Group 1 - The core viewpoint of the article is that Xingsen Technology's CSP packaging substrate business and its collaboration with key clients in Beijing Xinfai HDI boards and similar carrier boards are progressing normally, despite confidentiality agreements preventing the disclosure of specific client information [2]

兴森科技（002436.SZ）11月27日在投资者互动平台表示，公司部分业务正处于扩产阶段，存在人员招 聘需求。公司海外业务主要分布在韩国和欧洲，2025年上半年海外营收占比约48%。 （文章来源：每日经济新闻） 每经AI快讯，有投资者在投资者互动平台提问：1. 有人在吧里说目前公司上新产线正招聘新员工并培 训，是否有此事？2. 公司业务分为国内和海外，我不具体问海外公司名，您能告知海外在韩国、日本、 欧洲、美洲都有业务吗？3. 海外所涉及的地区，韩国、日本、欧洲、美洲这些区域业务体量的比重是多 少？4. 海外业务占公司整体业务比重多少？ ...

（文章来源：证券日报） 证券日报网讯兴森科技11月26日在互动平台回答投资者提问时表示，公司经营情况请关注后续的定期报 告。 ...

Core Viewpoint - The stock of Xingsen Technology has shown significant volatility, with a year-to-date increase of 85.11%, but recent trading indicates a slight decline in the short term [1][2]. Group 1: Stock Performance - As of November 26, Xingsen Technology's stock price reached 20.51 CNY per share, with a market capitalization of 34.86 billion CNY [1]. - The stock has experienced a net outflow of 75.13 million CNY in principal funds, with large orders accounting for 25.54% of purchases and 32.19% of sales [1]. - Over the past five trading days, the stock has decreased by 0.34%, and over the past 20 days, it has declined by 5.92% [1]. Group 2: Financial Performance - For the period from January to September 2025, Xingsen Technology reported a revenue of 5.373 billion CNY, representing a year-on-year growth of 23.48%, and a net profit attributable to shareholders of 131 million CNY, which is a significant increase of 516.08% [2]. - The company has distributed a total of 1.129 billion CNY in dividends since its A-share listing, with 270 million CNY distributed in the last three years [3]. Group 3: Shareholder Information - As of November 20, the number of shareholders for Xingsen Technology was 119,000, a decrease of 4.03% from the previous period, while the average circulating shares per person increased by 4.20% to 12,693 shares [2]. - Notable changes in the top ten circulating shareholders include an increase in holdings by Hong Kong Central Clearing Limited and new entries from Yongying Technology Smart Selection Mixed Fund A and other funds [3].

Core Viewpoint - The company, Xingsen Technology, is actively expanding its market presence and customer base in the CSP packaging substrate sector, which serves various chip applications [1] Group 1: Company Overview - Xingsen Technology's CSP packaging substrates are utilized in storage chips, application processor chips, sensor chips, and RF chips, indirectly supplying domestic mobile phone manufacturers [1] - The company's Beijing subsidiary, Xinfai, produces Anylayer HDI and similar substrates primarily for high-end smartphone mainboards and sub-boards [1] Group 2: Market Strategy - The company is committed to actively pursuing market expansion and aims to increase its market share and establish benchmark customers [1]

（文章来源：证券日报） 证券日报网讯兴森科技11月25日在互动平台回答投资者提问时表示，公司将专注于自身能力提升，加强 市场拓展，争取实现业务突破、规模增长和盈利提升，努力回馈股东的支持和信任。 ...

Core Viewpoint - The company, Xingsen Technology, specializes in IC packaging substrates, which are essential raw materials for chip packaging, targeting chip design companies and packaging manufacturers as its primary customers [1] Group 1 - The company confirmed on November 24 that its IC packaging substrates serve as raw materials for chip packaging [1] - The specific clients and business cooperation details are not disclosed due to confidentiality agreements [1]

Group 1 - The company, Xingsen Technology, confirmed that cooperation with major clients is progressing normally [2] - The expansion of production capacity is expected to enhance the scale of CSP packaging substrate business [2]

（文章来源：证券日报） 证券日报网讯兴森科技11月24日在互动平台回答投资者提问时表示，截至2025年11月20日，公司股东总 户数为十一万九千余户。 ...

Core Viewpoint - The company, Xingsen Technology, has indicated that its CSP packaging substrate customer base includes major Korean and domestic memory chip clients, with product pricing and gross margins being dependent on specific product structure, size, and processes, making it difficult to generalize [1] Group 1 - The customer base for Xingsen Technology's CSP packaging substrates includes both Korean and domestic major memory chip clients [1] - Product pricing and gross margins are influenced by specific factors such as product structure, size, and manufacturing processes [1] - The company emphasizes that it is not feasible to generalize pricing and gross margin information across all products [1]