证券日报网讯12月15日，兴森科技（002436）在互动平台回答投资者提问时表示，截至2025年12月10 日，公司股东总户数为十一万一千余户。 ...

Group 1 - The core viewpoint of the article is that the company, Xingsen Technology, is focusing on digital transformation and high-end packaging substrate strategies, particularly in the FCBGA packaging substrate market [1] - The company identifies chip design firms and packaging manufacturers as target customers for its packaging substrate business, although specific customer collaborations cannot be disclosed due to confidentiality agreements [1] - The company is accelerating the market expansion of its FCBGA packaging substrate project to enhance its core competitiveness [1]

证券日报网讯12月15日，兴森科技（002436）在互动平台回答投资者提问时表示，公司海外业务主要分 布在韩国和欧洲，目前美国业务收入占比较小。 ...

证券日报网讯12月15日，兴森科技（002436）在互动平台回答投资者提问时表示，公司不涉及封装业 务，CPO封装主要是用MSAP工艺，公司的产品可用于CPO产品的封装。 ...

格隆汇12月15日丨兴森科技(002436.SZ)在投资者互动平台表示，公司不涉及封装业务，CPO封装主要 是用MSAP工艺，公司的产品可用于CPO产品的封装。 ...

格隆汇12月15日丨兴森科技(002436.SZ)在投资者互动平台表示，公司海外业务主要分布在韩国和欧 洲，目前美国业务收入占比较小。 ...

Group 1 - The core viewpoint of the article is that Xingsen Technology (002436.SZ) has expanded its production capacity for BT substrates to 50,000 square meters per month, up from the previous capacity of 35,000 square meters per month, which is now fully utilized [1] - The company is currently in the ramp-up phase for the newly expanded capacity of 15,000 square meters per month [1] - ABF substrates are currently in small-batch production [1]

Group 1 - The company primarily produces BT substrates, with an overall production capacity of 50,000 square meters per month, up from the previous capacity of 35,000 square meters per month, which is now fully utilized [1] - The company is currently in the ramp-up phase for an additional capacity of 15,000 square meters per month for BT substrates [1] - ABF substrates are currently in small batch production [1]

Core Insights - The company, Xingsen Technology, has confirmed that its IC packaging substrates are essential raw materials for chip packaging, utilized in various applications including CPU, GPU, FPGA, ASIC, storage chips, and RF chips [2] Group 1 - The IC packaging substrates are specifically designed for chip packaging applications [2] - The specific application scenarios for chip products are determined by customers based on their individual needs [2]

Group 1 - The core material for FCBGA packaging substrate is ABF film, as stated by the company on the investor interaction platform [1]