lang Cai Jing· 2025-11-28 02:31
Core Viewpoint - The stock of Xingsen Technology increased by 5% on November 28, reaching a price of 21.20 CNY per share, with a trading volume of 869 million CNY and a turnover rate of 2.77%, resulting in a total market capitalization of 36.033 billion CNY [1] Group 1: Company Overview - Xingsen Technology, established on March 18, 1999, and listed on June 18, 2010, is located in Shenzhen, Guangdong Province. The company primarily engages in PCB and semiconductor businesses [1] - The revenue composition of Xingsen Technology includes: 71.45% from PCB printed circuit boards, 21.09% from IC packaging substrates, 4.29% from other sources, and 3.17% from semiconductor testing boards [1] Group 2: Shareholder Information - Southern Fund's Southern CSI 500 ETF (510500) is among the top ten circulating shareholders of Xingsen Technology, having reduced its holdings by 435,600 shares in the third quarter, now holding 24.6112 million shares, which accounts for 1.63% of circulating shares [2] - The estimated floating profit from this position is approximately 24.8573 million CNY [2] Group 3: Fund Performance - The Southern CSI 500 ETF (510500) has a total asset size of 140.098 billion CNY, with a year-to-date return of 23.3%, ranking 1975 out of 4206 in its category, and a one-year return of 21.6%, ranking 1987 out of 4008 [2] - The fund manager, Luo Wenjie, has been in position for 12 years and 224 days, achieving a best fund return of 145.85% and a worst return of -47.6% during his tenure [3] Group 4: Additional Fund Holdings - The Southern CSI 500 Enhanced Strategy ETF (560100) also holds Xingsen Technology as a significant position, with 38,500 shares, representing 1.18% of the fund's net value [4] - The estimated floating profit from this position is about 38,900 CNY [4] Group 5: Enhanced Strategy ETF Performance - The Southern CSI 500 Enhanced Strategy ETF (560100) has a total asset size of 72.2298 million CNY, with a year-to-date return of 22.17%, ranking 2130 out of 4206, and a one-year return of 22.88%, ranking 1820 out of 4008 [4] - The fund manager, Cui Lei, has been in position for 7 years and 23 days, achieving a best fund return of 167.8% and a worst return of -15.93% during her tenure [5]
兴森科技:CSP封装基板业务和北京兴斐HDI板、类载板业务与原有重要客户的合作均正常推进
Zheng Quan Ri Bao· 2025-11-27 08:44
Group 1 - The core viewpoint of the article is that Xingsen Technology's CSP packaging substrate business and its collaboration with key clients in Beijing Xinfai HDI boards and similar carrier boards are progressing normally, despite confidentiality agreements preventing the disclosure of specific client information [2]
兴森科技:海外业务主要分布在韩国和欧洲 2025年上半年海外营收占比约48%
Mei Ri Jing Ji Xin Wen· 2025-11-27 04:54
兴森科技(002436.SZ)11月27日在投资者互动平台表示,公司部分业务正处于扩产阶段,存在人员招 聘需求。公司海外业务主要分布在韩国和欧洲,2025年上半年海外营收占比约48%。 (文章来源:每日经济新闻) 每经AI快讯,有投资者在投资者互动平台提问:1. 有人在吧里说目前公司上新产线正招聘新员工并培 训,是否有此事?2. 公司业务分为国内和海外,我不具体问海外公司名,您能告知海外在韩国、日本、 欧洲、美洲都有业务吗?3. 海外所涉及的地区,韩国、日本、欧洲、美洲这些区域业务体量的比重是多 少?4. 海外业务占公司整体业务比重多少? ...
兴森科技:公司经营情况请关注后续的定期报告
Zheng Quan Ri Bao· 2025-11-26 12:07
(文章来源:证券日报) 证券日报网讯兴森科技11月26日在互动平台回答投资者提问时表示,公司经营情况请关注后续的定期报 告。 ...
兴森科技涨2.04%,成交额8.02亿元,主力资金净流出7513.22万元
Xin Lang Zheng Quan· 2025-11-26 03:21
Core Viewpoint - The stock of Xingsen Technology has shown significant volatility, with a year-to-date increase of 85.11%, but recent trading indicates a slight decline in the short term [1][2]. Group 1: Stock Performance - As of November 26, Xingsen Technology's stock price reached 20.51 CNY per share, with a market capitalization of 34.86 billion CNY [1]. - The stock has experienced a net outflow of 75.13 million CNY in principal funds, with large orders accounting for 25.54% of purchases and 32.19% of sales [1]. - Over the past five trading days, the stock has decreased by 0.34%, and over the past 20 days, it has declined by 5.92% [1]. Group 2: Financial Performance - For the period from January to September 2025, Xingsen Technology reported a revenue of 5.373 billion CNY, representing a year-on-year growth of 23.48%, and a net profit attributable to shareholders of 131 million CNY, which is a significant increase of 516.08% [2]. - The company has distributed a total of 1.129 billion CNY in dividends since its A-share listing, with 270 million CNY distributed in the last three years [3]. Group 3: Shareholder Information - As of November 20, the number of shareholders for Xingsen Technology was 119,000, a decrease of 4.03% from the previous period, while the average circulating shares per person increased by 4.20% to 12,693 shares [2]. - Notable changes in the top ten circulating shareholders include an increase in holdings by Hong Kong Central Clearing Limited and new entries from Yongying Technology Smart Selection Mixed Fund A and other funds [3].
兴森科技:公司的CSP封装基板应用领域涵盖存储芯片等
Zheng Quan Ri Bao Wang· 2025-11-25 11:10
Core Viewpoint - The company, Xingsen Technology, is actively expanding its market presence and customer base in the CSP packaging substrate sector, which serves various chip applications [1] Group 1: Company Overview - Xingsen Technology's CSP packaging substrates are utilized in storage chips, application processor chips, sensor chips, and RF chips, indirectly supplying domestic mobile phone manufacturers [1] - The company's Beijing subsidiary, Xinfai, produces Anylayer HDI and similar substrates primarily for high-end smartphone mainboards and sub-boards [1] Group 2: Market Strategy - The company is committed to actively pursuing market expansion and aims to increase its market share and establish benchmark customers [1]