Core Viewpoint - The company emphasizes its capabilities in CoWoP packaging technology and products, which are primarily applied in high-speed server architectures [1] Group 1: Company Developments - The company actively focuses on the research and development of new products, technologies, and processes [1] - The company is keen to seize new opportunities arising from industry development trends [1]

Core Viewpoint - The company, Xingsen Technology, emphasizes its capabilities in CoWoP packaging technology and products, targeting high-speed server architecture as a primary application area [1] Group 1 - The company possesses technology and products related to CoWoP packaging [1] - The main application areas for the company's technology include high-speed server architecture [1] - The company places a high priority on the research and development of new products, technologies, and processes [1]

证券日报网讯1月13日，兴森科技（002436）在互动平台回答投资者提问时表示，截至2026年1月9日， 公司股东总户数为10.2万余户。 ...

Investment Rating - The report maintains a "Buy" rating for key companies in the domestic computing power industry, including Cambrian (688256) and SMIC (0981.HK) [7][12]. Core Insights - The report emphasizes the certainty of investment opportunities in the domestic computing power sector, driven by the upcoming release of the new generation of computing power chips, represented by H Company’s 950 series, which will enter mass production in the first quarter [5][6]. - The domestic computing power industry is expected to see significant growth, with ByteDance projected to invest 150 billion in global computing power procurement in 2026, of which 60-65 billion is expected to be allocated domestically, with over 40 billion for domestic computing power [6]. - The report suggests that the impact of the H200 release on the domestic computing power industry will be limited, as the primary application scenarios differ from those of domestic solutions [6]. Summary by Sections Supply Side - The domestic computing power sector has faced challenges due to U.S. restrictions on advanced semiconductor processes and key materials. However, breakthroughs are anticipated starting in the second half of 2025, with improved collaboration between chip design companies and foundries expected to enhance production yields by 2026 [5][6]. - The report highlights the optimization of the supply chain and the collaboration between hardware and software, which has significantly improved the usability of domestic computing power in AI inference scenarios [5]. Demand Side - The demand for computing power in 2026 is becoming clearer, with major internet companies like Alibaba and Tencent also planning significant investments in domestic computing power [6]. - The report notes that the three major telecom operators are expected to increase their procurement of domestic computing power to meet the growing demand from AI applications [6]. Key Companies to Watch - The report recommends focusing on Cambrian (688256) as a representative of domestic computing power card suppliers and SMIC (0981.HK) as a leading foundry. Additionally, attention is drawn to Huahong Semiconductor (1347.HK) for its advancements in advanced processes [7]. - The report also suggests monitoring companies related to domestic IC substrates due to supply bottlenecks caused by shortages of upstream materials, recommending companies like Shenzhen South Circuit (002916) and Pengding Holdings (002938) [7]. Overseas Computing Power Industry - The report observes a shift in the driving force of AI computing power from training large models to deploying inference applications, with companies like Google leading advancements in model capabilities [8][9]. - The report anticipates continued high growth in AI application-driven computing power demand, with major companies expected to double their computing power every six months over the next few years [10].

1、本次股份质押基本情况 证券代码：002436 证券简称：兴森科技 公告编号：2026-01-001 深圳市兴森快捷电路科技股份有限公司 关于控股股东部分股份质押及解除质押的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚 假记载、误导性陈述或重大遗漏。 深圳市兴森快捷电路科技股份有限公司（以下简称"公司"）于近日接到控股股东、实际控 制人邱醒亚先生的通知，获悉其将所持有的部分公司股份办理了质押及解除质押手续。具体事项 如下： 一、股东股份质押及解除质押基本情况 | | 是否为控股 股东或第一 | 本次质押股份 | 占其所持 | 占公司 | 是否 | 是否 为补 | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 股东 | | | | 总股本 | 为限 | | 质押开始日期 | 质押到期日 | 质权人 | 用途 | | 名称 | 大股东及其 | 数量（股） | 股份比例 | 比例 | 售股 | 充质 | | | | | | | 一致行动人 | | | | | 押 | | | | ...

Group 1 - The core viewpoint of the news is that Xingsen Technology has shown significant stock performance and financial growth, with a notable increase in revenue and net profit year-on-year [1][2]. - As of January 8, Xingsen Technology's stock price increased by 7.56% year-to-date, with a 21.38% rise over the past 60 days, indicating strong market interest [1]. - The company reported a revenue of 5.373 billion yuan for the period from January to September 2025, representing a year-on-year growth of 23.48% [2]. Group 2 - Xingsen Technology's main business segments include PCB business (71.45% of revenue), IC packaging substrates (21.09%), and semiconductor testing boards (3.17%) [1]. - The company has distributed a total of 1.129 billion yuan in dividends since its A-share listing, with 270 million yuan distributed over the past three years [3]. - As of September 30, 2025, the top ten circulating shareholders include Hong Kong Central Clearing Limited and new entrants such as Yongan Technology Smart Selection Mixed Fund A [3].

Core Viewpoint - The company is progressing steadily in the market expansion and customer certification of its FCBGA packaging substrate project, and the operational situation will be detailed in future regular reports [2][4]. Group 1 - Investors inquired about whether the certification and introduction speed of key customers for the ABF substrate is below expectations [2][4]. - There are concerns regarding whether the idle high-end capacity will impact this year's financial report [2][4].

Market Overview - On December 29, the Shanghai Composite Index rose by 0.04%, while the CSI 300 fell by 0.38%. The STAR 50 increased by 0.04%, the CSI 1000 decreased by 0.15%, the ChiNext Index dropped by 0.66%, and the Hang Seng Index declined by 0.71% [4][5]. - The best-performing industries on December 29 were Oil & Petrochemicals (+1.48%), Defense & Military (+1.43%), Banking (+1.03%), Agriculture, Forestry, Animal Husbandry & Fishery (+0.71%), and Automotive (+0.41%). The worst-performing industries included Nonferrous Metals (-1.95%), Utilities (-1.24%), Electric Equipment (-1.13%), Building Materials (-1.11%), and Food & Beverage (-1.06%) [4][5]. - The total trading volume for the entire A-share market on December 29 was 21,577 billion yuan, with net outflow of southbound funds amounting to 3.414 billion HKD [4][5]. Key Recommendations - The report focuses on the company Xingsen Technology (002436), highlighting its comprehensive PCB product system and meticulous process capabilities [6]. - The driving factors for the company include the upgrade of PCB processes driven by AI, leading to an expanding market space. Projected revenues for 2025-2027 are 7,150.01 million yuan, 8,920.01 million yuan, and 11,250.01 million yuan, with growth rates of 22.91%, 24.76%, and 26.12% respectively. Net profits are expected to be 154.57 million yuan, 435.16 million yuan, and 830.26 million yuan, with growth rates of -181.52%, 90.79%, and 90.79% respectively [6][8]. - The catalysts for growth include the AI-driven upgrade of PCB processes [6]. Industry Insights - The pharmaceutical industry is expected to see innovation breakthroughs and favorable policy changes leading to a turning point in the sector's fundamentals. The report notes that the market lacks further catalysts for the pharmaceutical sector [7][9]. - The report emphasizes the potential for continued innovation in drugs and medical devices, driven by improved payment and access policies for innovative drugs and traditional Chinese medicine [9]. - The beauty and personal care industry is characterized by intense competition and increasing differentiation. The report suggests that structural opportunities should be seized, particularly for emerging brands and products [10].

Group 1 - The core point of the article highlights that on December 29, 2025, Xingsen Technology executed a block trade of 187,000 shares, amounting to 3.697 million yuan, which represented 0.14% of the total trading volume for that day [1][2] - The transaction price was 19.77 yuan per share, reflecting a discount of 9.81% compared to the market closing price of 21.92 yuan [1][2] - The buyer of the shares was China International Capital Corporation Wealth Securities, while the seller was Guosen Securities Co., Ltd. Hangzhou Teaching Staff Road Branch [2]

| 代码 | 名称 | 收盘价 | 涨跌幅 | 成交量(手) | 成交额(元) | | --- | --- | --- | --- | --- | --- | | 603228 | 景旺电子 | 73.57 | -4.27% | 32.76万 | 24.21亿 | | 600237 | 铜峰电子 | 9.20 | -3.97% | 70.80万 | 6.59亿 | | 002134 | 天津音林 | 25.59 | -3.43% | 19.19万 | 4.96 Z | | 688655 | 迅捷兴 | 17.49 | -3.42% | 2.37万 | 4197.00万 | | 300476 | 胜宏科技 | 291.99 | -2.51% | 30.01万 | 87.97亿 | | 688539 | 高华科技 | 50.85 | -2.02% | 12.65万 | 6.44亿 | | 002579 | 中京电子 | 11.79 | -1.91% | 33.74万 | 266.6 | | 603386 | 骏亚科技 | 15.11 | -1.88% | 22.52万 | 3.43亿 | | 301041 | 等 ...